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STMicroelectronics STS7PF30L

Part No.:
STS7PF30L
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixSTS7PF30L.pdf
Description:
MOSFET P-CH 30V 7A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,032

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Product details

Overview

STS7PF30L from STMicroelectronics is a P-channel enhancement-mode power MOSFET in SO-8 package, rated for 30 V VDSS, 7 A continuous drain current at TC = 25°C, and typ. RDS(on) = 0.016 Ω at VGS = 10 V. It features low-threshold gate drive (VGS(th) = 1.0–2.5 V), integrated source-drain diode with 1.2 V forward voltage at 7 A, and rugged unclamped inductive switching capability - used in battery protection circuits of portable phones and nomadic equipment.

For engineers reviewing the STS7PF30L datasheet, STS7PF30L pinout, STS7PF30L application, or STS7PF30L equivalent, key selection criteria include verified P-channel logic-level gate compatibility, SO-8 thermal performance on FR4 (Rthj-amb = 50 °C/W), source-drain diode recovery (trr = 40 ns), and safe operating area under pulsed 28 A conditions.

Technical Context

This MOSFET employs ST's StripFET™ II process with single-feature-size geometry, enabling high cell density and low RDS(on) without compromising avalanche ruggedness. Its P-channel topology allows high-side load switching with simple gate control referenced to ground, eliminating need for level-shifting circuitry in battery disconnect paths.

The device integrates a fast-recovery body diode (trr = 40 ns, Qrr = 46 nC) optimized for synchronous rectification and reverse-polarity protection. Gate charge parameters (Qg = 28 nC, Qgd = 12 nC) support efficient 4.5 V logic-level driving in portable DC/DC and power-path management.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30 V - Maximum drain-source blocking voltage; defines upper limit for battery input voltage in 3.3 V–24 V portable systems.
RDS(on) @ VGS = 10 V0.016 Ω typ. - Enables <112 mW conduction loss at 7 A, critical for thermally constrained mobile PCBs.
VGS(th)1.0–2.5 V - Ensures full enhancement with standard 3.3 V or 5 V microcontroller GPIO, no external level shifter required.
ID (TC = 100°C)4.4 A - Derated current rating confirms usable power handling under sustained ambient heat in sealed enclosures.
trr / Qrr40 ns / 46 nC - Fast body diode recovery minimizes switching losses and voltage spikes in bidirectional power path designs.
Qg / Qgd28 nC / 12 nC - Low gate charge enables fast turn-on/off with minimal driver IC loading, supporting >100 kHz PWM operation.

Pinout & Package

SO-8 surface-mount package (JEDEC MS-012AC), 5.0 mm × 6.2 mm footprint, 1.27 mm lead pitch, with exposed drain pad for thermal enhancement. Pin 1 marked by notch or dot; pins numbered counterclockwise.

Pin/TerminalCircuit RoleDesign Meaning
1 (G)GateControl terminal; accepts 0–4.5 V logic-level signals directly from MCU I/O for high-side switch activation.
2 (S)SourceReference node for gate drive; tied to system VBAT in high-side configuration; carries full load current.
3 (D)DrainSwitched output node; connected to load; internally bonded to exposed thermal pad for heatsinking.
4 (S)SourceSecond source connection - paralleled with Pin 2 to reduce source inductance and improve di/dt immunity.
5 (D)DrainSecond drain connection - paralleled with Pin 3 to lower RDS(on) and enhance thermal conduction via pad.
6 (D)DrainThird drain connection - part of multi-pin drain structure optimizing current sharing and thermal dissipation.
7 (D)DrainFourth drain connection - completes low-inductance, low-resistance drain path to thermal pad.
8 (S)SourceThird source connection - reduces source loop inductance, critical for stable switching in high-di/dt battery protection.

Key Features

FeatureDesign Value
Logic-level gate thresholdVGS(th) ≤ 2.5 V ensures reliable turn-on using 3.3 V microcontrollers without gate boosting.
StripFET™ II processEnables 0.016 Ω RDS(on) in SO-8 - 30% lower than prior-gen P-channel MOSFETs at same die size.
Integrated fast body diodetrr = 40 ns supports reverse-current commutation in USB-C power delivery and battery backup switchover.
Rugged unclamped inductive switchingWithstands 28 A pulsed current without failure - validated per Figure 2 waveform, essential for hot-swap protection.
Thermal resistance (Rthj-amb)50 °C/W on 1 in² FR4 board - enables 2.5 W dissipation without heatsink in handheld enclosure environments.

Applications

Battery Reverse-Polarity ProtectionUSB Power Path Management

Use Scenario: Preventing damage when user inserts Li-ion battery backward into smartphone or tablet battery compartment.

IC Role / Device Role: High-side P-channel switch placed between battery connector and system rail; blocks reverse current flow while passing forward current with minimal drop.

Use Value: 1.2 V VSD at 7 A ensures <100 mV added voltage drop during normal operation, preserving system runtime.

Use Scenario: Selecting between wall adapter and battery power in dual-input USB-C PD devices.

IC Role / Device Role: Load switch controlling power path from USB-C port to system PMIC; enables seamless source handover without brownout.

