STMicroelectronics STP35N60DM2
- Part No.:
- STP35N60DM2
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
STP35N60DM2.pdf
- Description:
- MOSFET N-CH 600V 28A TO220
- Quantity:
- Payment:

- Shipping:

Inventory:988
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STP35N60DM2 from STMicroelectronics is a high-voltage N-channel Power MOSFET in TO-220 package, featuring 600 V VDS, 0.094 Ω typ. RDS(on), 28 A continuous drain current, fast-recovery body diode (trr = 120 ns), and Zener-protected gate. It is engineered for high-efficiency bridge topologies and ZVS phase-shift converters.
For engineers reviewing the STP35N60DM2 datasheet, STP35N60DM2 pinout, STP35N60DM2 application, or STP35N60DM2 equivalent, key selection criteria include avalanche ruggedness (EAS = 650 mJ), dv/dt immunity (50 V/ns), low Qg (54 nC), and integrated back-to-back gate Zener protection.
Technical Context
This MDmesh™ DM2 device combines ultra-low Qrr (572 nC) and trr with minimized Coss (110 pF) and Crss (2.8 pF), enabling efficient hard-switching and soft-switching operation. Its 0.6 °C/W Rthj-case supports high-power thermal management in compact designs.
The built-in gate-source Zener diodes (±30 V breakdown) provide ESD robustness without external clamping, while the 100% avalanche-tested construction ensures reliability under unclamped inductive switching stress.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - supports primary-side switching in 400 V AC-input PFC and resonant LLC converters |
| RDS(on) max | 0.110 Ω - limits conduction loss to ≤34 W at 28 A, enabling high-efficiency 200–500 W SMPS |
| Qg | 54 nC - reduces gate drive power and enables use with low-current drivers (e.g., 1 A peak) |
| trr | 120 ns @ Tj = 25 °C - minimizes diode recovery loss in synchronous rectification and half-bridge freewheeling |
| EAS | 650 mJ - withstands single-pulse inductive energy without failure in UPS or motor drive snubberless designs |
| dv/dt ruggedness | 50 V/ns - prevents spurious turn-on in high-speed, high-bus-voltage inverters and EV chargers |
| Rthj-case | 0.6 °C/W - allows 210 W dissipation with ≤126 °C junction rise above 25 °C case temperature |
Pinout & Package
TO-220 type A package: insulated tab, vertical mounting, lead-free and RoHS-compliant ECOPACK® grade. Case connected to drain (D); source (S) and gate (G) on leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main high-side current path / heat sink interface | Electrically active drain terminal; requires insulating washer when mounted to grounded heatsink |
| Source (Lead 1) | Reference node for gate drive and current sensing | Low-inductance return path; used for shunt-based overcurrent detection in half-bridge legs |
| Gate (Lead 2) | Control input for channel modulation | High-impedance node with ±30 V Zener clamp; sensitive to layout-induced ringing |
Key Features
| Feature | Design Value |
|---|---|
| Fast-recovery body diode | trr = 120 ns and Qrr = 572 nC enable zero-voltage switching in phase-shift full-bridge converters without external SiC diodes |
| Extremely low gate charge | Qg = 54 nC reduces driver losses by >40% vs. legacy 600 V MOSFETs, permitting smaller gate drivers |
| Zener-protected gate | Integrated ±30 V gate-source Zener eliminates need for external TVS, simplifying PCB layout and BOM |
| 100% avalanche tested | Each unit validated for 6 A repetitive avalanche current and 650 mJ single-pulse energy per JEDEC JESD24-11 |
Applications
| Industrial Motor Drives | Server & Telecom PSU |
|---|---|
Use Scenario: Half-bridge inverter stage for 3 kW HVAC compressors operating at 16 kHz PWM frequency. IC Role / Device Role / Timing Role: High-side switch with fast body diode conducting freewheeling current during dead-time. Use Value: Low Qrr (572 nC) cuts diode recovery loss by 65% vs. standard 600 V MOSFETs, reducing heatsink size by 30%. | Use Scenario: Active clamp forward converter in 1.5 kW telecom rectifier with 100 kHz switching. IC Role / Device Role / Timing Role: Main switch handling 400 V DC bus and 28 A peak current; gate driven by isolated transformer. Use Value: 50 V/ns dv/dt ruggedness prevents false triggering during voltage transients on shared bus lines. |
| EV On-Board Charger | Renewable Energy Inverters |
Use Scenario: Primary-side switch in dual-phase interleaved PFC stage of 6.6 kW OBC. IC Role / Device Role / Timing Role: Fast-switching, high-voltage switch with integrated diode conducting reverse current during interleaving dead-time. Use Value: 120 ns trr and 1.6 V VSD minimize conduction and recovery losses, improving PFC efficiency to ≥98.5%. | Use Scenario: DC-link switch in 5 kW string inverter with 800 V PV input and transformerless topology. IC Role / Device Role / Timing Role: High-reliability main switch subjected to repeated lightning-induced surges and grid fault transients. Use Value: 100% avalanche testing and 650 mJ EAS ensure survival under unclamped inductive faults common in solar farm deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPP60R099C7 | 650 V rating, 0.099 Ω RDS(on), 57 nC Qg, no integrated Zener | Higher voltage margin but lacks gate Zener; requires external clamping in noisy environments | Preferred where 650 V headroom is critical and board space allows external TVS |
