STMicroelectronics STW28NM50N
- Part No.:
- STW28NM50N
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-247-3
- Datasheet:
-
STW28NM50N.pdf
- Description:
- MOSFET N-CH 500V 21A TO247-3
- Quantity:
- Payment:

- Shipping:

Inventory:510
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STW28NM50N from STMicroelectronics is an N-channel 500 V, 135 mΩ typ. (158 mΩ max), 21 A MDmesh™ II Power MOSFET in TO-247 package, designed for high-efficiency hard-switched and resonant power converters. It delivers low gate charge (50 nC), low input capacitance (1735 pF), and 100% avalanche-tested ruggedness, enabling use in industrial SMPS, solar inverters, and UPS systems where high voltage blocking and fast switching are critical.
For engineers reviewing the STW28NM50N datasheet, STW28NM50N pinout, STW28NM50N application, or STW28NM50N equivalent, key selection criteria include its 500 V VDS, 135 mΩ RDS(on) at 10 VGS, 50 nC total gate charge, 150 W PTOT at TC = 25 °C, and TO-247 thermal resistance of 0.83 °C/W (RthJC), all verified per DS6813 Rev 3.
Technical Context
This device employs ST's second-generation MDmesh™ vertical strip architecture to minimize conduction and switching losses simultaneously. Its 1735 pF Ciss, 4.3 pF Crss, and 50 nC Qg support high-frequency operation up to 100 kHz in LLC and phase-shifted full-bridge topologies.
The integrated body diode features 326 ns trr and 5 µC Qrr at 25 °C (376 ns / 6.2 µC at 150 °C), enabling reliable operation in synchronous rectification and freewheeling roles without external Schottky supplementation in medium-power designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 500 V - Enables direct interface with 400 V DC bus systems without derating in industrial AC/DC front-ends. |
| RDS(on) max | 158 mΩ at VGS = 10 V, ID = 10.5 A - Ensures <1.7 W conduction loss at 10.5 A, supporting compact heatsink design. |
| Qg | 50 nC - Reduces gate drive power requirement and enables use with standard 1–2 A peak gate drivers (e.g., STGAP2S). |
| td(off) | 62 ns - Supports clean turn-off in high-dV/dt environments (e.g., >10 V/ns) without shoot-through risk in half-bridge configurations. |
| EAS | 300 mJ single-pulse avalanche energy - Allows safe operation under unclamped inductive switching (UIS) events in motor drives and PFC stages. |
| RthJC | 0.83 °C/W - Delivers 150 W continuous power dissipation capability with minimal junction-to-case temperature rise under forced-air cooling. |
| ID @ TC = 100 °C | 13 A - Specifies usable current derating for sealed enclosures or ambient temperatures up to 85 °C. |
Pinout & Package
STW28NM50N uses the TO-247 package - a through-hole, isolated-tab power package with industry-standard mounting and thermal interface compatibility. The tab is electrically connected to the drain (D), enabling direct heatsink attachment with electrical isolation via insulating pads or mica washers.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Lead) | Gate (G) | High-impedance control terminal requiring <50 nC charge for full enhancement; sensitive to ESD and layout-induced ringing. |
| 2 (Tab) | Drain (D) | Main high-voltage power terminal; electrically tied to metal tab - must be isolated from heatsink unless system ground reference permits. |
| 3 (Lead) | Source (S) | Power return path and gate reference node; requires low-inductance PCB routing to minimize switching oscillation and Miller feedback. |
Key Features
| Feature | Design Value |
|---|---|
| 100% avalanche tested | Guarantees robustness against unclamped inductive switching events up to 300 mJ, eliminating need for external snubbers in PFC and flyback designs. |
| Low gate charge (50 nC) | Reduces driver IC power consumption and allows use of cost-effective gate drivers without active Miller clamping circuitry. |
| Low input capacitance (1735 pF) | Minimizes capacitive loading on gate drivers and improves immunity to dV/dt-induced false turn-on in high-noise industrial environments. |
| MDmesh™ II vertical structure | Delivers 135 mΩ RDS(on) at 500 V - 25% lower on-resistance than first-gen 500 V MOSFETs, directly improving efficiency in 1–3 kW converters. |
| Fast body diode (trr = 326 ns) | Enables reliable freewheeling in hard-switched topologies without cross-conduction issues, reducing need for external anti-parallel diodes. |
Applications
| Industrial Switch-Mode Power Supplies | Solar DC Optimizers |
|---|---|
|
Use Scenario: Primary-side switch in 1.5 kW telecom rectifier with universal AC input and 400 V DC output. IC Role / Device Role / Timing Role: High-voltage N-channel switching element operating at 70 kHz in continuous conduction mode (CCM) PFC + LLC resonant stage. Use Value: 135 mΩ RDS(on) and 50 nC Qg reduce total losses by ~1.2 W vs. legacy 500 V MOSFETs, enabling 96.3% peak efficiency at full load. |
Use Scenario: DC-DC buck converter in module-level power electronics (MLPE) for residential PV arrays. IC Role / Device Role / Timing Role: Synchronous rectifier and main switch in 60 Vin/12 Vout 250 W isolated flyback with active clamp. Use Value: 326 ns reverse recovery time and low Qrr prevent secondary-side diode oscillation, eliminating need for RC snubbers and reducing BOM count by two components. |
| Uninterruptible Power Supplies (UPS) | Motor Drive Inverters (HVAC) |
|
Use Scenario: Half-bridge in-line inverter stage converting 380 V DC battery bank to 230 V AC output in online double-conversion UPS. IC Role / Device Role / Timing Role: High-side and low-side switching device in 10 kHz PWM-controlled H-bridge with dead-time control. Use Value: 100% avalanche rating ensures survival during short-circuit faults and grid transients, meeting UL 1778 fault tolerance requirements without additional protection circuitry. |
