Toshiba Semiconductor and Storage TK13A50DA(STA4,Q,M
- Part No.:
- TK13A50DA(STA4,Q,M
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
TK13A50DA(STA4,Q,M.pdf
- Description:
- MOSFET N-CH 500V 12.5A TO220SIS
- Quantity:
- Payment:

- Shipping:

Inventory:13
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Product details
Overview
TK13A50DA from TOSHIBA is a silicon N-channel power MOSFET in the π-MOSⅦ family, designed for high-efficiency switching regulator applications. It features 500 V drain-source breakdown voltage, 0.39 Ω typical RDS(ON) at VGS = 10 V and ID = 6.3 A, 6.0 S typical forward transfer admittance, 12.5 A continuous drain current, and SC-67 (2-10U1B) package with isolated heatsink-capable construction.
For engineers reviewing the TK13A50DA datasheet, TK13A50DA pinout, TK13A50DA application, or TK13A50DA equivalent, key selection criteria include avalanche ruggedness (416 mJ single-pulse), thermal resistance (2.78 °C/W channel-to-case), gate charge profile (28 nC total), body diode recovery (1300 ns trr), and RoHS-compliant marking underlined [[G]]/RoHS COMPATIBLE.
Technical Context
This MOSFET operates in enhancement mode with a gate threshold voltage range of 2.0–4.0 V, enabling reliable turn-on using standard 3.3 V or 5 V logic-level drivers when combined with sufficient gate drive strength. Its low RDS(ON) and high |Yfs| support high-current, high-frequency DC-DC conversion while minimizing conduction and switching losses.
The device integrates an intrinsic fast-recovery body diode (VDSF = −1.7 V at IDR = 12.5 A) and is rated for repetitive avalanche energy (4.5 mJ), making it suitable for hard-switched topologies where inductive energy dissipation occurs across the MOSFET. Thermal design must respect Tch ≤ 150 °C and derate PD linearly above 25 °C case temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 500 V - supports off-line SMPS input stages up to 400 V DC bus with margin |
| RDS(ON) (typ.) | 0.39 Ω @ VGS = 10 V, ID = 6.3 A - enables <1 W conduction loss at 12.5 A continuous operation |
| |Yfs| (typ.) | 6.0 S - indicates strong transconductance for stable gain and fast switching response |
| EAS | 416 mJ - withstands single-pulse inductive energy without failure in flyback or forward converters |
| Qg | 28 nC - determines gate driver current requirement (~1.4 A peak for 20 ns rise time) |
| Rth(ch-c) | 2.78 °C/W - allows ~16 W dissipation at ΔT = 45 °C with minimal heatsink |
| trr | 1300 ns - impacts snubber sizing and EMI in discontinuous conduction mode |
Pinout & Package
TK13A50DA uses the SC-67 (JEITA) / 2-10U1B (Toshiba) package - a through-hole, isolated-tab power package with integral heatsink interface and 1.7 g mass. The tab is electrically connected to the drain terminal.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control electrode | Receives voltage-controlled signal; requires low-impedance drive due to 28 nC Qg |
| 2 (Drain) | High-side power output | Connected to switch node and heatsink; electrically tied to metal tab |
| 3 (Source) | Reference return path | Serves as local ground reference for gate drive and current sensing |
Key Features
| Feature | Design Value |
|---|---|
| π-MOSⅦ process technology | Optimized cell layout delivering 0.39 Ω RDS(ON) at 500 V rating - balances voltage capability and on-resistance |
| Single-pulse avalanche rating | 416 mJ at VDD = 90 V, L = 4.53 mH - eliminates need for external clamping in many flyback designs |
| Body diode with low VDSF | −1.7 V at IDR = 12.5 A - reduces reverse conduction loss during dead-time in half-bridge configurations |
| Thermal robustness | Rth(ch-c) = 2.78 °C/W - enables compact heatsinking in industrial AC-DC adapters and UPS systems |
| RoHS-compliant marking | Underlined Lot No. indicates [[G]]/RoHS COMPATIBLE - meets EU Directive 2011/65/EU requirements |
Applications
| AC-DC Power Adapters | Industrial UPS Systems |
|---|---|
Use Scenario: 65–150 W offline flyback converter powering industrial instrumentation. IC Role / Device Role / Timing Role: Primary-side switching transistor handling 500 V DC link and delivering regulated 12 V/5 V outputs. Use Value: 416 mJ avalanche energy absorbs leakage inductance spikes without snubber, reducing component count and improving reliability. | Use Scenario: Online double-conversion UPS with 1 kVA output and battery backup. IC Role / Device Role / Timing Role: High-side switch in DC-DC boost stage regulating battery-charged DC bus to 400 V. Use Value: 0.39 Ω RDS(ON) limits conduction loss to <1.5 W at full load, enabling natural convection cooling in sealed enclosures. |
| LED Streetlight Drivers | Telecom Rectifier Modules |
Use Scenario: Constant-current buck-boost LED driver operating from 277 V AC mains. IC Role / Device Role / Timing Role: Main switching element in active PFC + isolated DC-DC stage controlling 10–20 A LED strings. Use Value: 6.0 S |Yfs| ensures stable closed-loop regulation under wide line/load variations and ambient temperature shifts. | Use Scenario: 48 V telecom rectifier module converting -48 V DC to 12 V intermediate bus. IC Role / Device Role / Timing Role: Synchronous rectifier MOSFET in secondary-side synchronous rectification circuit. Use Value: Fast body diode recovery (1300 ns trr) minimizes cross-conduction loss and EMI during zero-voltage switching transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP12NK50ZFP | 500 V, 12 A, RDS(ON) = 0.52 Ω (typ.), TO-220FP package, no avalanche rating specified | Lacks documented single-pulse avalanche energy; higher RDS(ON) increases conduction loss by ~33% | Acceptable where layout allows larger heatsink and system does not experience inductive fault stress |
| IXTP12N50L2 | 500 V, 12 A, RDS(ON) = 0.42 Ω (typ.), TO-220AB package, 320 mJ EAS | Lower avalanche energy (320 vs. 416 mJ); slightly higher RDS(ON); same thermal resistance class | Valid alternative if board-level transient suppression is added and thermal margin remains ≥10 °C |
Compared with STP12NK50ZFP and IXTP12N50L2, TK13A50DA offers superior avalanche ruggedness and lower on-resistance in a thermally optimized SC-67 package-critical for unclamped inductive switching and space-constrained industrial power supplies.
