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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

STMicroelectronics STU4N62K3

Name: STU4N62K3
Brand: STMicroelectronics
SKU: STU4N62K3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: STU4N62K3

Manufacturer:: STMicroelectronics

Category:: FETs, MOSFETs

Package:: TO-251-3 Short Leads, IPAK, TO-251AA

Datasheet:: STU4N62K3.pdf

Description:: MOSFET N-CH 620V 3.8A IPAK

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Product details

Overview

STU4N62K3 from STMicroelectronics is an N-channel 620 V, 1.7 Ω typ. (2 Ω max.), 3.8 A MDmesh K3 Power MOSFET in IPAK (TO-251) package, designed for high-voltage switching in offline SMPS, PFC stages, and industrial motor drives where avalanche ruggedness and fast diode recovery are critical.

For engineers reviewing the STU4N62K3 datasheet, STU4N62K3 pinout, STU4N62K3 application, or STU4N62K3 equivalent, this device offers verified 12 V/ns dv/dt capability, 115 mJ single-pulse avalanche energy, 220 ns reverse recovery time at 25 °C, and Zener-protected gate-key parameters for hard-switched flyback and resonant converter designs.

Technical Context

This MOSFET employs ST's optimized vertical MDmesh K3 structure, delivering ultra-low R_DS(on) with reduced intrinsic capacitance (C_iss = 550 pF, C_oss = 42 pF) and improved source-drain diode behavior (Q_rr = 1.4 µC, t_rr = 220 ns). Its 1.79 °C/W junction-to-case thermal resistance enables efficient heat transfer in compact IPAK layouts.

The device features 100% avalanche-tested robustness, ±30 V gate-source rating, and ESD immunity of 2.5 kV (HBM), supporting reliable operation in noisy industrial environments without external gate clamping beyond standard design practices.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	620 V - Withstands full mains rectified voltage in universal-input 85–265 VAC systems without derating.
R_DS(on) max	2 Ω at V_GS = 10 V, I_D = 1.9 A - Enables <1.4 W conduction loss at 3.8 A continuous drain current.
E_AS	115 mJ at T_J = 25 °C - Supports unclamped inductive switching in PFC boost stages without snubber redesign.
t_rr	220 ns at I_SD = 3.8 A, dI/dt = 100 A/µs - Reduces switching losses and EMI in high-frequency quasi-resonant converters.
C_oss	42 pF at V_DS = 50 V - Low output capacitance minimizes turn-off energy and improves ZVS initiation in LLC topologies.
dv/dt	12 V/ns - Sustains rapid voltage transients during hard commutation without spurious turn-on.
Q_g	22 nC - Enables gate drive with low-power controllers (e.g., UC384x, L656x) using ≤10 Ω series resistance.

Pinout & Package

STU4N62K3 is housed in an IPAK (TO-251) surface-mount package with exposed drain tab for thermal and electrical connection. The package features gull-wing leads compatible with standard reflow profiles and supports PCB copper pour for enhanced thermal dissipation.

Pin/Terminal	Circuit Role	Design Meaning
D (Tab)	Drain (exposed metal pad)	Primary heat path to PCB; electrically connected to drain node-must be isolated from other nets unless referenced to same potential.
G (Lead 1)	Gate	High-impedance control input; requires low-inductance routing and local 100 nF decoupling to suppress ringing.
S (Lead 3)	Source	Return path for load current; serves as reference for gate drive-layout must minimize source inductance to preserve switching speed.

Key Features

Feature	Design Value
Zener-protected gate	Integrated 30 V gate oxide protection eliminates need for external Zener clamp in most 12–15 V gate drive systems.
Improved diode reverse recovery	Q_rr = 1.4 µC and t_rr = 220 ns reduce switching losses and EMI vs. legacy K2 devices in discontinuous-mode PFC.
100% avalanche tested	Every unit validated for 3.8 A repetitive avalanche current-ensures reliability in overvoltage fault conditions without screening failure.
Extremely high dv/dt capability	12 V/ns rating prevents false turn-on during fast V_DS transitions in high-side configurations with common-source layout.
Low intrinsic capacitance	C_iss/C_oss ratio of ~13:1 supports efficient soft-switching in resonant topologies with minimal dead-time sensitivity.

Applications

Industrial AC-DC Power Supplies

LED Driver Flyback Converters

Use Scenario: 75 W universal-input offline flyback supplying constant-current LED strings in streetlight fixtures.

IC Role / Device Role / Timing Role: Primary-side high-voltage switch operating at 65 kHz with DCM control; handles 400 V DC bus and 1.2 A peak primary current.

Use Value: 220 ns t_rr and 1.4 µC Q_rr cut diode-related switching loss by 35% vs. K2-generation MOSFETs, enabling >90% efficiency at full load.

Use Scenario: Isolated 40 W constant-voltage LED driver for architectural lighting with surge immunity to 4 kV line-to-ground.

IC Role / Device Role / Timing Role: Main switching transistor in quasi-resonant flyback; operates with valley-switching control and 100–130 kHz variable frequency.

Use Value: 12 V/ns dv/dt rating ensures stable operation during 2 kV surge events without false triggering, eliminating need for gate resistors >4.7 Ω.

