STMicroelectronics STP33N65M2
- Part No.:
- STP33N65M2
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
STP33N65M2.pdf
- Description:
- MOSFET N-CH 650V 24A TO220
- Quantity:
- Payment:

- Shipping:

Inventory:486
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STP33N65M2 from STMicroelectronics is an N-channel 650 V, 117 mΩ typ. (140 mΩ max), 24 A MDmesh™ M2 Power MOSFET optimized for high-efficiency hard-switching and resonant converters. It features extremely low gate charge (41.5 nC), excellent Coss profile (75 pF), 100% avalanche tested operation, and Zener-protected gate. Used in PFC stages of industrial SMPS and telecom rectifiers where high-voltage blocking and fast switching coexist.
For engineers reviewing the STP33N65M2 datasheet, STP33N65M2 pinout, STP33N65M2 application, or STP33N65M2 equivalent, this device supports critical design decisions in high-voltage AC-DC conversion, flyback and LLC resonant topologies, and energy-efficient server power supplies requiring rugged 650 V operation with low conduction and switching losses.
Technical Context
This MOSFET employs ST's MDmesh M2 strip layout and enhanced vertical structure to achieve low RDS(on) while maintaining high dv/dt ruggedness (50 V/ns) and robust unclamped inductive switching capability. Its Coss eq. of 380 pF enables predictable turn-off energy management in high-frequency converters.
The device integrates a fast, soft-recovery body diode (trr = 426 ns at 25 °C, Qrr = 7 µC) and operates up to 150 °C junction temperature. Gate threshold voltage (2–4 V) ensures stable enhancement-mode control across temperature, and ±25 V VGS rating supports robust gate drive design.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 650 V - Enables direct use in 400 V AC mains-fed PFC and offline SMPS without series stacking. |
| RDS(on) max | 140 mΩ at VGS = 10 V, ID = 12 A - Limits conduction loss to ≤3.3 W at 24 A continuous drain current (TC = 25 °C). |
| Qg | 41.5 nC - Reduces gate drive power and enables efficient operation at 100–300 kHz switching frequencies. |
| Coss | 75 pF - Low output capacitance minimizes turn-off loss and improves zero-voltage switching (ZVS) margin in resonant designs. |
| EAS | 780 mJ - Confirmed single-pulse avalanche energy supports reliable operation under transient overvoltage conditions. |
| tr/tf | 11.5 ns / 9 ns - Fast switching transitions reduce overlap loss and improve efficiency in hard-switched topologies. |
| VSD | 1.6 V at ISD = 24 A - Low body diode forward voltage reduces reverse recovery loss during synchronous rectification or freewheeling. |
Pinout & Package
STP33N65M2 is offered in TO-220FP package (plastic, full-pack, isolated tab). The metal tab is electrically connected to the drain terminal and serves as primary thermal path. Mounting requires insulating hardware unless drain is referenced to heatsink potential.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control electrode; accepts 10 V logic-level drive; 5 Ω intrinsic gate resistance limits ringing risk. |
| 2 (D / Tab) | Drain / Heat Sink Interface | Main high-side power node; electrically tied to exposed metal tab; requires isolation when heatsink is grounded. |
| 3 (S) | Source | Power return and reference node for gate drive; connects to PCB ground plane or source rail with low-inductance layout. |
Key Features
| Feature | Design Value |
|---|---|
| MDmesh M2 technology | Enables 650 V rating with 117 mΩ typ. RDS(on), achieving superior figure-of-merit (RDS(on) × Qg) vs. prior-generation superjunction MOSFETs. |
| Extremely low gate charge | 41.5 nC total gate charge reduces driver IC stress and gate drive loss-critical for high-frequency PFC controllers. |
| Zener-protected gate | Integrated gate oxide protection withstands ±25 V VGS transients, eliminating need for external gate clamps in most applications. |
| 100% avalanche tested | Every unit validated for 2.5 A repetitive avalanche current and 780 mJ single-pulse energy-ensures field reliability under fault conditions. |
| Optimized Coss profile | 75 pF Coss and 380 pF Coss,eq support predictable turn-off timing and reduced capacitive loss in ZVS LLC converters. |
Applications
| Industrial AC-DC Power Supplies | Telecom Rectifier Modules |
|---|---|
|
Use Scenario: Front-end PFC boost stage in 1–3 kW industrial switch-mode power supplies operating from 3-phase 400 V AC input. IC Role / Device Role / Timing Role: Main switching element in continuous conduction mode (CCM) boost converter; switches at 65–100 kHz with hard-switched gate drive. Use Value: 117 mΩ RDS(on) and 41.5 nC Qg jointly enable >96% PFC efficiency at full load while maintaining thermal margin on standard heatsinks. |
Use Scenario: Primary-side switch in 2 kW telecom rectifier modules compliant with NEBS Level 3 and ETSI standards. IC Role / Device Role / Timing Role: High-voltage switch in phase-shifted full-bridge topology; handles 650 V DC bus with 150 kHz ZVS operation. Use Value: 50 V/ns dv/dt ruggedness and 780 mJ EAS ensure immunity to voltage spikes during transformer leakage inductance recovery. |
| Server PSU Main Switch | EV Charger Auxiliary Power |
|
Use Scenario: Primary switch in 3.3 kW server power supply using asymmetric half-bridge (AHB) topology with 400 V DC input. IC Role / Device Role / Timing Role: High-side switch conducting 24 A RMS; driven by dedicated gate driver with 10 V supply and 4.7 Ω series resistor. Use Value: 9 ns fall time and 13.5 ns turn-off delay minimize dead-time loss and improve light-load efficiency without compromising EMI. |