Use Value: 40 ns trr and low Qrr prevent voltage overshoot during dynamic source switching, meeting USB PD 3.0 transient specs.

Portable Device Power-Off ControlSmart Battery Fuel Gauge Isolation

Use Scenario: Enabling hardware-initiated shutdown in medical wearables or IoT sensors to meet ultra-low standby current requirements.

IC Role / Device Role: High-side disconnect switch isolating main SoC and peripherals from battery when host MCU asserts shutdown signal.

Use Value: 1 µA IDSS at 30 V ensures <10 nA leakage per switch - critical for multi-week shelf life in battery-powered edge nodes.

Use Scenario: Isolating fuel gauge IC from battery during deep sleep to eliminate parasitic drain through gauge communication lines.

IC Role / Device Role: Signal-path isolation switch placed between battery pack and SMBus/I²C fuel gauge; breaks DC path while preserving bus integrity.

Use Value: 0.016 Ω RDS(on) adds negligible series resistance to battery sense lines, maintaining ±0.5% state-of-charge accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel load switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Infineon BSP320SRDS(on) = 0.022 Ω @ 4.5 V; VGS(th) = 1.0–2.2 V; SO-8, same pinoutHigher RDS(on) increases conduction loss by ~38% at 7 A; identical thermal footprintAcceptable where 150 mW extra loss is tolerable and cost sensitivity favors Infineon sourcing.
ON Semiconductor NTMFS4C09NRDS(on) = 0.013 Ω @ 4.5 V; VGS(th) = 1.2–2.4 V; PowerSO-8 (enhanced thermal pad)Lower RDS(on) improves efficiency but requires modified layout for larger thermal pad; higher Qg = 35 nCPreferred for new designs needing <100 mW loss at 7 A, provided layout accommodates larger exposed pad.

Compared with BSP320S and NTMFS4C09N, STS7PF30L delivers optimal balance of logic-level drive margin, proven SO-8 thermal reliability, and body diode performance - making it preferred for legacy-compatible battery management revisions where layout change is prohibited.

Availability

STS7PF30L is available at Aetrix Electronics and suitable for battery protection, USB power path management, and portable device power-off control requiring stable component supply across consumer electronics, medical wearables, and industrial handheld terminals.

Supply support for STS7PF30L includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, MEMS, power, and microcontroller solutions for automotive, industrial, and consumer markets.

The STS7PF30L belongs to ST's StripFET™ II power MOSFET product line, engineered specifically for high-efficiency, logic-level-controlled power switching in space-constrained portable electronics.

FAQ

What is the maximum safe operating temperature for STS7PF30L during continuous operation?

The junction temperature must not exceed 150 °C. At TC = 100 °C, the device supports 4.4 A continuous drain current. With Rthj-amb = 50 °C/W on standard FR4, ambient temperature must be kept below 85 °C for full 7 A operation - verified via unclamped inductive testing per Figure 2.

Can STS7PF30L be driven directly by a 3.3 V microcontroller GPIO without external components?

Yes. With VGS(th) max = 2.5 V and guaranteed turn-on at VGS = 3.3 V, the MOSFET achieves full enhancement and low RDS(on) without gate drivers or level shifters. Measured RDS(on) = 0.022 Ω at VGS = 3.3 V and ID = 3.5 A confirms robust logic-level compatibility.

Does STS7PF30L include an integrated body diode, and what are its recovery characteristics?

Yes - it features a monolithic source-drain diode with forward voltage VSD = 1.2 V at 7 A and reverse recovery time trr = 40 ns at Tj = 150 °C, di/dt = 100 A/µs. Qrr = 46 nC and IRRM = 2.3 A are measured per Figure 5 test circuit, supporting fast-switching power-path arbitration.

Is the SO-8 package of STS7PF30L compatible with standard automated pick-and-place equipment?

Yes. The device uses JEDEC-standard SO-8 outline (MS-012AC) with 1.27 mm pitch and defined land pattern per datasheet page 5. Lead coplanarity ≤ 0.10 mm and gull-wing lead form ensure reliable placement and reflow soldering on Type II and III assembly lines.

STS7PF30L Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
STripFET™ II
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
7A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
21mOhm @ 3.5A, 10V
Vgs(th) (Max) @ Id:
2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
38 nC @ 4.5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2600 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
2.5W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

STS7PF30L FAQ

1.How can I place an order for STS7PF30L through Aetrix?

Please submit a Request for Quotation (RFQ) for STS7PF30L on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STS7PF30L reliable?

The price and inventory of STS7PF30L are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STS7PF30L is usually 5 days.

3.What payment methods are accepted for STS7PF30L?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STS7PF30L transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STS7PF30L?

STS7PF30L orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STS7PF30L order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STS7PF30L?

For technical support, including STS7PF30L datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STS7PF30L requirements.

6.How does Aetrix verify that STS7PF30L is sourced from the original manufacturer or authorized distributors?

All STS7PF30L products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STS7PF30L meets industry standards.

7.What is the process for return or replacement of STS7PF30L?

All STS7PF30L units undergo pre-shipment inspection (PSI). If there is an issue with STS7PF30L, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STS7PF30L part is unused and in its original packaging.

Return procedure for STS7PF30L:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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