Availability
TK13A50DA is available at Aetrix Electronics and suitable for AC-DC power adapters, industrial UPS systems, and LED streetlight drivers requiring stable component supply, long-lifecycle support, and traceable RoHS-compliant sourcing.
Supply support for TK13A50DA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on efficiency, reliability, and industrial-grade performance.
The TK13A50DA belongs to Toshiba's π-MOSⅦ high-voltage power MOSFET product line, engineered specifically for ruggedized switching regulator applications demanding high avalanche tolerance, low conduction loss, and stable parametric behavior over temperature.
FAQ
What is the maximum continuous drain current rating for TK13A50DA at 25°C case temperature?
The TK13A50DA has a DC drain current rating of 12.5 A at Tc = 25°C. This value assumes proper heatsinking to maintain channel temperature ≤150°C. At elevated case temperatures, current must be derated linearly per the Safe Operating Area curve - for example, at Tc = 100°C, the usable continuous current drops to approximately 6.5 A. Always verify thermal design using Rth(ch-c) = 2.78 °C/W and actual ambient/heatsink conditions before finalizing the TK13A50DA implementation.
Does TK13A50DA support logic-level gate drive?
The TK13A50DA is not a logic-level MOSFET. Its gate threshold voltage ranges from 2.0 V to 4.0 V, but full enhancement requires VGS ≥ 10 V to achieve the specified RDS(ON) of 0.39 Ω. Driving TK13A50DA with only 3.3 V or 5 V will result in significantly higher on-resistance (>2 Ω) and excessive conduction loss. A dedicated gate driver capable of delivering ≥10 V with ≥1 A peak current is required for optimal performance of TK13A50DA in switching applications.
What is the significance of the underlined lot number on TK13A50DA marking?
An underlined lot number on TK13A50DA indicates [[G]]/RoHS COMPATIBLE compliance per EU Directive 2011/65/EU, confirming lead-free terminations and restricted substance control. Non-underlined markings denote [[Pb]]/INCLUDES > MCV (lead-containing). Both variants share identical electrical and thermal specifications. For new designs targeting RoHS markets, only underlined units should be selected - the TK13A50DA part number itself does not encode compliance; visual inspection of the marking is mandatory to confirm RoHS status of each received TK13A50DA unit.
Can TK13A50DA be used in synchronous rectification circuits?
Yes, TK13A50DA can be used in synchronous rectification, particularly on secondary-side high-voltage rails (e.g., 48 V or 54 V outputs), due to its low RDS(ON) and integrated body diode with VDSF = −1.7 V at 12.5 A. However, its 1300 ns reverse recovery time (trr) is slower than dedicated sync rectifiers, so careful timing control is needed to avoid shoot-through. For best results, pair TK13A50DA with a gate driver featuring adaptive dead-time control and validate cross-conduction margins in the final TK13A50DA-based design.
How is avalanche capability tested for TK13A50DA, and what does 416 mJ represent?
The 416 mJ single-pulse avalanche energy (EAS) for TK13A50DA is measured under standardized conditions: VDD = 90 V, initial Tch = 25°C, L = 4.53 mH, RG = 25 Ω, and IAR = 12.5 A. It quantifies the maximum inductive energy the device can absorb in one event without failure. This rating validates TK13A50DA for use in unclamped inductive switching (e.g., flyback transformers) where leakage energy must be dissipated internally - a key reliability advantage over non-rated MOSFETs like TK13A50DA's alternatives.
TK13A50DA(STA4,Q,M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- π-MOSVII
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 500 V
- Current - Continuous Drain (Id) @ 25°C:
- 12.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 470mOhm @ 6.3A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 28 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1550 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 45W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220SIS
TK13A50DA(STA4,Q,M FAQ
1.How can I place an order for TK13A50DA(STA4,Q,M through Aetrix?
Please submit a Request for Quotation (RFQ) for TK13A50DA(STA4,Q,M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TK13A50DA(STA4,Q,M reliable?
The price and inventory of TK13A50DA(STA4,Q,M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK13A50DA(STA4,Q,M is usually 5 days.
3.What payment methods are accepted for TK13A50DA(STA4,Q,M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK13A50DA(STA4,Q,M transactions.
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4.How is shipping managed for TK13A50DA(STA4,Q,M?
TK13A50DA(STA4,Q,M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TK13A50DA(STA4,Q,M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TK13A50DA(STA4,Q,M?
For technical support, including TK13A50DA(STA4,Q,M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK13A50DA(STA4,Q,M requirements.
6.How does Aetrix verify that TK13A50DA(STA4,Q,M is sourced from the original manufacturer or authorized distributors?
All TK13A50DA(STA4,Q,M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK13A50DA(STA4,Q,M meets industry standards.
7.What is the process for return or replacement of TK13A50DA(STA4,Q,M?
All TK13A50DA(STA4,Q,M units undergo pre-shipment inspection (PSI). If there is an issue with TK13A50DA(STA4,Q,M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TK13A50DA(STA4,Q,M part is unused and in its original packaging.
Return procedure for TK13A50DA(STA4,Q,M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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