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STMicroelectronics STP33N60M2

Part No.:
STP33N60M2
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixSTP33N60M2.pdf
Description:
MOSFET N-CH 600V 26A TO220
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:596

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Product details

Overview

STP33N60M2 from STMicroelectronics is an N-channel 600 V, 108 mΩ typ., 26 A Power MOSFET using MDmesh M2 technology in TO-220 package. It delivers low gate charge (45.5 nC), optimized Coss profile (85 pF), and 100% avalanche-tested ruggedness for high-efficiency switching in hard-switched and resonant topologies. Used in industrial AC-DC front-ends and LLC converters operating at 100–300 kHz.

For engineers reviewing the STP33N60M2 datasheet, STP33N60M2 pinout, STP33N60M2 application, or STP33N60M2 equivalent, key selection criteria include RDS(on) stability over temperature, dv/dt ruggedness (50 V/ns), unclamped inductive switching capability, and thermal resistance (RthJC = 3.6 °C/W in TO-220FP variant).

Technical Context

This MOSFET employs ST's MDmesh M2 strip layout and enhanced vertical structure to simultaneously reduce conduction loss and improve switching efficiency. Its Zener-protected gate enables robust ESD immunity (±25 V VGS rating), while the integrated body diode features low Qrr (5.6 µC) and fast trr (375 ns) at 26 A.

The device operates with a gate threshold voltage of 2–4 V and exhibits stable RDS(on) up to 150 °C junction temperature. Its safe operating area (SOA) is defined by both thermal limits and peak current constraints, supporting single-pulse avalanche energy of 450 mJ at TJ = 25 °C.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 600 V - Withstands DC bus voltages up to 400 V in 3-phase rectified systems with margin.
RDS(on) typ. 108 mΩ at VGS = 10 V, ID = 13 A - Enables <1.4 W conduction loss at 13 A continuous drain current.
Qg 45.5 nC - Reduces gate drive power and enables efficient operation with standard 1–2 W gate drivers.
Coss 85 pF - Low output capacitance minimizes turn-off energy loss in high-frequency hard-switching.
EAS 450 mJ - Supports reliable unclamped inductive switching in PFC and flyback designs without external snubbers.
dv/dt ruggedness 50 V/ns - Ensures noise-immune operation in high-dV/dt environments like motor drives and inverters.
TJ max 150 °C - Allows sustained operation in enclosed industrial enclosures with limited airflow.

Pinout & Package

STP33N60M2 is supplied in TO-220 package with isolated tab (Type A). The metal tab is electrically connected to the drain terminal and serves as primary heat dissipation path. Mounting requires insulating washer or thermal pad when heatsink is grounded.

Pin/Terminal Circuit Role Design Meaning
1 (Left) Gate (G) Control input; accepts 10 V logic-level drive; gate charge 45.5 nC defines driver sizing requirement.
2 (Center) Drain (D) Main high-side power terminal; connected to TO-220 tab; must be insulated from heatsink if floating.
3 (Right) Source (S) Power return and reference node; ties to ground or low-side switch source; carries full load current.

Key Features

Feature Design Value
MDmesh M2 technology Enables 108 mΩ RDS(on) at 600 V - 25% lower on-resistance than prior-generation 600 V MOSFETs in same package.
Zener-protected gate Withstands ±25 V gate-source transients - eliminates need for external gate clamping in noisy industrial environments.
Low Coss / Coss eq. 85 pF / 135 pF - Reduces turn-off switching loss by >30% vs comparable devices in 100 kHz LLC resonant converters.
100% avalanche tested Rated for 5 A repetitive avalanche current - ensures reliability in overvoltage fault conditions without derating.
Optimized body diode Qrr = 5.6 µC, trr = 375 ns - Minimizes reverse recovery loss and EMI in bridge-leg configurations.

Applications

Industrial AC-DC Front-End LLC Resonant Converter

Use Scenario: 3.3 kW telecom rectifier with active PFC stage operating at 65 kHz.

IC Role / Device Role / Timing Role: High-side switching element in boost PFC circuit; handles 26 A RMS input current.

Use Value: Low RDS(on) and high dv/dt ruggedness enable >96% efficiency and elimination of gate snubbers.

Use Scenario: 1.2 kW server PSU using half-bridge LLC topology with 250 kHz resonant frequency.

IC Role / Device Role / Timing Role: Primary-side synchronous rectifier switch; commutates at zero-voltage switching (ZVS) boundary.

Use Value: Low Coss and fast body diode allow reliable ZVS down to light loads, reducing switching losses by 22%.

