Toshiba Semiconductor and Storage TK100A06N1,S4X
- Part No.:
- TK100A06N1,S4X
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
TK100A06N1,S4X.pdf
- Description:
- MOSFET N-CH 60V 100A TO220SIS
- Quantity:
- Payment:

- Shipping:

Inventory:6,673
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TK100A06N1,S4X from Toshiba is a silicon N-channel power MOSFET in U-MOSⅧ-H process, designed as a high-current switching element in DC-DC converters and motor drives. It delivers 60 V VDSS, 263 A ID (DC), and ultra-low 2.2 mΩ RDS(ON) at VGS = 10 V, enabling high-efficiency operation in industrial switching voltage regulators.
For engineers reviewing the TK100A06N1,S4X datasheet, TK100A06N1,S4X pinout, TK100A06N1,S4X application, or TK100A06N1,S4X equivalent, key selection factors include its TO-220SIS package thermal performance (Rth(ch-c) = 2.77 °C/W), avalanche energy rating (EAS = 413 mJ), and gate charge profile (Qg = 140 nC) for hard-switching SMPS designs.
Technical Context
This MOSFET employs Toshiba's U-MOSⅧ-H trench-gate structure to minimize conduction and switching losses simultaneously. Its enhancement-mode threshold (Vth = 2.0–4.0 V) ensures reliable turn-on with standard 10 V gate drivers, while low Crss (50 pF) supports stable high-frequency operation up to 500 kHz in synchronous buck converters.
The integrated body diode exhibits trr = 100 ns and Qrr = 220 nC under specified conditions, making it suitable for freewheeling in non-isolated topologies. Thermal design must respect the 150 °C channel temperature limit and derate power dissipation above Tc = 25 °C per the guaranteed PD vs. Tc curve.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 60 V - Maximum blocking voltage before avalanche; sets upper limit for input voltage in 48 V bus applications. |
| RDS(ON) | 2.2 mΩ (typ.) at VGS = 10 V - Enables <1.3 W conduction loss at 50 A, critical for thermal management in high-current rails. |
| ID (DC) | 263 A at Tc = 25 °C - Requires heatsinking capable of maintaining case temperature ≤25 °C for full rating. |
| EAS | 413 mJ - Single-pulse avalanche energy rating; supports robustness against inductive switching transients without external snubbers. |
| Qg | 140 nC - Total gate charge determines driver strength requirement; ~1.4 A peak needed for 100 ns turn-on with 10 V swing. |
| Ciss | 10500 pF - Input capacitance impacts gate drive loop stability and EMI filtering requirements in high-dV/dt environments. |
| Rth(ch-c) | 2.77 °C/W - Channel-to-case thermal resistance defines minimum heatsink interface performance for safe continuous operation. |
Pinout & Package
TK100A06N1,S4X is housed in a TO-220SIS (JEITA SC-67) package with isolated drain tab, enabling direct mounting to heatsinks without insulating hardware. The package weighs 1.7 g and features a 2-10U1S footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate | Control terminal; requires ≥10 V drive for full RDS(ON) conduction; sensitive to ESD (±0.1 µA leakage max). |
| 2 | Drain | Main current path output; electrically connected to metal tab; must be isolated from PCB ground unless system topology permits. |
| 3 | Source | Reference node for gate drive; carries full load current; forms common return path with driver ground in low-side configurations. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(ON) | 2.2 mΩ typ. at 10 V - Reduces I²R losses by >30% versus legacy 60 V MOSFETs, directly improving efficiency in 50–200 A power stages. |
| High avalanche capability | 413 mJ single-pulse - Eliminates need for external clamping in flyback or boost converters operating near VDSS limits. |
| Low gate charge | Qg = 140 nC - Enables use of cost-effective 1–2 A gate drivers instead of high-current ICs, lowering BOM count in multi-phase VRMs. |
| Fast body diode recovery | trr = 100 ns, Qrr = 220 nC - Minimizes reverse recovery loss and associated ringing in synchronous rectification, improving light-load efficiency. |
| Thermally optimized package | Rth(ch-c) = 2.77 °C/W - Allows 45 W power dissipation at ΔT = 125 °C, supporting compact heatsink designs in space-constrained server PSUs. |
Applications
| Server VRM Power Stage | Industrial DC-DC Converter |
|---|---|
Use Scenario: High-current, multiphase buck converter supplying CPU core voltage in datacenter servers. IC Role / Device Role / Timing Role: Low-side synchronous rectifier switch handling up to 200 A per phase with <100 ns switching transitions. Use Value: 2.2 mΩ RDS(ON) reduces conduction loss by 1.8 W per phase versus 3.5 mΩ alternatives, lowering thermal load on VRM heatsinks. |
Use Scenario: 48 V to 12 V step-down converter powering PLC I/O modules and industrial sensors. IC Role / Device Role / Timing Role: Primary high-current switching element in hard-switched forward or LLC resonant topology. Use Value: 413 mJ EAS rating withstands 48 V bus transients without failure, eliminating need for TVS protection on primary side. |
| Motor Drive Inverter | Telecom Rectifier Module |
Use Scenario: Three-phase inverter stage driving 5–10 kW AC induction motors in HVAC and pump systems. IC Role / Device Role / Timing Role: Upper-leg switching device in 600 V-class inverter bridge, operated at 8–16 kHz PWM frequency. Use Value: Low Crss (50 pF) minimizes Miller-induced shoot-through risk during high dV/dt commutation, improving reliability in noisy EMI environments. |
Use Scenario: Secondary-side synchronous rectifier in 48 V telecom rectifier delivering 100+ A to base station equipment. IC Role / Device Role / Timing Role: High-current freewheeling switch conducting continuous 120 A with minimal forward voltage drop. Use Value: Body diode VDSF = –1.2 V enables efficient forced-commutated operation, reducing conduction loss by 15% over Schottky-assisted designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N6F7 | RDS(ON) = 2.0 mΩ (typ.), but rated only for 220 A DC; higher Qg = 165 nC increases driver loss. | Suitable for lower-current 48 V systems where peak current <220 A; less robust in avalanche-limited topologies. | Prefer TK100A06N1,S4X when sustained 263 A operation or 413 mJ EAS is required. |
| IXTH100N60L2 | 600 V rating, RDS(ON) = 12.5 mΩ - significantly higher conduction loss; optimized for high-voltage, not high-current. | Used in PFC front-end stages, not secondary-side switching; incompatible thermal profile due to TO-247 package. | Not interchangeable; TK100A06N1,S4X serves distinct low-voltage, high-current role requiring sub-3 mΩ RDS(ON). |
Compared with STL220N6F7 and IXTH100N60L2, the TK100A06N1,S4X uniquely balances ultra-low on-resistance, high DC current capability, and industry-leading avalanche energy-making it the preferred choice for 48–60 V, >200 A switching applications where thermal density and transient robustness are critical.
