Toshiba Semiconductor and Storage TK090N65Z,S1F
- Part No.:
- TK090N65Z,S1F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- TO-247-3
- Datasheet:
-
TK090N65Z,S1F.pdf
- Description:
- MOSFET N-CH 650V 30A TO247
- Quantity:
- Payment:

- Shipping:

Inventory:26
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Product details
Overview
TK090N65Z,S1F from Toshiba Electronic Devices & Storage Corporation is a silicon N-channel DTMOS™ IV superjunction MOSFET designed for high-efficiency, high-voltage switching in power conversion stages. It delivers RDS(ON) = 0.075 Ω (typ.), 650 V VDSS, and 30 A ID (DC) in a TO-247 package, targeting primary-side switches in industrial AC-DC SMPS and PFC circuits.
For engineers reviewing the TK090N65Z,S1F datasheet, TK090N65Z,S1F pinout, TK090N65Z,S1F application, or TK090N65Z,S1F equivalent, key selection criteria include avalanche ruggedness (EAS = 265 mJ), low gate charge (Qg = 47 nC), diode reverse recovery performance (trr = 330 ns), and thermal resistance (Rth(ch-c) = 0.543 °C/W).
Technical Context
The TK090N65Z,S1F implements Toshiba's DTMOS™ IV process with optimized cell pitch and deep-trench structure to reduce specific on-resistance while maintaining fast switching. Its enhancement-mode operation (Vth = 3–4 V) enables direct drive from standard 10 V gate drivers, and its low Ciss (2780 pF) and Crss (2 pF) support high-frequency operation up to 100 kHz in hard-switched topologies.
Integrated body diode characteristics-VDSF = −1.7 V (max), Qrr = 5.1 µC, and dv/dt ruggedness ≥50 V/ns-are specified under realistic conditions (IDR = 30 A, −dIDR/dt = 100 A/µs), enabling reliable operation in discontinuous conduction mode (DCM) PFC and resonant LLC secondary-side synchronous rectification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 650 V - supports 400 VAC input systems with 2× safety margin for surge and ringing |
| RDS(ON) | 0.075 Ω (typ.) - reduces conduction loss to ≤17 W at 30 A, enabling compact heatsink design |
| Qg | 47 nC - minimizes gate drive power and allows use of low-power isolated gate drivers |
| EAS | 265 mJ - withstands single-pulse inductive energy without failure in flyback or forward converters |
| trr | 330 ns - limits diode reverse recovery loss and EMI generation in high-frequency PFC stages |
| Rth(ch-c) | 0.543 °C/W - enables 230 W power dissipation at Tc = 25 °C, supporting high-power density layouts |
| dv/dt ruggedness | ≥120 V/ns - prevents false turn-on during high-slew-rate switching transients in bridge configurations |
Pinout & Package
TK090N65Z,S1F is housed in a TO-247 (JEITA SC-65 / Toshiba 2-16L1A) package with isolated tab (Drain-connected heatsink). The case is electrically tied to Drain, requiring insulated mounting hardware in floating-source applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Lead) | Gate | High-impedance control terminal; requires <1 µA leakage current handling and ESD-safe PCB layout |
| 2 (Tab) | Drain (Heatsink) | Main high-voltage power path and thermal interface; must be electrically isolated from chassis unless system ground-referenced |
| 3 (Lead) | Source | Return path for load current and reference node for gate drive; connects to low-side driver return or shunt resistor |
Key Features
| Feature | Design Value |
|---|---|
| DTMOS™ IV trench-gate structure | Reduces RDS(ON) × area by 35% vs. prior DTMOS III, improving power density in space-constrained PSUs |
| Low Crss (2 pF) | Minimizes Miller effect, enabling stable 100 kHz+ operation without external Miller clamp or negative gate voltage |
| Guaranteed avalanche capability | Rated for single-pulse EAS = 265 mJ at Tch = 25 °C - eliminates need for external snubbers in inductive load switching |
| RoHS-compliant marking | Underlined Lot No. indicates [[G]]/RoHS COMPATIBLE - meets EU Directive 2011/65/EU without lead exemptions |
| ESD-sensitive handling | Class 1C per JESD22-A114 - requires grounded workstations, ionizers, and shielded packaging during assembly |
Applications
| Industrial AC-DC Power Supplies | Server & Telecom Rectifiers |
|---|---|
Use Scenario: Primary-side switch in 1–3 kW offline flyback or forward converters with universal AC input (90–264 VAC). IC Role / Device Role / Timing Role: High-voltage power switch controlling energy transfer into transformer primary winding during PWM on-time. Use Value: Low RDS(ON) and high EAS reduce conduction loss and improve surge immunity, extending MTBF in 24/7 datacenter power systems. | Use Scenario: Active clamp forward or LLC resonant converter primary switch in 48 V intermediate bus supplies. IC Role / Device Role / Timing Role: Synchronized high-side switch operating at 100–300 kHz with zero-voltage switching (ZVS) assist. Use Value: Low Ciss and Crss enable reliable ZVS across full load range, reducing switching loss by ≥22% vs. legacy 650 V MOSFETs. |
| Industrial Motor Drives | PFC Boost Stages |
Use Scenario: Inverter leg switch in 3–7.5 kW variable frequency drives (VFDs) for pumps and compressors. IC Role / Device Role / Timing Role: Half-bridge high-side or low-side switch modulating motor phase voltage via 6–16 kHz PWM. Use Value: Avalanche rating and dv/dt ruggedness prevent shoot-through failures during bus overvoltage events caused by regenerative braking. | Use Scenario: Boost switch in continuous conduction mode (CCM) PFC front-end for industrial UPS and welding equipment. IC Role / Device Role / Timing Role: Unidirectional current switch shaping input current waveform to match sinusoidal voltage. Use Value: Fast trr and low Qrr minimize diode reverse recovery loss, achieving >98.2% PFC efficiency at full load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW65N60DM6 | 600 V VDSS, RDS(ON) = 0.065 Ω, Qg = 52 nC, TO-247 package | Limited to 400 VAC systems; lower voltage margin than TK090N65Z,S1F in surge-prone environments | Select when cost sensitivity outweighs 50 V headroom requirement and gate drive power budget permits +5 nC increase |
| IXTH72N65X2 | 650 V VDSS, RDS(ON) = 0.052 Ω, Qg = 105 nC, TO-247 package | Higher gate charge increases driver complexity and switching loss; superior conduction efficiency only above 45 A | Prefer for ultra-high-efficiency designs where conduction loss dominates and gate drive capability supports 105 nC |
Compared with STW65N60DM6 and IXTH72N65X2, the TK090N65Z,S1F offers optimal balance of voltage margin, gate drive simplicity, and thermal performance for 1–3 kW industrial SMPS-delivering 0.075 Ω on-resistance with 47 nC gate charge and guaranteed 265 mJ avalanche energy.
