STMicroelectronics STQ2HNK60ZR-AP
- Part No.:
- STQ2HNK60ZR-AP
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-226-3, TO-92-3 (TO-226AA) Formed Leads
- Datasheet:
-
STQ2HNK60ZR-AP.pdf
- Description:
- MOSFET N-CH 600V 500MA TO92-3
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
STQ2HNK60ZR-AP from STMicroelectronics is a Zener-protected N-channel SuperMESH Power MOSFET rated at 600 V VDS, 4.8 Ω max RDS(on), and 2 A continuous drain current in an IPAK (TO-251) package. It delivers high dv/dt capability (4.5 V/ns), 100% avalanche tested operation, and low gate charge (11–15 nC) for robust switching in offline SMPS and AC-DC adapters.
For engineers reviewing the STQ2HNK60ZR-AP datasheet, STQ2HNK60ZR-AP pinout, STQ2HNK60ZR-AP application, or STQ2HNK60ZR-AP equivalent, key selection criteria include its 600 V breakdown voltage, 2.77 °C/W junction-to-case thermal resistance, Zener-protected gate, and verified unclamped inductive switching performance up to 120 mJ single-pulse avalanche energy.
Technical Context
This device implements ST's SuperMESH process - an evolution of PowerMESH - optimized for reduced on-resistance while preserving high-voltage ruggedness. Its Zener-protected gate structure enables ±30 V VGS tolerance and intrinsic ESD immunity (2 kV HBM), eliminating need for external gate protection in many designs.
The MOSFET integrates a fast-recovery body diode with 178 ns trr (TJ = 25 °C) and 445 nC Qrr, supporting hard-switched flyback and resonant topologies. Safe operating area (SOA) is defined up to 100 µs pulse width at 2 A, constrained by RDS(on) and thermal limits (TJ ≤ 150 °C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - supports universal-input offline converters up to 380 V DC bus with margin |
| RDS(on) max | 4.8 Ω @ VGS = 10 V, ID = 1 A - determines conduction loss in 2 A continuous applications |
| ID cont. | 2.0 A @ TC = 25 °C - defines heatsink sizing for ambient-limited PCB layouts |
| EAS | 120 mJ - enables reliable unclamped inductive switching without external snubbers |
| dv/dt | 4.5 V/ns - ensures noise-immune operation in high-speed gate-drive environments |
| Qg | 11–15 nC - sets minimum gate-driver peak current requirement (~1.5 A for 10 ns rise) |
| RthJC | 2.77 °C/W - allows direct thermal path to heatsink via exposed tab in IPAK package |
Pinout & Package
STQ2HNK60ZR-AP uses the IPAK (TO-251) type C package with an electrically active exposed tab (Drain-connected). The three-terminal configuration supports low-inductance PCB layout and efficient thermal transfer to heatsinks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control terminal; requires <30 V swing and low-impedance drive due to 11–15 nC Qg |
| 2 (D / TAB) | Drain / Heatsink Pad | Main high-voltage power terminal; electrically connected to exposed metal tab for thermal and electrical conduction |
| 3 (S) | Source | Power return and reference node; ties to gate driver ground to minimize common-source inductance |
Key Features
| Feature | Design Value |
|---|---|
| Zener-protected gate | ±30 V VGS rating with integrated clamp eliminates need for external TVS in most gate-drive circuits |
| 100% avalanche tested | Each unit validated for 120 mJ single-pulse avalanche energy - guarantees ruggedness in inductive fault conditions |
| Low Ciss/Coss | 280 pF input capacitance and 38 pF output capacitance reduce switching losses and EMI generation |
| High dv/dt immunity | 4.5 V/ns rated diode recovery slope prevents false turn-on during fast voltage transients |
| SuperMESH technology | Optimized cell layout achieves 3.5 Ω typ. RDS(on) at 600 V - improves efficiency over prior-generation 600 V MOSFETs |
Applications
| AC-DC Adapter Primary Switch | Flyback Converter Main Switch |
|---|---|
Use Scenario: 36 W universal-input (90–264 VAC) adapter for consumer electronics. IC Role / Device Role / Timing Role: Primary-side high-voltage switch controlling energy transfer into transformer. Use Value: 600 V rating and 120 mJ EAS ensure reliable operation under line surges and no-load overvoltage conditions. | Use Scenario: Isolated 24 V/1.5 A industrial power supply with 65 kHz switching frequency. IC Role / Device Role / Timing Role: Main power switch in discontinuous conduction mode (DCM) flyback topology. Use Value: Low Qg (11–15 nC) and fast diode (178 ns trr) minimize switching loss and improve light-load efficiency. |
| LED Driver Secondary Switch | Industrial PLC Input Stage |
Use Scenario: Constant-current LED driver for street lighting with active PFC front-end. IC Role / Device Role / Timing Role: High-side switch in buck-derived secondary regulation stage. Use Value: Zener-protected gate withstands gate-drive coupling noise from PFC stage, reducing failure risk. | Use Scenario: 24 V DC input module handling relay coil drive and sensor interface signals. IC Role / Device Role / Timing Role: Load switch isolating downstream circuitry during fault events. Use Value: 100% avalanche testing ensures survival during inductive kickback from relay coils without snubber. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP2HNK60Z | Same SuperMESH die, TO-220 package; higher RthJA (62 °C/W vs 100 °C/W), identical RDS(on) and EAS | Better thermal dissipation in forced-air or heatsink-mounted setups; larger footprint | Select when board space permits and higher continuous power (>3 W) is required |
| FQP2N60 | 600 V, 5.5 Ω RDS(on), no Zener gate protection, 80 mJ EAS, TO-220 | Lacks integrated gate clamp and avalanche margin; requires external protection and derating | Choose only for cost-sensitive, non-safety-critical applications with controlled gate drive |
Compared with STP2HNK60Z and FQP2N60, STQ2HNK60ZR-AP offers superior gate ruggedness and compact IPAK packaging - critical for space-constrained, high-reliability AC-DC systems where layout-induced dv/dt stress is unavoidable.