Availability
TK100A06N1,S4X is available at Aetrix Electronics and suitable for server VRMs, industrial DC-DC converters, and motor drive inverters requiring stable component supply across multi-year production cycles.
Supply support for TK100A06N1,S4X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on energy efficiency and reliability.
The TK100A06N1,S4X belongs to Toshiba's U-MOSⅧ-H high-current MOSFET product line, engineered specifically for high-efficiency, high-power-density switching applications in datacenter, industrial, and telecom infrastructure.
FAQ
What is the maximum continuous drain current for TK100A06N1,S4X at 100 °C case temperature?
The TK100A06N1,S4X supports 100 A DC drain current at Tc = 100 °C, as defined by its absolute maximum rating table and thermal derating curve. This reflects silicon-limited current capacity under elevated thermal conditions, distinct from the 263 A rating at Tc = 25 °C. Engineers must verify heatsink performance to maintain Tc ≤100 °C for this operational point.
Does TK100A06N1,S4X have a built-in body diode, and what are its key recovery characteristics?
Yes, the TK100A06N1,S4X integrates a fast-recovery body diode with trr = 100 ns and Qrr = 220 nC under specified test conditions (IDR = 100 A, –dIDR/dt = 100 A/µs). These values enable efficient synchronous rectification in hard-switched topologies and reduce reverse recovery loss compared to standard MOSFETs, directly improving light-load efficiency in the TK100A06N1,S4X-based design.
Can TK100A06N1,S4X be used in avalanche mode, and what is its rated single-pulse energy?
Yes, the TK100A06N1,S4X is rated for single-pulse avalanche operation with EAS = 413 mJ at Tch = 25 °C. This specification is validated per JEDEC standards and allows controlled energy absorption during inductive switching events-such as those in boost or flyback converters-without device failure, provided channel temperature remains within 150 °C limits during the pulse.
What is the gate threshold voltage range for TK100A06N1,S4X, and how does it affect drive circuit design?
The TK100A06N1,S4X has a gate threshold voltage Vth of 2.0–4.0 V at VDS = 10 V and ID = 1.0 mA. This range ensures reliable turn-on with standard 5 V or 10 V logic-level gate drivers, but mandates sufficient gate overdrive (≥10 V) to achieve the specified 2.2 mΩ RDS(ON). Drive circuits must deliver adequate peak current to charge Qg = 140 nC within target switching times for the TK100A06N1,S4X.
Is TK100A06N1,S4X RoHS compliant, and what marking indicates compliance?
Yes, TK100A06N1,S4X is RoHS compliant. Per Toshiba documentation, RoHS-compliant units are marked with an underlined lot number and carry [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] labeling. Non-underlined markings indicate lead-containing versions. Customers should verify marking format on received units and consult Toshiba's environmental compliance documentation for TK100A06N1,S4X to ensure regulatory alignment.
TK100A06N1,S4X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- U-MOSVIII-H
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 2.7mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 140 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 10500 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 45W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220SIS
TK100A06N1,S4X FAQ
1.How can I place an order for TK100A06N1,S4X through Aetrix?
Please submit a Request for Quotation (RFQ) for TK100A06N1,S4X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TK100A06N1,S4X reliable?
The price and inventory of TK100A06N1,S4X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK100A06N1,S4X is usually 5 days.
3.What payment methods are accepted for TK100A06N1,S4X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK100A06N1,S4X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TK100A06N1,S4X?
TK100A06N1,S4X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TK100A06N1,S4X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TK100A06N1,S4X?
For technical support, including TK100A06N1,S4X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK100A06N1,S4X requirements.
6.How does Aetrix verify that TK100A06N1,S4X is sourced from the original manufacturer or authorized distributors?
All TK100A06N1,S4X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK100A06N1,S4X meets industry standards.
7.What is the process for return or replacement of TK100A06N1,S4X?
All TK100A06N1,S4X units undergo pre-shipment inspection (PSI). If there is an issue with TK100A06N1,S4X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TK100A06N1,S4X part is unused and in its original packaging.
Return procedure for TK100A06N1,S4X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TK100A06N1,S4X Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