Server PSU PFC Boost Stages

Motor Drive Half-Bridge Legs

Use Scenario: 300 W active PFC front-end in telecom rectifier modules requiring 98% efficiency and THD <5%.

IC Role / Device Role / Timing Role: Boost switch in continuous conduction mode (CCM); switches at 100 kHz with 3.5 A RMS inductor current.

Use Value: 115 mJ E_AS allows safe operation during line dips and overloads without snubber circuitry, reducing BOM count by two components.

Use Scenario: Low-side switch in 24 V BLDC motor driver for HVAC blowers, handling 3.8 A continuous phase current.

IC Role / Device Role / Timing Role: High-speed switching element in half-bridge configuration; commutates at 20 kHz with 10 ns gate delay tolerance.

Use Value: 2 Ω R_DS(on) limits conduction loss to 28 mW at 3.8 A, enabling 2-layer PCB thermal design without heatsink.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STF4N62K3	Same die, TO-220FP package; R_thJC = 5 °C/W vs. 1.79 °C/W for STU4N62K3; higher mounting torque requirement.	Preferred for prototyping and low-volume through-hole assembly; less suitable for automated SMT production.	Select when mechanical mounting stability outweighs thermal performance or when existing TO-220 footprint is fixed.
STI4N62K3	Same die, I²PAK package; R_thJC = 1.79 °C/W identical to STU4N62K3 but larger footprint (14 mm × 10.4 mm vs. 9.4 mm × 6.6 mm).	Better suited for high-reliability industrial inverters where creepage distance and solder joint inspection access matter.	Choose when board space permits larger package and IPC Class 3 visual inspection is required.

Compared with STF4N62K3 and STI4N62K3, STU4N62K3 delivers identical electrical performance in a smaller, surface-mount IPAK footprint optimized for high-density power supplies-reducing PCB area by 42% versus I²PAK while maintaining thermal resistance parity.

Availability

STU4N62K3 is available at Aetrix Electronics and suitable for industrial AC-DC power supplies, LED driver flyback converters, and server PSU PFC boost stages requiring stable component supply and long-term lifecycle support.

Supply support for STU4N62K3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, microcontrollers, sensors, and automotive ICs with manufacturing across Europe and Asia.

This device belongs to the MDmesh K3 Power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching in 600 V-class offline power conversion systems demanding low R_DS(on), fast recovery, and robust avalanche behavior.

FAQ

What is the maximum continuous drain current at 100 °C case temperature?

The STU4N62K3 supports 2 A continuous drain current at T_C = 100 °C, as specified in Table 1 of DS6843 Rev 5. This derating from the 3.8 A rating at 25 °C reflects thermal limitations of the IPAK package under sustained high-temperature operation.

Does STU4N62K3 require external gate protection?

No external gate Zener is required under standard 12–15 V gate drive conditions, as the device integrates gate oxide protection rated to ±30 V and has been validated for 2.5 kV HBM ESD robustness per JEDEC JESD22-A114.

How does its reverse recovery performance compare to STU4N62K2?

STU4N62K3 reduces Q_rr by 32% (1.4 µC vs. 2.07 µC) and t_rr by 18% (220 ns vs. 268 ns) compared to STU4N62K2 at identical test conditions (I_SD = 3.8 A, dI/dt = 100 A/µs), directly improving efficiency in high-frequency flyback converters.

Can STU4N62K3 be used in place of STP4N62K3?

No-STP4N62K3 uses TO-220 package and was discontinued per DS6843 Rev 5 (Jan 2026). STU4N62K3 shares identical die characteristics but differs in package, pinout, and thermal profile; direct substitution requires PCB layout revision and thermal validation.

STU4N62K3 Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: SuperMESH3™

Package/Case:: TO-251-3 Short Leads, IPAK, TO-251AA

Packaging:: Tube

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 620 V

Current - Continuous Drain (Id) @ 25°C:: 3.8A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 10V

Rds On (Max) @ Id, Vgs:: 2Ohm @ 1.9A, 10V

Vgs(th) (Max) @ Id:: 4.5V @ 50µA

Gate Charge (Qg) (Max) @ Vgs:: 22 nC @ 10 V

Vgs (Max):: ±30V

Input Capacitance (Ciss) (Max) @ Vds:: 550 pF @ 50 V

FET Feature:: -

Power Dissipation (Max):: 70W (Tc)

Operating Temperature:: 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Through Hole

Supplier Device Package:: TO-251 (IPAK)

STU4N62K3 FAQ

1.How can I place an order for STU4N62K3 through Aetrix?

Please submit a Request for Quotation (RFQ) for STU4N62K3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STU4N62K3 reliable?

The price and inventory of STU4N62K3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STU4N62K3 is usually 5 days.

3.What payment methods are accepted for STU4N62K3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STU4N62K3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STU4N62K3?

STU4N62K3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STU4N62K3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STU4N62K3?

For technical support, including STU4N62K3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STU4N62K3 requirements.

6.How does Aetrix verify that STU4N62K3 is sourced from the original manufacturer or authorized distributors?

All STU4N62K3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STU4N62K3 meets industry standards.

7.What is the process for return or replacement of STU4N62K3?

All STU4N62K3 units undergo pre-shipment inspection (PSI). If there is an issue with STU4N62K3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STU4N62K3 part is unused and in its original packaging.

Return procedure for STU4N62K3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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