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STMicroelectronics STP6N62K3

Part No.:
STP6N62K3
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixSTP6N62K3.pdf
Description:
MOSFET N-CH 620V 5.5A TO220AB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:54

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Product details

Overview

STP6N62K3 from STMicroelectronics is an N-channel 620 V, 0.95 Ω typ. (1.2 Ω max.), 5.5 A MDmesh K3 Power MOSFET in IPAK (TO-251) package, designed for high-voltage switching applications including SMPS, PFC stages, and industrial inverters where low conduction loss and robust avalanche capability are critical.

For engineers reviewing the STP6N62K3 datasheet, STP6N62K3 pinout, STP6N62K3 application, or STP6N62K3 equivalent, this device offers verified 12 V/ns dv/dt immunity, 140 mJ single-pulse avalanche energy, 875 pF input capacitance, Zener-protected gate, and improved diode reverse recovery (trr = 290 ns at TJ = 25 °C).

Technical Context

This MOSFET employs ST's MDmesh K3 vertical structure with optimized charge balancing, delivering ultra-low RDS(on) × Qg figure-of-merit (1.2 Ω × 34 nC = 40.8 Ω·nC) and reduced output capacitance energy (Eoss = 3 µJ at 400 V). Its intrinsic gate resistance is 3.5 Ω, supporting fast, controlled switching.

The integrated source-drain diode features 1.5 V forward voltage at 5.5 A and exhibits 2.4 µC reverse recovery charge at TJ = 150 °C - enabling reliable operation in hard-switched and resonant topologies without external snubbers.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 620 V - supports 400 V DC bus designs with ≥50% voltage margin for surge and ringing
RDS(on) max 1.2 Ω - enables ≤6.6 W conduction loss at 5.5 A continuous drain current
Qg 34 nC - determines gate drive power requirement and switching speed in 100–500 kHz converters
EAS 140 mJ - guarantees unclamped inductive switching survival without external clamping
Ciss 875 pF - defines Miller effect and gate drive loop stability in high-side configurations
trr 290 ns - limits diode commutation losses and EMI generation in bridge-leg transitions
RthJC 1.39 °C/W - allows 90 W dissipation with ≤125 °C junction rise above 25 °C case temperature

Pinout & Package

Package: IPAK (TO-251) - surface-mount, single-ended heatsinkable package with exposed drain tab for thermal and electrical connection to PCB copper pour or heatsink.

Pin/Terminal Circuit Role Design Meaning
TAB (Drain) Power Drain terminal / Heatsink interface Electrically connected to drain; must be soldered to large copper area for thermal management and low-inductance return path
Pin 1 (G) Gate control input High-impedance MOS gate requiring <3.5 Ω series resistance to damp oscillation and limit peak current during switching
Pin 3 (S) Source reference / Return path Common node for gate drive return and load current return; layout must minimize inductance to preserve dv/dt immunity

Key Features

Feature Design Value
100% avalanche tested Each unit validated for 5.5 A repetitive avalanche at 50 V, ensuring field reliability in unclamped inductive faults
Extremely high dv/dt capability 12 V/ns rated slope - suppresses false turn-on in high-noise half-bridge environments without gate clamping
Very low intrinsic capacitance Coss = 100 pF, Crss = 17 pF - reduces Miller-induced shoot-through risk and improves ZVS/ZCS transition efficiency
Zener-protected gate Integrated ±30 V gate-source Zener - eliminates need for external gate protection diodes in most industrial designs
Improved diode reverse recovery Qrr = 1.9 µC (25 °C), trr = 290 ns - lowers commutation loss by >30% vs legacy K2 devices in LLC resonant converters

Applications

Server PSU Primary Switch Industrial Motor Drive Inverter

Use Scenario: High-efficiency 3.3 kW server power supply operating at 100–300 kHz with active clamp forward or LLC topology.

IC Role / Device Role / Timing Role: Primary-side high-voltage switch handling 400 V DC input, conducting 5.5 A RMS with 22 A pulsed peaks.

Use Value: Low RDS(on) minimizes conduction loss; 140 mJ EAS ensures fault tolerance during transformer saturation events.

Use Scenario: 7.5 kW three-phase VFD driving 400 V AC induction motors with IGBT replacement in upper switches.

IC Role / Device Role / Timing Role: High-side N-channel switch in 6–12 kHz PWM inverter leg, managing 5.5 A motor phase current.

Use Value: 12 V/ns dv/dt rating prevents spurious turn-on from cross-talk; fast trr enables clean dead-time control.

