STMicroelectronics STU5N60M2

Overview

STU5N60M2 from STMicroelectronics is an N-channel 600 V, 1.4 Ω max, 3.5 A power MOSFET in IPAK (TO-251) package, built on MDmesh™ M2 technology for high-efficiency flyback and PFC converters. It features 100% avalanche-tested ruggedness, Zener-protected gate, and low 8 nC total gate charge - enabling fast switching with reduced driver loss in offline SMPS.

For engineers reviewing the STU5N60M2 datasheet, STU5N60M2 pinout, STU5N60M2 application, or STU5N60M2 equivalent, key selection criteria include its 600 V V_DS, 1.4 Ω R_DS(on) at 10 V_GS, 8 nC Q_g, 1.6 V source-drain diode forward voltage, and IPAK thermal resistance of 2.8 °C/W junction-to-case - critical for compact, thermally constrained AC-DC designs.

Technical Context

This device employs ST's MDmesh™ M2 strip layout and optimized vertical structure to simultaneously reduce R_DS(on) and output capacitance (C_oss = 13 pF typ.), delivering superior figure-of-merit (R_DS(on) × Q_g = 11.2 Ω·nC). Its 15 V/ns diode recovery dv/dt rating and 50 V/ns MOSFET dv/dt ruggedness ensure reliable operation under hard-switching conditions.

The integrated Zener-protected gate withstands ±25 V transient stress, while the 100% unclamped inductive switching (UIS) test guarantees 0.5 A repetitive avalanche current and 80 mJ single-pulse energy handling - essential for overvoltage transients in boost and flyback topologies.

Key Specifications

Pinout & Package

STU5N60M2 is housed in IPAK (TO-251) package with exposed drain tab for thermal and electrical connection. The package provides 2.8 °C/W junction-to-case thermal resistance and supports surface-mount assembly with through-hole mechanical anchoring.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 600 V power MOSFET applications.

Compared with STP5N60M2 and STD5N60M2, STU5N60M2 offers identical electrical performance in a surface-mount IPAK package that balances PCB thermal dissipation and mechanical robustness - ideal for volume production of compact, sealed AC-DC modules requiring reflow compatibility and moderate heatsinking.

Availability

STU5N60M2 is available at Aetrix Electronics and suitable for AC-DC adapters, LED drivers, and industrial power supplies requiring stable component supply across multi-year production cycles.

Supply support for STU5N60M2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, microcontroller, power, and sensor solutions for automotive, industrial, and consumer markets.

STU5N60M2 belongs to the MDmesh™ M2 power MOSFET product line, engineered specifically for high-efficiency, high-voltage switching in offline SMPS - emphasizing low R_DS(on) × Q_g and rugged avalanche performance.

FAQ

What is the maximum continuous drain current for STU5N60M2 at 100 °C case temperature?

The maximum continuous drain current is 2.2 A at T_C = 100 °C, as specified in Table 1 of DS9958 Rev 5. This derating reflects thermal limits of the IPAK package and ensures safe operation within the SOA boundary at elevated temperatures without exceeding T_j = 150 °C.

Does STU5N60M2 include integrated gate protection?

Yes - STU5N60M2 integrates a Zener diode between gate and source, rated for ±25 V, providing inherent protection against gate oxide breakdown from ESD or switching transients. No external gate protection components are required for standard layouts.

How does the IPAK package compare thermally to TO-220 and DPAK for this device?

All three variants (STU5N60M2/IPAK, STP5N60M2/TO-220, STD5N60M2/DPAK) share identical die and junction-to-case thermal resistance of 2.8 °C/W. However, IPAK offers surface-mount reliability with mechanical anchoring, while TO-220 enables direct bolt-on heatsinking and DPAK maximizes PCB-conducted heat transfer on 1-inch² copper.

Can STU5N60M2 replace STP5N60M2 in an existing TO-220 footprint?

No - STU5N60M2 uses IPAK (TO-251), which has different pad layout, lead pitch, and mounting method than TO-220. Direct replacement requires PCB redesign. For drop-in compatibility, use STP5N60M2; for SMT migration, verify thermal performance using the same 2.8 °C/W R_th(j-c) but account for different PCB copper requirements.