Use Scenario: Phase-leg switch in 3-phase 7.5 kW HVAC inverter driving permanent magnet motor at 4 kHz carrier frequency. IC Role / Device Role / Timing Role: Main power switch handling 18 A RMS phase current with 84 A pulsed peak IDM capability. Use Value: 0.83 °C/W RthJC enables direct mounting to aluminum heatsink with <15 °C junction rise at full load, avoiding forced-air cooling and reducing system acoustic noise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP28NM50N | Same die, TO-220 package; RthJC = 0.83 °C/W but lower PTOT (35 W vs. 150 W); no isolated tab. | Lower-cost alternative for <100 W designs where heatsinking is constrained and isolation not required. | Select when board space is limited and thermal budget allows higher case temperature rise; avoid in >120 W continuous operation. |
| IPP60R190C7 | 600 V, 190 mΩ, 17 A, CoolMOS™ C7; 35 nC Qg, but higher VDS rating and different SOA curve. | Better suited for 600 V mains-fed applications; lower gate charge reduces driver stress but higher RDS(on) increases conduction loss at 400 V bus. | Prefer for 600 V designs or where ultra-low Qg dominates over on-resistance; verify UIS capability - not 100% avalanche tested per datasheet. |
Compared with STW28NM50N, STP28NM50N trades package isolation and power handling for lower cost and footprint, while IPP60R190C7 offers higher voltage margin and lower gate drive demand at the expense of conduction efficiency and avalanche ruggedness in 400–450 V systems.
Availability
STW28NM50N is available at Aetrix Electronics and suitable for industrial SMPS, solar DC optimizers, UPS inverters, and HVAC motor drives requiring stable component supply across multi-year production cycles.
Supply support for STW28NM50N includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, microcontrollers, sensors, and automotive ICs, with manufacturing in Europe and Asia.
STW28NM50N belongs to the MDmesh™ II Power MOSFET product line, engineered specifically for high-efficiency, high-reliability industrial and renewable energy power conversion systems operating at 400–500 V DC bus levels.
FAQ
What is the maximum continuous drain current for STW28NM50N at 100 °C case temperature?
The maximum continuous drain current is 13 A when the case temperature (TC) is maintained at 100 °C, as specified in Table 1 of DS6813 Rev 3. This rating is thermally limited by the 150 °C maximum junction temperature and the TO-247 package's 0.83 °C/W RthJC. Operation above this current requires active cooling or derating to ensure TJ ≤ 150 °C.
Does STW28NM50N have an integrated body diode, and what are its key recovery parameters?
Yes, STW28NM50N includes a monolithic source-drain body diode. At TJ = 25 °C, it exhibits 326 ns reverse recovery time (trr), 5 µC reverse recovery charge (Qrr), and 30 A peak reverse recovery current (IRRM) under ISD = 21 A, di/dt = 100 A/µs, and VDD = 400 V conditions. These values increase to 376 ns and 6.2 µC at 150 °C junction temperature.
Can STW28NM50N be used in avalanche mode, and what is its rated single-pulse energy?
Yes - STW28NM50N is 100% production-tested for avalanche capability. Its single-pulse avalanche energy (EAS) is rated at 300 mJ when starting from TJ = 25 °C, with IAR = 7.5 A and VDD = 50 V. This enables robust operation during unclamped inductive switching events common in PFC and motor drive circuits without external protection.
What is the gate threshold voltage range, and how does it vary with temperature?
The gate threshold voltage (VGS(th)) is specified from 2 V (min) to 4 V (max) at 25 °C, with typical value of 3 V. As shown in Figure 13 of DS6813 Rev 3, VGS(th) decreases with rising temperature - normalized to ~0.8× at 150 °C - ensuring predictable turn-on behavior across the full –55 °C to 150 °C operating range without thermal runaway.
STW28NM50N Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- MDmesh™ II
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 500 V
- Current - Continuous Drain (Id) @ 25°C:
- 21A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 158mOhm @ 10.5A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 50 nC @ 10 V
- Vgs (Max):
- ±25V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1735 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 150W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247-3
STW28NM50N FAQ
1.How can I place an order for STW28NM50N through Aetrix?
Please submit a Request for Quotation (RFQ) for STW28NM50N on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STW28NM50N reliable?
The price and inventory of STW28NM50N are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STW28NM50N is usually 5 days.
3.What payment methods are accepted for STW28NM50N?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STW28NM50N transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STW28NM50N?
STW28NM50N orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STW28NM50N order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STW28NM50N?
For technical support, including STW28NM50N datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STW28NM50N requirements.
6.How does Aetrix verify that STW28NM50N is sourced from the original manufacturer or authorized distributors?
All STW28NM50N products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STW28NM50N meets industry standards.
7.What is the process for return or replacement of STW28NM50N?
All STW28NM50N units undergo pre-shipment inspection (PSI). If there is an issue with STW28NM50N, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STW28NM50N part is unused and in its original packaging.
Return procedure for STW28NM50N:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STW28NM50N Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