Availability
STQ2HNK60ZR-AP is available at Aetrix Electronics and suitable for AC-DC adapters, flyback converters, and industrial PLC input stages requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for STQ2HNK60ZR-AP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for industrial, automotive, and consumer markets.
The SuperMESH Power MOSFET product line targets high-efficiency, high-reliability offline power conversion - specifically engineered for ruggedness in unclamped inductive switching and surge-prone mains-connected applications.
FAQ
What is the maximum safe operating temperature for STQ2HNK60ZR-AP?
The device has a specified operating junction temperature range of –55 °C to 150 °C. Maximum continuous operation occurs at TJ = 150 °C, which corresponds to TC ≈ 135 °C given its 2.77 °C/W RthJC. Derating is required above 100 °C case temperature per the SOA curve in DS3646.
Does STQ2HNK60ZR-AP require an external gate resistor?
Yes - a gate resistor (typically 4.7–10 Ω) is required to control dV/dt and prevent oscillation. The 11–15 nC total gate charge and low Ciss make it sensitive to parasitic inductance; layout and resistor value must be tuned to achieve clean 10–30 ns rise/fall times without overshoot.
Can STQ2HNK60ZR-AP replace STD2HNK60Z-1 in existing designs?
Yes - STQ2HNK60ZR-AP shares identical electrical specifications, pinout, and package with STD2HNK60Z-1 per DS3646 Rev 8. The "R-AP" suffix denotes tape-and-reel packaging and minor internal process enhancements; no schematic or layout changes are needed for drop-in replacement.
Is the exposed tab electrically isolated in STQ2HNK60ZR-AP?
No - the exposed tab is internally connected to the Drain (pin 2). It must be mounted to a heatsink using electrically insulating thermal pads or mica washers if the heatsink is grounded or at a different potential than the drain node.
STQ2HNK60ZR-AP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- SuperMESH™
- Package/Case:
- TO-226-3, TO-92-3 (TO-226AA) Formed Leads
- Packaging:
- Cut Tape (CT)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 500mA (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 4.8Ohm @ 1A, 10V
- Vgs(th) (Max) @ Id:
- 4.5V @ 50µA
- Gate Charge (Qg) (Max) @ Vgs:
- 15 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 280 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-92-3
STQ2HNK60ZR-AP FAQ
1.How can I place an order for STQ2HNK60ZR-AP through Aetrix?
Please submit a Request for Quotation (RFQ) for STQ2HNK60ZR-AP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STQ2HNK60ZR-AP reliable?
The price and inventory of STQ2HNK60ZR-AP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STQ2HNK60ZR-AP is usually 5 days.
3.What payment methods are accepted for STQ2HNK60ZR-AP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STQ2HNK60ZR-AP transactions.
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4.How is shipping managed for STQ2HNK60ZR-AP?
STQ2HNK60ZR-AP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STQ2HNK60ZR-AP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STQ2HNK60ZR-AP?
For technical support, including STQ2HNK60ZR-AP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STQ2HNK60ZR-AP requirements.
6.How does Aetrix verify that STQ2HNK60ZR-AP is sourced from the original manufacturer or authorized distributors?
All STQ2HNK60ZR-AP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STQ2HNK60ZR-AP meets industry standards.
7.What is the process for return or replacement of STQ2HNK60ZR-AP?
All STQ2HNK60ZR-AP units undergo pre-shipment inspection (PSI). If there is an issue with STQ2HNK60ZR-AP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STQ2HNK60ZR-AP part is unused and in its original packaging.
Return procedure for STQ2HNK60ZR-AP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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