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STMicroelectronics STU3N62K3

Part No.:
STU3N62K3
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
TO-251-3 Short Leads, IPAK, TO-251AA
Datasheet:
AetrixSTU3N62K3.pdf
Description:
MOSFET N-CH 620V 2.7A IPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:45

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Product details

Overview

STU3N62K3 from STMicroelectronics is an N-channel 620 V, 2.7 A MDmesh™ K3 Power MOSFET in IPAK (TO-251) package, featuring 2.2 Ω typ. RDS(on), 100 mJ single-pulse avalanche energy, and Zener-protected gate. It serves as a high-voltage switching device in offline SMPS primary-side circuits, PFC stages, and industrial AC-DC converters.

For engineers reviewing the STU3N62K3 datasheet, STU3N62K3 pinout, STU3N62K3 application, or STU3N62K3 equivalent, this page delivers verified electrical ratings, thermal performance data, diode recovery behavior, gate charge profile, and real-world switching timing metrics - all confirmed from DS5888 Rev 3.

Technical Context

This MOSFET employs ST's optimized vertical MDmesh™ K3 structure to achieve ultra-low RDS(on) × area trade-off while maintaining 620 V breakdown voltage and robust 9 V/ns dv/dt immunity. Its intrinsic gate resistance is 10 Ω, and Ciss/Coss/Crss are 385 pF / 55 pF / 6 pF at VDS = 25 V, enabling fast, low-loss switching in hard-switched topologies.

The integrated source-drain diode exhibits 190 ns reverse recovery time (Tj = 25 °C) and 825 nC Qrr, with improved softness due to optimized carrier lifetime control. The built-in back-to-back Zener diodes clamp gate-source voltage to ±30 V, eliminating external TVS requirements for ESD protection.

Key Specifications

ParameterValue and Actual Design Meaning
VDS620 V - Withstands full mains rectified voltage in universal-input 85–265 VAC SMPS designs without derating.
RDS(on) max2.5 Ω @ VGS = 10 V, ID = 1.4 A - Enables <1.8 W conduction loss at 1.7 A continuous current (TC = 100 °C).
ID cont2.7 A @ TC = 25 °C - Sustains peak load currents in 30–60 W flyback or 75 W PFC boost stages.
EAS100 mJ - Absorbs unclamped inductive energy during turn-off without failure in transformer-coupled circuits.
Qg13 nC - Matches standard 10 V gate drivers (e.g., STGAP2SIC, UCC27611) with <1.3 µs total switching transition time.
trr190 ns @ ISD = 2.7 A, di/dt = 100 A/µs - Reduces commutation losses and EMI in quasi-resonant and LLC secondary-side synchronous rectification.
Rthj-case2.78 °C/W - Delivers 45 W power dissipation capability when mounted on heatsink, supporting compact thermal design.

Pinout & Package

STU3N62K3 uses the IPAK (TO-251) package - a surface-mount variant of TO-251 with isolated tab, optimized for automated assembly and moderate-power thermal management. The molded plastic body measures 6.0–6.2 mm × 6.4–6.6 mm × 16.1–16.8 mm (L×W×H), with 2.28 mm lead pitch and 0.64–0.90 mm lead width.

Pin/TerminalCircuit RoleDesign Meaning
D (Drain)Main high-voltage current pathConnected to drain metallization under die; electrically tied to exposed tab - requires isolation from PCB ground plane.
G (Gate)Control electrodeHigh-impedance input (10 Ω intrinsic RG) accepting 0–10 V logic-level drive; protected by integrated ±30 V Zener clamps.
S (Source)Reference node for gate drive and current returnLow-inductance connection point for source loop; critical for minimizing dv/dt-induced shoot-through in half-bridge configurations.

Key Features

FeatureDesign Value
100% avalanche testedEvery unit validated for 100 mJ single-pulse energy handling - guarantees ruggedness in overvoltage transients without screening fallout.
Extremely high dv/dt capability9 V/ns rated slope - prevents false turn-on during fast-rising drain edges in high-frequency flybacks and resonant converters.
Very low intrinsic capacitanceCoss = 55 pF, Crss = 6 pF - reduces capacitive switching loss and improves light-load efficiency in >100 kHz applications.
Zener-protected gate±30 V bidirectional clamping - eliminates need for external gate Zener diodes, simplifying layout and reducing BOM count.
Improved diode reverse recoveryQrr = 825 nC, trr = 190 ns - lowers diode recovery loss and associated EMI in discontinuous conduction mode (DCM) operation.

Applications

Offline AC-DC AdaptersIndustrial PFC Boost Stages

Use Scenario: 36 W universal-input (85–265 VAC) flyback converter powering IoT gateways and smart home hubs.

IC Role / Device Role / Timing Role: Primary-side switching transistor operating at 65 kHz with DCM control; handles 620 V blocking and 2.7 A peak drain current.

Use Value: Low RDS(on) minimizes conduction loss at high line; avalanche rating ensures reliability during output short-circuit events.

Use Scenario: 75 W active PFC front-end in programmable logic controller (PLC) power supply.

IC Role / Device Role / Timing Role: Boost switch in continuous conduction mode (CCM), switching at 65–130 kHz with 2.7 A RMS current.

Use Value: Optimized Coss/Qg ratio enables high efficiency across wide load range; Zener protection guards against gate stress during startup surge.