PFC Boost Converter Photovoltaic String Inverter

Use Scenario: Continuous-conduction-mode (CCM) boost PFC stage in 1.5 kW telecom rectifier with 380–400 V output.

IC Role / Device Role / Timing Role: Main switching element operating at 65–100 kHz, sustaining 5.5 A average current under full load.

Use Value: Low Ciss/Coss ratio improves light-load efficiency; Zener gate protection simplifies driver design.

Use Scenario: DC-DC stage of string inverter converting 600–1000 V PV array voltage to 400 V DC link for grid-tie inverter.

IC Role / Device Role / Timing Role: High-voltage buck/forward switch handling up to 1000 V transients and 5.5 A continuous current.

Use Value: 620 V VDS rating provides 1.6× margin over 600 V nominal array; avalanche ruggedness handles lightning-induced surges.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STF6N62K3 Fully isolated TO-220FP package; same die, higher RthJA (62 °C/W vs 100 °C/W), no exposed drain tab Better suited for through-hole prototyping or lower-power (<40 W) heatsink-limited designs Select when mechanical mounting constraints prohibit surface-mount IPAK or when isolation from heatsink is required
STI6N62K3 I²PAK (TO-262) package; identical electrical specs but larger footprint and 0.95 °C/W RthJC Preferred for high-volume industrial inverters needing higher thermal derating margin and manual assembly compatibility Choose when board space allows larger package and junction-to-case thermal performance is prioritized over footprint

Compared with STF6N62K3 and STI6N62K3, STP6N62K3 delivers optimal power density and thermal interface efficiency in space-constrained SMT layouts, while maintaining identical MDmesh K3 die performance - making it the preferred choice for modern high-frequency, high-power-density converters.

Availability

STP6N62K3 is available at Aetrix Electronics and suitable for server power supplies, industrial motor drives, PFC boost converters, and photovoltaic string inverters requiring stable component supply and long-term production continuity.

Supply support for STP6N62K3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

The MDmesh K3 product line targets high-efficiency, high-reliability power conversion systems - specifically engineered to replace older planar MOSFETs in 600–650 V applications with superior RDS(on) × Qg trade-offs and ruggedness.

FAQ

Is STP6N62K3 pin-compatible with STU6N62K3?

No. STP6N62K3 uses IPAK (TO-251) package with 3-pin configuration (G-S-D on pins 1-3-TAB), while STU6N62K3 is in DPAK (TO-252) with different pinout (G-S-D on pins 1-2-3). Mechanical and thermal footprints differ significantly; PCB redesign is required for substitution.

What gate resistor value is recommended for STP6N62K3 in a 100 kHz LLC converter?

A 4.7 Ω series gate resistor is validated per datasheet Figure 14 test circuit for 100 kHz operation. This value balances switching speed (td(on) = 22 ns, tf = 20 ns) against ringing suppression and gate driver stress, assuming 12 V gate drive and standard PCB layout.

Does STP6N62K3 require external gate protection diodes?

No. The device integrates bidirectional Zener protection between gate and source rated for ±30 V, eliminating the need for external gate clamps in standard industrial applications with properly decoupled gate drive supplies and layout.

Can STP6N62K3 be used in synchronous rectification?

No. STP6N62K3 is a standard N-channel enhancement-mode MOSFET with non-optimized body diode characteristics (trr = 290 ns, Qrr = 1.9 µC); it lacks the low VSD and ultra-fast soft-recovery traits required for efficient synchronous rectification in secondary-side applications.

STP6N62K3 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
SuperMESH3™
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
620 V
Current - Continuous Drain (Id) @ 25°C:
5.5A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
1.2Ohm @ 2.8A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 50µA
Gate Charge (Qg) (Max) @ Vgs:
34 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
875 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
90W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220

STP6N62K3 FAQ

1.How can I place an order for STP6N62K3 through Aetrix?

Please submit a Request for Quotation (RFQ) for STP6N62K3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STP6N62K3 reliable?

The price and inventory of STP6N62K3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STP6N62K3 is usually 5 days.

3.What payment methods are accepted for STP6N62K3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STP6N62K3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STP6N62K3?

STP6N62K3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STP6N62K3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STP6N62K3?

For technical support, including STP6N62K3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STP6N62K3 requirements.

6.How does Aetrix verify that STP6N62K3 is sourced from the original manufacturer or authorized distributors?

All STP6N62K3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STP6N62K3 meets industry standards.

7.What is the process for return or replacement of STP6N62K3?

All STP6N62K3 units undergo pre-shipment inspection (PSI). If there is an issue with STP6N62K3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STP6N62K3 part is unused and in its original packaging.

Return procedure for STP6N62K3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STP6N62K3 Tags

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