STMicroelectronics STW26NM60ND
- Part No.:
- STW26NM60ND
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-247-3
- Datasheet:
-
STW26NM60ND.pdf
- Description:
- MOSFET N-CH 600V 21A TO247
- Quantity:
- Payment:

- Shipping:

Inventory:9,254
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STW26NM60ND from STMicroelectronics is an N-channel 600 V, 0.145 Ω typ. RDS(on), 21 A FDmesh™ II Power MOSFET in TO-247 package, featuring intrinsic fast-recovery body diode and 100% avalanche tested ruggedness. It delivers low gate charge (54.6 nC), high dv/dt immunity (40 V/ns), and is engineered for high-efficiency bridge topologies and ZVS phase-shift converters in industrial SMPS.
For engineers reviewing the STW26NM60ND datasheet, STW26NM60ND pinout, STW26NM60ND application, or STW26NM60ND equivalent, this page provides verified electrical ratings, thermal resistance (Rthj-case = 0.66 °C/W), diode recovery performance (Qrr = 1.39 µC @ TJ = 25 °C), and real-world switching behavior (td(off) = 69 ns) - all critical for hard-switched PFC and resonant converter design.
Technical Context
This MOSFET employs ST's second-generation MDmesh™ strip-layout vertical structure to achieve ultra-low on-resistance and superior switching efficiency. Its integrated fast-recovery body diode enables reliable operation in synchronous rectification and bidirectional power flow without external diodes.
The device supports high-voltage hard switching with guaranteed 40 V/ns dv/dt ruggedness and 100 mJ single-pulse avalanche energy. Thermal design is enabled by low junction-to-case resistance (0.66 °C/W) and a TO-247 package optimized for heatsink mounting and high-power dissipation (PTOT = 190 W at TC = 25 °C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - Supports primary-side switching in 400 V AC-input offline SMPS without derating. |
| RDS(on) typ. | 0.145 Ω - Enables <1.5 W conduction loss at 10.5 A DC, reducing thermal load in continuous conduction mode. |
| Qg | 54.6 nC - Low gate drive energy requirement simplifies gate driver selection and reduces switching losses in high-frequency designs. |
| td(off) | 69 ns - Fast turn-off supports >100 kHz operation in phase-shifted full-bridge topologies. |
| Qrr | 1.39 µC (TJ = 25 °C) - Minimizes diode reverse recovery loss and EMI in bridge-leg commutation. |
| Rthj-case | 0.66 °C/W - Allows direct heatsink mounting for efficient thermal management up to 190 W power dissipation. |
| EAS | 100 mJ - Withstands unclamped inductive switching events common in motor drives and UPS systems. |
Pinout & Package
STW26NM60ND is housed in a TO-247 package with isolated tab (drain-connected), optimized for high-power thermal and electrical performance. The three-terminal configuration supports standard high-current PCB layout and mechanical mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control input | Receives 10 V logic-level gate drive; low 2.5 Ω intrinsic gate resistance ensures stable switching waveform integrity. |
| 2 (Drain) | High-voltage power output | Connected to internal die backside and metal tab; requires insulated mounting when heatsink is grounded. |
| 3 (Source) | Power return / reference node | Serves as local ground reference for gate drive; low-inductance source connection critical for minimizing voltage spikes during dI/dt transients. |
Key Features
| Feature | Design Value |
|---|---|
| 100% avalanche tested | Guarantees robustness against transient overvoltage events without derating, eliminating need for external snubbers in many applications. |
| Low Ciss/Coss/Crss | 1817 pF / 90 pF / 4.4 pF - Reduces Miller effect and improves controllability during high-dv/dt transitions in bridge configurations. |
| Intrinsic fast-recovery body diode | trr = 170 ns, Qrr = 1.39 µC - Enables zero-voltage switching in LLC and phase-shifted topologies without external diode replacement. |
| High dv/dt ruggedness | 40 V/ns - Prevents false turn-on during rapid voltage transients across drain-source, critical for half-bridge leg reliability. |
| FDmesh™ II technology | Strip-layout vertical structure - Achieves 0.145 Ω RDS(on) at 600 V while maintaining low gate charge and high SOA margin. |
Applications
| Industrial Switch-Mode Power Supplies | Phase-Shifted Full-Bridge Converters |
|---|---|
|
Use Scenario: Primary-side switch in 1–3 kW telecom and server PSUs operating from 380–400 V DC bus. IC Role / Device Role / Timing Role: High-side/low-side switching element handling 21 A continuous current with ZVS capability. Use Value: Low RDS(on) and fast td(off) reduce conduction and switching losses, enabling >95% efficiency at full load. |
Use Scenario: Bridge-leg MOSFET in isolated DC–DC converters for EV charging stations and renewable energy inverters. IC Role / Device Role / Timing Role: Hard- and soft-switched power switch with body-diode commutation during dead-time intervals. Use Value: Intrinsic fast-recovery diode eliminates need for discrete SiC Schottky, lowering BOM cost and layout complexity. |
| Uninterruptible Power Supplies | Motor Drive Inverters |
|
Use Scenario: Output stage switch in double-conversion online UPS systems requiring high reliability under overload and short-circuit conditions. IC Role / Device Role / Timing Role: Main inverter switch subjected to repetitive avalanche stress during battery-mode transfer events. Use Value: 100 mJ EAS rating and 40 V/ns dv/dt immunity ensure fail-safe operation without additional protection circuitry. |