Availability
TK090N65Z,S1F is available at Aetrix Electronics and suitable for industrial AC-DC power supplies, server rectifiers, and PFC boost stages requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for TK090N65Z,S1F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and storage solutions with emphasis on reliability, efficiency, and industrial-grade robustness.
The TK090N65Z,S1F belongs to Toshiba's DTMOS™ IV superjunction MOSFET product line, engineered specifically for high-efficiency, high-reliability switching power supplies in industrial, telecom, and renewable energy applications.
FAQ
What is the maximum continuous drain current for TK090N65Z,S1F at Tc = 25 °C?
The TK090N65Z,S1F supports 30 A DC drain current at case temperature Tc = 25 °C, derating linearly to zero at Tc = 105 °C per the absolute maximum ratings table. This rating assumes proper heatsinking and adherence to Rth(ch-c) = 0.543 °C/W thermal path. Exceeding this current without thermal mitigation risks channel temperature exceeding 150 °C.
Does TK090N65Z,S1F have an integrated body diode, and what are its key parameters?
Yes, the TK090N65Z,S1F includes a monolithic body diode with VDSF = −1.7 V (max) at IDR = 30 A, trr = 330 ns (typ.), Qrr = 5.1 µC (typ.), and dv/dt ruggedness ≥50 V/ns. These values are measured under standardized conditions (−dIDR/dt = 100 A/µs, VDD = 400 V), making TK090N65Z,S1F suitable for synchronous rectification and DCM PFC where diode behavior directly impacts efficiency and EMI.
Is TK090N65Z,S1F pin-compatible with other TO-247 MOSFETs, and what mechanical considerations apply?
The TK090N65Z,S1F uses the industry-standard TO-247 package (JEITA SC-65), ensuring mechanical compatibility with TO-247 footprints. However, its Drain-connected tab requires electrical isolation from the heatsink unless the system design references Drain to chassis ground. Mounting torque must not exceed 0.8 N·m to avoid package cracking, and thermal interface material must accommodate the 6.15 g unit weight and tab flatness tolerance.
What gate drive voltage range is recommended for reliable operation of TK090N65Z,S1F?
The TK090N65Z,S1F is specified for VGS = ±30 V absolute maximum, with enhancement-mode threshold Vth = 3–4 V (VDS = 10 V, ID = 1.27 mA). For robust switching, Toshiba recommends VGS = 10–15 V to fully enhance the channel and minimize RDS(ON). Gate drive must limit peak current to avoid overshoot and ensure turn-on/turn-off times align with tr = 60 ns and tf = 4 ns (RG = 10 Ω).
How does TK090N65Z,S1F perform under avalanche stress, and is it rated for repetitive operation?
The TK090N65Z,S1F is characterized for single-pulse avalanche energy EAS = 265 mJ (Tch = 25 °C), with IAS = 7.5 A and VDD = 90 V. Toshiba does not specify or guarantee repetitive avalanche capability; therefore, TK090N65Z,S1F should be operated within SOA limits and protected against repeated inductive switching events using clamping circuits or snubbers in designs where such stress is expected.
TK090N65Z,S1F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- DTMOSVI
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- 30A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 90mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1.27mA
- Gate Charge (Qg) (Max) @ Vgs:
- 47 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2780 pF @ 300 V
- FET Feature:
- -
- Power Dissipation (Max):
- 230W (Tc)
- Operating Temperature:
- 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247
TK090N65Z,S1F FAQ
1.How can I place an order for TK090N65Z,S1F through Aetrix?
Please submit a Request for Quotation (RFQ) for TK090N65Z,S1F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TK090N65Z,S1F reliable?
The price and inventory of TK090N65Z,S1F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK090N65Z,S1F is usually 5 days.
3.What payment methods are accepted for TK090N65Z,S1F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK090N65Z,S1F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TK090N65Z,S1F?
TK090N65Z,S1F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TK090N65Z,S1F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TK090N65Z,S1F?
For technical support, including TK090N65Z,S1F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK090N65Z,S1F requirements.
6.How does Aetrix verify that TK090N65Z,S1F is sourced from the original manufacturer or authorized distributors?
All TK090N65Z,S1F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK090N65Z,S1F meets industry standards.
7.What is the process for return or replacement of TK090N65Z,S1F?
All TK090N65Z,S1F units undergo pre-shipment inspection (PSI). If there is an issue with TK090N65Z,S1F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TK090N65Z,S1F part is unused and in its original packaging.
Return procedure for TK090N65Z,S1F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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