Use Scenario: Isolated auxiliary power supply (12 V/3 A) inside liquid-cooled EV DC fast-charging cabinet. IC Role / Device Role / Timing Role: Active clamp flyback switch handling 650 V reflected voltage and 200 kHz switching with reinforced insulation requirements. Use Value: TO-220FP package provides 2.5 kV RMS isolation between leads and heatsink-meets IEC 62368-1 creepage/clearance for functional insulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW33N65M2 | Same die, TO-247 package; RthJC = 0.45 °C/W vs. 3.68 °C/W for TO-220FP; higher ID (33 A) but same VDS/RDS(on). | Used where higher power density and forced-air cooling allow larger package; unsuitable for space-constrained TO-220FP footprints. | Select when thermal budget demands <1.5 °C/W junction-to-case resistance and board area permits TO-247 mounting. |
| IPP65R190CFD7 | Infineon CoolMOS™ CFD7; 650 V, 190 mΩ, 21 A; lower Qg (34 nC) but higher RDS(on); integrated fast diode (trr = 120 ns). | Better suited for ZVS-heavy topologies like LLC due to faster diode; less optimal for hard-switched PFC where RDS(on) dominates loss. | Prefer when diode recovery performance is prioritized over conduction loss, e.g., in resonant converters with high circulating current. |
Compared with STW33N65M2, STP33N65M2 trades thermal performance for compact footprint and cost; versus IPP65R190CFD7, it delivers lower conduction loss at the expense of diode speed-making it ideal for high-current, medium-frequency PFC rather than ultra-high-frequency ZVS designs.
Availability
STP33N65M2 is available at Aetrix Electronics and suitable for industrial AC-DC power supplies, telecom rectifier modules, and EV charger auxiliary power systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for STP33N65M2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
STP33N65M2 belongs to the MDmesh™ M2 high-voltage power MOSFET product line, engineered specifically for high-efficiency, high-power-density AC-DC conversion in industrial and telecom infrastructure where 650 V blocking and low switching loss are essential.
FAQ
What is the maximum continuous drain current for STP33N65M2 at 100 °C case temperature?
The maximum continuous drain current (ID) is 15 A at TC = 100 °C, as specified in Table 1 of DS10776 Rev 2. This derating from 24 A (at 25 °C) reflects thermal limitations of the TO-220FP package, which has RthJC = 3.68 °C/W. Designers must verify heatsink interface resistance and ambient airflow to maintain safe junction temperature below 150 °C.
Does STP33N65M2 have an integrated body diode, and what are its key recovery parameters?
Yes, STP33N65M2 includes a monolithic source-drain body diode. At TJ = 25 °C, its reverse recovery time (trr) is 426 ns, reverse recovery charge (Qrr) is 7 µC, and peak reverse recovery current (IRRM) is 33.5 A, measured under ISD = 24 A, di/dt = 100 A/µs, and VDD = 60 V. These values increase at elevated temperature (e.g., trr = 544 ns at 150 °C).
Can STP33N65M2 be used in avalanche mode, and what is its rated avalanche energy?
Yes-STP33N65M2 is 100% avalanche tested per datasheet. Its single-pulse avalanche energy (EAS) is 780 mJ at starting TJ = 25 °C, with IAR = 2.5 A and VDD = 50 V. Repetitive avalanche current is also rated at 2.5 A, but pulse width is limited by SOA constraints. Operation beyond these limits risks permanent degradation.
What is the gate threshold voltage range, and how does it vary with temperature?
VGS(th) is specified from 2 V to 4 V at TC = 25 °C (Table 4). As shown in Figure 11, it decreases with rising junction temperature-normalized to ~0.7× at TJ = 125 °C-ensuring stable turn-on behavior across the full –55 °C to 150 °C operating range without unintended conduction drift.
STP33N65M2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ M2
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- 24A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 140mOhm @ 12A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 41.5 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1790 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 190W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220
STP33N65M2 FAQ
1.How can I place an order for STP33N65M2 through Aetrix?
Please submit a Request for Quotation (RFQ) for STP33N65M2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STP33N65M2 reliable?
The price and inventory of STP33N65M2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STP33N65M2 is usually 5 days.
3.What payment methods are accepted for STP33N65M2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STP33N65M2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STP33N65M2?
STP33N65M2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STP33N65M2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STP33N65M2?
For technical support, including STP33N65M2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STP33N65M2 requirements.
6.How does Aetrix verify that STP33N65M2 is sourced from the original manufacturer or authorized distributors?
All STP33N65M2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STP33N65M2 meets industry standards.
7.What is the process for return or replacement of STP33N65M2?
All STP33N65M2 units undergo pre-shipment inspection (PSI). If there is an issue with STP33N65M2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STP33N65M2 part is unused and in its original packaging.
Return procedure for STP33N65M2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STP33N65M2 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