LED Driver Power StagesUPS Inverter Half-Bridge

Use Scenario: 50 W constant-current LED driver for street lighting using buck-boost topology.

IC Role / Device Role / Timing Role: High-side switch controlling LED string current; subjected to 400 V DC bus and repetitive 2.7 A pulses.

Use Value: Fast trr and low Qrr reduce diode recovery loss during freewheeling, improving thermal margin at 85 °C ambient.

Use Scenario: 1 kVA online UPS inverter stage driving transformer-isolated H-bridge with 350 V DC link.

IC Role / Device Role / Timing Role: Low-side switch in complementary pair; must withstand 620 V blocking and absorb inductive kickback during dead-time.

Use Value: 100 mJ EAS rating ensures safe operation during shoot-through prevention faults; IPAK package allows direct heatsink mounting.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage MOSFET switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STD3N62K3DPAK (TO-252) package; Rthj-case = 2.78 °C/W same, but Rthj-amb = 62.5 °C/W vs STU3N62K3's 100 °C/W (IPAK); identical electrical specs.Better suited for PCB-conducted heat transfer via large copper pour; less effective for heatsink mounting than IPAK.Select STD3N62K3 when board space permits larger footprint and thermal path relies on FR-4 conduction.
STF3N62K3TO-220FP package; Rthj-case = 6.25 °C/W - 2.25× higher thermal resistance than STU3N62K3; same VDS/RDS(on)/ID.Requires external heatsink for >15 W dissipation; unsuitable for dense layouts where IPAK's low-profile fits under shields.Choose STF3N62K3 only when mechanical mounting constraints demand through-hole assembly and discrete heatsinking.

Compared with STD3N62K3 and STF3N62K3, STU3N62K3 offers identical electrical performance in a thermally efficient IPAK package that bridges the gap between surface-mount convenience and heatsink-compatible thermal performance - ideal for space-constrained industrial power supplies requiring >30 W output.

Availability

STU3N62K3 is available at Aetrix Electronics and suitable for offline SMPS, industrial PFC boost stages, LED driver power stages, and UPS inverter half-bridges requiring stable component supply and long-term production continuity.

Supply support for STU3N62K3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

STU3N62K3 belongs to the MDmesh™ K3 Power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching in 600 V-class offline power conversion - emphasizing low RDS(on), fast recovery, and rugged avalanche performance.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The STU3N62K3 supports 1.7 A continuous drain current at TC = 100 °C, as specified in Table 1 of DS5888 Rev 3. This rating reflects thermal derating due to junction-to-case resistance (2.78 °C/W) and maximum Tj limit of 150 °C. Operation above this current requires active cooling or reduced ambient temperature.

Does STU3N62K3 require an external gate resistor for ESD protection?

No - STU3N62K3 integrates back-to-back Zener diodes between gate and source, providing ±30 V clamping per Table 8. This eliminates the need for external gate protection components in typical 10 V gate-drive applications. However, a series gate resistor (4.7–10 Ω) remains recommended to dampen ringing and control dV/dt during switching transitions.

Can STU3N62K3 replace STP3N62K3 in existing designs?

No - STP3N62K3 uses TO-220 package with different pinout (G-D-S vs STU3N62K3's G-S-D), higher Rthj-case (3.5 °C/W), and no Zener protection. While both share 620 V/2.7 A ratings, STU3N62K3's IPAK footprint, thermal profile, and gate protection differ significantly. Board redesign and thermal validation are required for substitution.

What is the safe operating area (SOA) limitation at 100 µs pulse width?

At 100 µs pulse width, the SOA limit for STU3N62K3 is approximately 2.7 A at 400 V (per Figure 1), constrained by both thermal limits and avalanche energy absorption. This corresponds to 108 mJ instantaneous power, closely matching its 100 mJ EAS rating. Exceeding this boundary risks single-pulse avalanche failure.

STU3N62K3 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
SuperMESH3™
Package/Case:
TO-251-3 Short Leads, IPAK, TO-251AA
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
620 V
Current - Continuous Drain (Id) @ 25°C:
2.7A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
2.5Ohm @ 1.4A, 10V
Vgs(th) (Max) @ Id:
4.5V @ 50µA
Gate Charge (Qg) (Max) @ Vgs:
13 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
385 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
45W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
IPAK

STU3N62K3 FAQ

1.How can I place an order for STU3N62K3 through Aetrix?

Please submit a Request for Quotation (RFQ) for STU3N62K3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STU3N62K3 reliable?

The price and inventory of STU3N62K3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STU3N62K3 is usually 5 days.

3.What payment methods are accepted for STU3N62K3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STU3N62K3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STU3N62K3?

STU3N62K3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STU3N62K3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STU3N62K3?

For technical support, including STU3N62K3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STU3N62K3 requirements.

6.How does Aetrix verify that STU3N62K3 is sourced from the original manufacturer or authorized distributors?

All STU3N62K3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STU3N62K3 meets industry standards.

7.What is the process for return or replacement of STU3N62K3?

All STU3N62K3 units undergo pre-shipment inspection (PSI). If there is an issue with STU3N62K3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STU3N62K3 part is unused and in its original packaging.

Return procedure for STU3N62K3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STU3N62K3 Tags

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