Use Scenario: Inverter leg switch in HVAC compressors and industrial servo drives operating at 10–20 kHz PWM frequency. IC Role / Device Role / Timing Role: High-voltage, high-current switching device managing regenerative braking energy via body diode conduction. Use Value: Low Qrr and controlled trr minimize shoot-through risk and reduce EMI generation during commutation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPP60R190C7 | 650 V, 0.190 Ω RDS(on), 21 A, TO-247, CoolMOS™ C7 - higher RDS(on), lower Qg (43 nC) | Lower gate charge enables faster switching but higher conduction loss at high DC current | Preferable where switching loss dominates (e.g., >200 kHz resonant converters); less suitable for high-current PFC stages. |
| IXFH50N60P | 600 V, 0.120 Ω RDS(on), 50 A, TO-247, HiPerFET™ - lower RDS(on), higher ID, no intrinsic fast diode | Requires external anti-parallel diode for bidirectional conduction; higher thermal mass | Better for pure hard-switched applications with external diode control; unsuitable where body-diode recovery is critical (e.g., ZVS). |
Compared with IPP60R190C7 and IXFH50N60P, STW26NM60ND uniquely balances low RDS(on), fast body-diode recovery, and proven avalanche ruggedness - making it optimal for bridge-based topologies where both conduction efficiency and commutation reliability are simultaneously required.
Availability
STW26NM60ND is available at Aetrix Electronics and suitable for industrial switch-mode power supplies, phase-shifted full-bridge converters, and uninterruptible power supplies requiring stable component supply and long-term production continuity.
Supply support for STW26NM60ND includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, digital, and mixed-signal ICs and discrete power devices for industrial, automotive, and consumer markets.
STW26NM60ND belongs to ST's FDmesh™ II Power MOSFET product line, developed specifically for high-efficiency, high-reliability power conversion in industrial SMPS, UPS, and motor drives - emphasizing ruggedness, low loss, and integration of fast-recovery diode functionality.
FAQ
What is the maximum continuous drain current for STW26NM60ND at case temperature 100 °C?
The maximum continuous drain current (ID) is 13 A at TC = 100 °C, as specified in Table 2 of the official datasheet. This rating reflects thermal limitation due to junction-to-case thermal resistance (0.66 °C/W) and maximum junction temperature (150 °C), not package current-carrying capacity alone.
Does STW26NM60ND have a built-in body diode, and what are its key recovery parameters?
Yes, STW26NM60ND features an intrinsic fast-recovery body diode. At TJ = 25 °C, ISD = 21 A, VDD = 60 V, and di/dt = 100 A/µs, its reverse recovery time (trr) is 170 ns and reverse recovery charge (Qrr) is 1.39 µC, per Table 7 in the datasheet.
Can STW26NM60ND be used in avalanche mode, and what is its rated single-pulse energy?
Yes - STW26NM60ND is 100% avalanche tested. Its single-pulse avalanche energy (EAS) is 100 mJ when starting from TJ = 25 °C, ID = IAS, and VDD = 50 V, as defined in Table 4. This rating applies to unclamped inductive switching events within safe operating area limits.
What is the gate threshold voltage range, and how does it vary with temperature?
VGS(th) is specified from 3 V to 5 V (min to max) at TC = 25 °C and ID = 250 µA. Figure 14 shows normalized on-resistance vs. temperature, and Figure 17 confirms VGS(th) decreases with rising junction temperature - typical drift is –3.5 mV/°C, consistent with silicon MOSFET physics.
STW26NM60ND Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- FDmesh™ II
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 21A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 175mOhm @ 10.5A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 54.6 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1817 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 190W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247-3
STW26NM60ND FAQ
1.How can I place an order for STW26NM60ND through Aetrix?
Please submit a Request for Quotation (RFQ) for STW26NM60ND on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STW26NM60ND reliable?
The price and inventory of STW26NM60ND are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STW26NM60ND is usually 5 days.
3.What payment methods are accepted for STW26NM60ND?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STW26NM60ND transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STW26NM60ND?
STW26NM60ND orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STW26NM60ND order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STW26NM60ND?
For technical support, including STW26NM60ND datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STW26NM60ND requirements.
6.How does Aetrix verify that STW26NM60ND is sourced from the original manufacturer or authorized distributors?
All STW26NM60ND products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STW26NM60ND meets industry standards.
7.What is the process for return or replacement of STW26NM60ND?
All STW26NM60ND units undergo pre-shipment inspection (PSI). If there is an issue with STW26NM60ND, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STW26NM60ND part is unused and in its original packaging.
Return procedure for STW26NM60ND:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STW26NM60ND Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

