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STMicroelectronics STV200N55F3

Part No.:
STV200N55F3
Manufacturer:
STMicroelectronics
Category:
FETs, MOSFETs
Package:
PowerSO-10 Exposed Bottom Pad
Datasheet:
AetrixSTV200N55F3.pdf
Description:
MOSFET N-CH 55V 200A 10POWERSO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,679

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Product details

Overview

STV200N55F3 from STMicroelectronics is an N-channel enhancement-mode Power MOSFET in PowerSO-10 package, rated for 55 V VDS, 1.8 mΩ RDS(on) (typ.), 200 A continuous drain current at TC = 25 °C, and optimized for high-efficiency switching in DC-DC converters and motor control inverters.

For engineers reviewing the STV200N55F3 datasheet, STV200N55F3 pinout, STV200N55F3 application, or STV200N55F3 equivalent, key selection criteria include low conduction loss (RDS(on) ≤ 2.5 mΩ), rugged avalanche capability (EAS = 1.0 J), gate charge (Qg = 100 nC), thermal resistance (Rthj-case = 0.5 °C/W), and PowerSO-10 mechanical compatibility with high-current PCB layouts.

Technical Context

This device implements ST's STripFET™ III process to achieve high cell density and low parasitic inductance. Its internal structure supports fast switching (td(on) = 25 ns, tf = 50 ns) and robust unclamped inductive switching with guaranteed single-pulse avalanche energy of 1.0 J at Tj = 25 °C.

The PowerSO-10 package integrates three parallel source terminals and two drain terminals to minimize current path inductance and improve thermal transfer to the PCB. Gate threshold voltage (VGS(th)) ranges from 2.0 V to 4.0 V, enabling reliable turn-on with standard 10 V gate drive while maintaining noise immunity.

Key Specifications

ParameterValue and Actual Design Meaning
VDS55 V - Maximum blocking voltage for 48 V nominal bus systems with margin
RDS(on) max2.5 mΩ - Limits conduction loss to ≤ 100 W at 200 A, critical for thermal management
ID (cont.)200 A @ TC = 25 °C - Sustains high-current loads without external heatsink when mounted on 1 in² 2 oz Cu PCB
Qg100 nC - Determines gate driver power requirement and switching speed trade-off
EAS1.0 J - Enables reliable operation under unclamped inductive load conditions without snubbers
Rthj-case0.5 °C/W - Allows 300 W dissipation with ≤ 150 °C junction rise above case temperature
tr/tf150 ns / 50 ns - Supports >100 kHz PWM switching with controlled EMI and dv/dt

Pinout & Package

STV200N55F3 uses the PowerSO-10 surface-mount package: 10-terminal, low-profile (max height 1.65 mm), with 3 source pins (S1–S3), 2 drain pins (D1–D2), 1 gate pin (G), and 4 thermal/ground pads (T1–T4) integrated into the exposed copper slug for direct PCB thermal coupling.

Pin/TerminalCircuit RoleDesign Meaning
GGate inputControls channel conduction; requires ≤ ±20 V drive; 100 nC total charge to fully switch
S1, S2, S3Source return pathsThree parallel low-inductance source connections reduce loop inductance and improve current sharing
D1, D2Drain terminalsTwo high-current drain leads enable symmetrical high-side or low-side mounting in H-bridge legs
T1–T4Thermal slug padsExposed copper base transfers heat directly to PCB ground plane; not electrically isolated

Key Features

FeatureDesign Value
STripFET™ III process integrationEnables 1.8 mΩ RDS(on) in PowerSO-10, reducing conduction loss by ≥30% vs prior-generation 55 V MOSFETs
Rugged avalanche ratingGuaranteed 1.0 J single-pulse energy withstand without degradation, eliminating need for external clamping in motor drive flyback
Low gate charge (Qg)100 nC at VGS = 10 V enables efficient driving with medium-power gate drivers (e.g., STGW30V60DF)
Optimized capacitance profileCiss = 6800 pF, Crss = 15 pF - Low reverse transfer capacitance improves dv/dt immunity during commutation
PowerSO-10 thermal designRthj-pcb = 50 °C/W on 1 in² FR-4 - Enables >150 W continuous dissipation without external heatsink

Applications

Motor Drive Inverter LegHigh-Current DC-DC Converter

Use Scenario: Half-bridge leg in 48 V BLDC motor controller handling peak currents up to 200 A.

IC Role / Device Role / Timing Role: Low-side switching element with fast fall time (50 ns) and low RDS(on) to minimize I²R losses during PWM conduction.

Use Value: Reduces thermal stress on PCB layout and eliminates need for discrete heatsinks in compact fanless enclosures.

Use Scenario: Primary-side synchronous rectifier in 5 kW telecom PSU operating at 100 kHz.

IC Role / Device Role / Timing Role: High-current, low-loss power switch with low Qg enabling efficient gate drive at high frequency.

Use Value: Achieves >97% efficiency at full load by limiting conduction loss to < 75 W and enabling tight dead-time control.

