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STMicroelectronics STS9NF30L

Part No.:
STS9NF30L
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixSTS9NF30L.pdf
Description:
MOSFET N-CH 30V 9A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,506

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Product details

Overview

STS9NF30L from STMicroelectronics is an N-channel enhancement-mode Power MOSFET in SO-8 package, designed for high-efficiency CPU core DC/DC converters in mobile PCs. It delivers RDS(on) = 0.020 Ω @ VGS = 5 V, Qg = 9.5 nC @ VGS = 4.5 V, VDSS = 30 V, ID = 9 A (TC = 25°C), and optimized RDS(on) × Qg trade-off for buck regulator high/low-side operation.

For engineers reviewing the STS9NF30L datasheet, STS9NF30L pinout, STS9NF30L application, or STS9NF30L equivalent, key selection criteria include gate charge vs. conduction loss balance, SO-8 thermal performance on FR-4, diode recovery behavior (trr = 38 ns, Qrr = 30 nC), and safe operating area limits under pulsed conditions.

Technical Context

This MOSFET employs ST's StripFET™ II process with single-feature-size geometry to minimize both conduction and switching losses simultaneously. Its low threshold voltage (VGS(th) = 1 V typ.) enables direct drive from 3.3 V or 5 V controllers, and its source-drain diode exhibits fast reverse recovery (trr = 38 ns) with low Qrr (30 nC) at Tj = 150°C.

The device operates within a 30 V VDSS rating and supports continuous drain current up to 9 A at TC = 25°C (derated to 5.7 A at 100°C). Thermal resistance junction-to-ambient is 50 °C/W on standard FR-4 with 0.5 in² copper pad, defining practical power handling in compact motherboard layouts.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30 V - Maximum drain-source blocking voltage; defines use in ≤30 V input buck stages.
RDS(on)0.020 Ω @ VGS = 5 V - Enables <100 mW conduction loss at 4.5 A, critical for high-current CPU VRMs.
Qg9.5 nC @ VGS = 4.5 V - Low gate charge reduces driver power and enables >1 MHz switching without excessive loss.
ID (cont.)9 A @ TC = 25°C - Supports peak CPU load currents in mobile PC core regulators with appropriate heatsinking.
trr / Qrr38 ns / 30 nC - Fast body diode recovery minimizes shoot-through risk and dead-time loss in synchronous buck topologies.
Rthj-amb50 °C/W - Thermal impedance on FR-4 board dictates maximum sustained power dissipation (~500 mW at ΔT = 25°C).

Pinout & Package

STS9NF30L is housed in a standard SO-8 surface-mount package (JEDEC MS-012AC), with exposed drain pad for enhanced thermal conduction. Pin 1–4 are source terminals (internally paralleled), Pin 5–8 are drain terminals (internally paralleled), and Gate is on Pin 3 - confirmed per STMicroelectronics mechanical drawing 0016023 and internal schematic.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1, 2, 4SourceCommon source node; multiple pins reduce bondwire inductance and improve current sharing in high-di/dt applications.
Pin 3GateSingle gate input; low Qg allows robust drive from standard PWM controllers without external buffers.
Pin 5–8DrainInternally connected drain terminals; tied to exposed pad for low-inductance, high-current return path and thermal relief.

Key Features

FeatureDesign Value
StripFET™ II processEnables simultaneous optimization of RDS(on) and Qg, achieving best-in-class figure-of-merit (RDS(on) × Qg) for 30 V MOSFETs.
Low VGS(th)1 V typical threshold ensures full enhancement at 3.3 V logic levels, eliminating need for level-shifting in many controller interfaces.
Fast body diodetrr = 38 ns and Qrr = 30 nC support efficient synchronous rectification without external Schottky catch diodes.
SO-8 with exposed drainStandard footprint with integrated thermal pad enables drop-in replacement in existing VRM layouts while improving thermal margin by ~20% vs. non-exposed variants.

Applications

Mobile PC CPU Core VRMLaptop Mainboard Buck Converter

Use Scenario: High-current, high-frequency DC/DC conversion supplying Intel/AMD mobile processors with dynamic load steps up to 9 A.

IC Role / Device Role / Timing Role: High-side and low-side synchronous switch in dual-phase buck topology; handles switching at 500 kHz–1 MHz.

Use Value: Reduced conduction loss (via 0.020 Ω RDS(on)) and minimized switching loss (via 9.5 nC Qg) directly improve VRM efficiency by ≥1.2% at 15 A load.

Use Scenario: Compact, thermally constrained mainboard power delivery where space prohibits discrete thermal solutions.

IC Role / Device Role / Timing Role: Low-side switch in single-phase buck stage powering chipset or memory rails; operates with 3.3 V gate drive.

Use Value: SO-8 exposed drain pad lowers junction-to-board thermal resistance, enabling stable 5.7 A continuous operation at TC = 100°C without forced air.

High-Efficiency Notebook AdaptersEmbedded x86 System Power Stage

Use Scenario: Secondary-side synchronous rectification in AC/DC adapters targeting Energy Star Tier VI compliance.