| STW35N60DM2 | Identical die in TO-247 package; same RDS(on), Qg, trr, and Zener protection | Superior thermal performance (Rthj-case = 0.45 °C/W) but larger footprint and higher cost | Chosen when >210 W power dissipation or extended lifetime at 100 °C case temperature is required |
Compared with IPP60R099C7, STP35N60DM2 offers integrated gate protection and lower dv/dt sensitivity; versus STW35N60DM2, it trades thermal capability for cost and footprint savings in space-constrained 200–300 W designs.
Availability
STP35N60DM2 is available at Aetrix Electronics and suitable for industrial motor drives, server & telecom power supplies, EV on-board chargers, and renewable energy inverters requiring stable component supply and long-term production continuity.
Supply support for STP35N60DM2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, MCU, power, and sensor solutions for automotive, industrial, and consumer markets.
The MDmesh™ DM2 product line targets high-efficiency, high-frequency power conversion systems-specifically optimized for ZVS, phase-shift, and bridge topologies demanding low Qrr, fast trr, and rugged avalanche behavior.
FAQ
What is the maximum safe operating temperature for STP35N60DM2?
The device has a maximum operating junction temperature of 150 °C and storage temperature range of –55 to +150 °C. With Rthj-case = 0.6 °C/W and PTOT = 210 W, case temperature must be held ≤25 °C for full power rating; derating is required above that, per Figure 2's SOA curve.
Does STP35N60DM2 require external gate protection?
No. The device integrates back-to-back gate-source Zener diodes with ±30 V breakdown voltage, providing inherent ESD and overvoltage protection. External TVS devices are unnecessary unless system-level transients exceed ±30 V at the gate pin under worst-case layout conditions.
How does the body diode performance compare to discrete Schottky diodes?
At 28 A and 25 °C, its VSD = 1.6 V and trr = 120 ns outperform standard 600 V FRDs but not SiC Schottkys. However, its co-packaged integration eliminates layout parasitics and reduces component count-making it preferable in cost- and space-sensitive bridge designs where <2% efficiency penalty is acceptable.
Can STP35N60DM2 be used in parallel configurations?
Yes-its positive temperature coefficient of RDS(on) (see Figure 10) enables inherently self-balancing current sharing. Successful parallel operation requires matched gate drive impedance, symmetrical PCB layout, and individual gate resistors (≥4.7 Ω) to damp oscillation; thermal coupling between devices improves balance stability.
STP35N60DM2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ DM2
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 28A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 110mOhm @ 14A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 54 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2400 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 210W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220
STP35N60DM2 FAQ
1.How can I place an order for STP35N60DM2 through Aetrix?
Please submit a Request for Quotation (RFQ) for STP35N60DM2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STP35N60DM2 reliable?
The price and inventory of STP35N60DM2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STP35N60DM2 is usually 5 days.
3.What payment methods are accepted for STP35N60DM2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STP35N60DM2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STP35N60DM2?
STP35N60DM2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STP35N60DM2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STP35N60DM2?
For technical support, including STP35N60DM2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STP35N60DM2 requirements.
6.How does Aetrix verify that STP35N60DM2 is sourced from the original manufacturer or authorized distributors?
All STP35N60DM2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STP35N60DM2 meets industry standards.
7.What is the process for return or replacement of STP35N60DM2?
All STP35N60DM2 units undergo pre-shipment inspection (PSI). If there is an issue with STP35N60DM2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STP35N60DM2 part is unused and in its original packaging.
Return procedure for STP35N60DM2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STP35N60DM2 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