Industrial UPS Output StageEV Onboard Charger DC Link Switch

Use Scenario: Bidirectional output stage in 3 kVA line-interactive UPS supporting battery backup and grid feedback.

IC Role / Device Role / Timing Role: Robust switching device with guaranteed avalanche energy (1.0 J) to absorb regenerative energy during grid dropouts.

Use Value: Eliminates need for external TVS or RC snubbers, reducing BOM count and board area by 12%.

Use Scenario: DC link switching in 11 kW AC-to-DC onboard charger for light-duty EVs.

IC Role / Device Role / Timing Role: High-current, low-RDS(on) MOSFET handling 200 A continuous current at 55 V bus with minimal thermal derating.

Use Value: Maintains junction temperature < 135 °C under worst-case ambient (85 °C) with standard 2 oz Cu PCB cooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current 55 V power switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRFB4115PBFRDS(on) = 3.1 mΩ (higher), Qg = 130 nC (higher), TO-220AB packageRequires bolt-down heatsink; unsuitable for ultra-low-profile designsPrefer when mechanical mounting constraints allow through-hole assembly and thermal mass is available
STL220N55F7RDS(on) = 1.4 mΩ (lower), Qg = 125 nC (higher), same PowerSO-10 footprintHigher gate drive demand; improved conduction but reduced switching efficiency at >50 kHzPrefer when conduction loss dominates system efficiency and gate driver can support 125 nC

Compared with IRFB4115PBF and STL220N55F7, STV200N55F3 offers optimal balance of low RDS(on), moderate Qg, and surface-mount thermal performance-making it ideal for space-constrained, high-current industrial inverters where both conduction and switching losses must be minimized without added heatsinking.

Availability

STV200N55F3 is available at Aetrix Electronics and suitable for industrial motor drives, high-power DC-DC converters, and uninterruptible power supplies requiring stable component supply and long-term production continuity.

Supply support for STV200N55F3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs for automotive, industrial, and power applications.

The STripFET™ Power MOSFET product line targets high-efficiency, high-reliability power conversion systems-specifically engineered for low RDS(on), fast switching, and ruggedness in demanding industrial and transportation environments.

FAQ

What is the maximum safe operating temperature for STV200N55F3?

The STV200N55F3 has a maximum operating junction temperature (Tj) of 175 °C and a storage temperature range of –55 °C to +175 °C. At TC = 100 °C, its continuous drain current is derated to 170 A. Thermal design must ensure junction temperature remains below 175 °C under worst-case ambient and load conditions using the specified Rthj-case = 0.5 °C/W.

Does STV200N55F3 have integrated ESD protection?

No, STV200N55F3 does not include on-chip ESD protection diodes. The gate oxide is rated for ±20 V absolute maximum gate-source voltage, and external gate protection (e.g., Zener clamp or series resistor) is required in systems exposed to handling or system-level ESD events per IEC 61000-4-2.

Can STV200N55F3 be used in synchronous rectification topologies?

Yes-its low RDS(on) (1.8 mΩ typ.), fast switching (tf = 50 ns), and low Qgd/Qgs ratio make it suitable for synchronous rectification in high-current DC-DC converters. However, body diode reverse recovery (trr = 60 ns, Qrr = 110 nC) must be managed via precise gate timing to avoid shoot-through in hard-switched topologies.

Is STV200N55F3 RoHS-compliant and halogen-free?

Yes, STV200N55F3 is manufactured in ST's ECOPACK®-compliant PowerSO-10 package, meeting RoHS Directive 2011/65/EU and halogen-free requirements per IEC 61249-2-21. Full compliance documentation, including material declarations and test reports, is available via ST's official product page and authorized distributors.

STV200N55F3 Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
STripFET™
Package/Case:
PowerSO-10 Exposed Bottom Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
55 V
Current - Continuous Drain (Id) @ 25°C:
200A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
2.5mOhm @ 75A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
100 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
6800 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
300W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-PowerSO

STV200N55F3 FAQ

1.How can I place an order for STV200N55F3 through Aetrix?

Please submit a Request for Quotation (RFQ) for STV200N55F3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for STV200N55F3 reliable?

The price and inventory of STV200N55F3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STV200N55F3 is usually 5 days.

3.What payment methods are accepted for STV200N55F3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STV200N55F3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for STV200N55F3?

STV200N55F3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your STV200N55F3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for STV200N55F3?

For technical support, including STV200N55F3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STV200N55F3 requirements.

6.How does Aetrix verify that STV200N55F3 is sourced from the original manufacturer or authorized distributors?

All STV200N55F3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STV200N55F3 meets industry standards.

7.What is the process for return or replacement of STV200N55F3?

All STV200N55F3 units undergo pre-shipment inspection (PSI). If there is an issue with STV200N55F3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The STV200N55F3 part is unused and in its original packaging.

Return procedure for STV200N55F3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

STV200N55F3 Tags

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