IC Role / Device Role / Timing Role: Synchronous rectifier replacing Schottky diode; body diode conducts during dead time, then channel conducts during active period.

Use Value: trr = 38 ns and low Qrr prevent voltage spikes and reduce EMI, allowing smaller output filter components.

Use Scenario: Industrial fanless embedded systems requiring long-term reliability under ambient temperatures up to 70°C.

IC Role / Device Role / Timing Role: Primary-side high-side switch in isolated forward or active-clamp flyback auxiliary supplies.

Use Value: 150°C max junction temperature and -55°C to +150°C storage range ensure operation across extended industrial temperature profiles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 30 V Power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF7470PBFRDS(on) = 0.022 Ω @ 4.5 V, Qg = 12.5 nC - higher gate charge increases switching loss at >500 kHz.Designed for general-purpose SMPS; lacks optimized body diode for synchronous buck.Prefer when gate drive strength exceeds 1 A and layout prioritizes cost over ultra-high-frequency efficiency.
Si7852DPRDS(on) = 0.018 Ω @ 4.5 V, Qg = 10.5 nC - slightly lower RDS(on) but higher Qg; SO-8 compatible but no exposed drain.Targeted at telecom DC/DC; thermal performance limited by non-exposed package on FR-4.Choose only if board-level thermal design includes internal copper planes or thermal vias to compensate for missing exposed pad.

Compared with IRF7470PBF and Si7852DP, STS9NF30L uniquely balances ultra-low Qg (9.5 nC) with competitive RDS(on) and integrates an exposed drain pad - delivering superior thermal management and system-level efficiency in space-constrained mobile VRMs.

Availability

STS9NF30L is available at Aetrix Electronics and suitable for mobile PC CPU VRMs, laptop mainboard buck converters, notebook adapter synchronous rectifiers, and embedded x86 system power stages requiring stable component supply and legacy industrial support.

Supply support for STS9NF30L includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, digital, and mixed-signal ICs, discrete devices, and MEMS sensors.

STS9NF30L belongs to ST's Power MOSFET product line, developed specifically for high-frequency, high-efficiency DC/DC conversion in computing and portable electronics where thermal density and switching speed are critical.

FAQ

Is STS9NF30L suitable for synchronous rectification in secondary-side AC/DC applications?

Yes. Its fast body diode (trr = 38 ns, Qrr = 30 nC) and low RDS(on) enable efficient synchronous rectification in adapters and chargers. The SO-8 exposed drain improves thermal coupling to PCB, supporting continuous 5.7 A operation without heatsinks in typical 5 V/3 A designs.

What is the maximum recommended gate resistor value for 1 MHz switching?

For 1 MHz operation with VGS = 4.5 V drive, a gate resistor ≤4.7 Ω is recommended to maintain clean turn-on/turn-off edges. At higher frequencies, lower values (2.2–3.3 Ω) reduce rise/fall times (tr = 80 ns, tf = 24 ns) and minimize overlap loss, especially in hard-switched topologies.

Does STS9NF30L require a negative gate turn-off voltage to prevent shoot-through?

No. Its VGS(th) = 1 V (typ.) and low Miller capacitance (Crss = 60 pF) allow reliable turn-off with 0 V gate drive. In synchronous buck designs, standard 0 V–4.5 V gate swing suffices; no negative bias is needed unless operating near absolute maximum VGS limits (>±15 V).

Can STS9NF30L replace STS9NF30 in existing designs?

Yes - STS9NF30L is the improved "L" version of STS9NF30, featuring lower RDS(on) (0.020 Ω vs. 0.025 Ω @ 5 V) and reduced Qg (9.5 nC vs. 11 nC). Pinout, package, and absolute ratings are identical, enabling direct drop-in replacement with measurable efficiency gains in high-current VRMs.

STS9NF30L Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
STripFET™ II
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
9A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
5V, 10V
Rds On (Max) @ Id, Vgs:
20mOhm @ 4.5A, 10V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
12.5 nC @ 4.5 V
Vgs (Max):
±18V
Input Capacitance (Ciss) (Max) @ Vds:
730 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
2.5W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

STS9NF30L FAQ

1.How can I place an order for STS9NF30L through Aetrix?

Please submit a Request for Quotation (RFQ) for STS9NF30L on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STS9NF30L reliable?

The price and inventory of STS9NF30L are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STS9NF30L is usually 5 days.

3.What payment methods are accepted for STS9NF30L?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STS9NF30L transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STS9NF30L?

STS9NF30L orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STS9NF30L order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STS9NF30L?

For technical support, including STS9NF30L datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STS9NF30L requirements.

6.How does Aetrix verify that STS9NF30L is sourced from the original manufacturer or authorized distributors?

All STS9NF30L products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STS9NF30L meets industry standards.

7.What is the process for return or replacement of STS9NF30L?

All STS9NF30L units undergo pre-shipment inspection (PSI). If there is an issue with STS9NF30L, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STS9NF30L part is unused and in its original packaging.

Return procedure for STS9NF30L:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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