Solar Microinverter DC-AC Stage Motor Drive Half-Bridge

Use Scenario: 300 W microinverter with transformerless H5 topology feeding 230 VAC grid.

IC Role / Device Role / Timing Role: High-side leg switch in H5 bridge; blocks 600 V DC link during dead-time intervals.

Use Value: 100% avalanche rating ensures survival during grid-voltage surges and inductive kickback events.

Use Scenario: 750 W BLDC motor drive for HVAC compressors with 20 kHz PWM modulation.

IC Role / Device Role / Timing Role: Low-side switch in three-phase inverter half-bridge; conducts 26 A peak phase current.

Use Value: Stable RDS(on) over −40 to 150 °C enables consistent torque control without thermal derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STW33N60M2 Same die, TO-247 package; RthJC = 0.66 °C/W vs 3.6 °C/W (TO-220FP); higher ID(100°C) = 16 A. Better thermal performance for >50 W continuous dissipation; requires larger PCB footprint and heatsink interface. Select when board space allows TO-247 and thermal budget exceeds 25 W.
IPP60R190C7 650 V, 190 mΩ, 21 A; CoolMOS C7; Qg = 37 nC; lower Coss (65 pF) but no avalanche rating. Lower switching loss at >200 kHz, but requires external avalanche protection in PFC stages. Select for ultra-high-frequency SMPS where avalanche robustness is managed at system level.

Compared with STW33N60M2, STP33N60M2 trades thermal performance for compact TO-220 mounting and lower cost; versus IPP60R190C7, it offers guaranteed avalanche survivability at the expense of slightly higher conduction loss and gate charge.

Availability

STP33N60M2 is available at Aetrix Electronics and suitable for industrial AC-DC front-ends, LLC resonant converters, and solar microinverters requiring stable component supply across multi-year production cycles.

Supply support for STP33N60M2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, MCU, power, and sensor solutions for industrial, automotive, and consumer markets.

STP33N60M2 belongs to the MDmesh M2 high-voltage Power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching in industrial power supplies and renewable energy systems.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The maximum continuous drain current ID at TC = 100 °C is 16 A, as specified in Table 1 of DS9497. This rating reflects thermal limitation-not SOA-so operation above this current requires forced cooling or pulse-width derating per the SOA curves in Figures 1–5.

Does STP33N60M2 have a built-in body diode, and what are its key recovery parameters?

Yes, it integrates a fast, Zener-protected body diode with ISD = 26 A continuous, trr = 375 ns (TJ = 25 °C), Qrr = 5.6 µC, and IRRM = 30 A. These values are measured under standardized inductive-load conditions (ISD = 26 A, di/dt = 100 A/µs, VDD = 60 V), enabling accurate loss modeling in bridge circuits.

Can STP33N60M2 be used in avalanche mode, and what is its rated single-pulse energy?

Yes, STP33N60M2 is 100% avalanche tested and rated for single-pulse avalanche energy EAS = 450 mJ at TJ = 25 °C (ID = 5 A, VDD = 50 V). Repetitive avalanche is limited to IAR = 5 A, with pulse width constrained by junction temperature rise-refer to Figure 17 for EAS vs. TJ derating.

Is the TO-220 package tab electrically isolated, and how should it be mounted?

The TO-220 tab is electrically connected to the drain (pin 2) and is not isolated. When mounting to a grounded heatsink, use an insulating thermal pad (e.g., Sil-Pad 1500) or mica washer with silicone grease. Mechanical flatness tolerance is ±0.10 mm (per Table 10), requiring torque-controlled screw mounting at 0.5–0.6 N·m.

STP33N60M2 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
MDmesh™ II Plus
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
26A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
125mOhm @ 13A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
45.5 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
1781 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
190W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220

STP33N60M2 FAQ

1.How can I place an order for STP33N60M2 through Aetrix?

Please submit a Request for Quotation (RFQ) for STP33N60M2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STP33N60M2 reliable?

The price and inventory of STP33N60M2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STP33N60M2 is usually 5 days.

3.What payment methods are accepted for STP33N60M2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STP33N60M2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STP33N60M2?

STP33N60M2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STP33N60M2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STP33N60M2?

For technical support, including STP33N60M2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STP33N60M2 requirements.

6.How does Aetrix verify that STP33N60M2 is sourced from the original manufacturer or authorized distributors?

All STP33N60M2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STP33N60M2 meets industry standards.

7.What is the process for return or replacement of STP33N60M2?

All STP33N60M2 units undergo pre-shipment inspection (PSI). If there is an issue with STP33N60M2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STP33N60M2 part is unused and in its original packaging.

Return procedure for STP33N60M2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STP33N60M2 Tags

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