Toshiba Semiconductor and Storage TK17V65W,LQ
- Part No.:
- TK17V65W,LQ
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- 4-VSFN Exposed Pad
- Datasheet:
-
TK17V65W,LQ.pdf
- Description:
- X35 PB-F POWER MOSFET TRANSISTOR
- Quantity:
- Payment:

- Shipping:

Inventory:14
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Product details
Overview
TK17V65W from Toshiba Electronic Devices & Storage Corporation is a silicon N-channel super-junction MOSFET designed for high-voltage switching in offline power supplies. It features 650 V drain-source breakdown voltage, 17.3 A DC drain current, and low RDS(ON) of 0.175 Ω (typ.) at VGS = 10 V, enabling high-efficiency operation in AC-DC adapters and industrial SMPS.
For engineers reviewing the TK17V65W datasheet, TK17V65W pinout, TK17V65W application, or TK17V65W equivalent, key selection considerations include its DFN8x8 package thermal performance (Rth(ch-c) = 0.8 °C/W), avalanche ruggedness (EAS = 210 mJ), and gate threshold voltage range (2.5–3.5 V) for reliable drive compatibility with standard PWM controllers.
Technical Context
This MOSFET employs Toshiba's DTMOS™ IV super-junction structure to achieve low conduction loss while maintaining fast switching characteristics. Its optimized charge profile (Qg = 45 nC typ., Qgd = 20 nC) supports high-frequency operation up to several hundred kHz in resonant and hard-switched topologies.
The device integrates an intrinsic body diode with reverse recovery time (trr) of 300 ns and peak recovery current (Irr) of 16 A under specified conditions, making it suitable for continuous-conduction-mode PFC and LLC half-bridge stages where diode behavior impacts efficiency and EMI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 650 V - Supports universal-input (85–265 VAC) offline converters without derating. |
| RDS(ON) | 0.175 Ω (typ.) at VGS = 10 V - Enables <1.5 W conduction loss at 17.3 A, reducing heatsink requirements. |
| ID (DC) | 17.3 A at Tc = 25 °C - Sustains full-load current in compact 8×8 mm DFN packages with proper PCB copper area. |
| EAS | 210 mJ - Withstands single-pulse inductive energy in flyback and forward converters without failure. |
| Rth(ch-c) | 0.8 °C/W - Allows direct thermal coupling to heatsink or copper plane, supporting >100 W power density designs. |
| Qgd/Qg | 20/45 nC - Low gate-drain charge ratio improves dv/dt immunity and reduces Miller-induced shoot-through risk. |
| trr | 300 ns - Limits diode switching loss and EMI generation in synchronous rectification and PFC boost stages. |
Pinout & Package
TK17V65W is housed in a surface-mount DFN8x8 package (Toshiba designation: 2-8T1A), featuring exposed drain pad for enhanced thermal dissipation. The package weighs 0.175 g and requires solder reflow per JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate | Control terminal; accepts 10 V logic-level drive; Vth = 2.5–3.5 V ensures compatibility with 3.3 V/5 V controllers. |
| 2 | Source1 | Signal return path for gate driver; must be used as gate reference to avoid ground loop noise in high-dv/dt switching. |
| 3,4 | Source2 | Main current return path; parallel pins reduce source inductance and improve current sharing in high-frequency operation. |
| 5 | Drain (Heatsink) | High-current output and thermal interface; exposed metal pad connects directly to PCB thermal plane or heatsink. |
Key Features
| Feature | Design Value |
|---|---|
| Super-junction DTMOS™ IV structure | Enables 0.175 Ω RDS(ON) at 650 V, reducing conduction loss by ~35% vs. planar MOSFETs in same package. |
| Optimized gate charge profile | Qgd/Qg = 0.44 minimizes Miller plateau duration, improving switching controllability in ZVS/ZCS circuits. |
| Robust avalanche capability | Rated EAS = 210 mJ ensures reliable operation during transient overloads without external snubbers. |
| Body diode with controlled recovery | trr = 300 ns and Qrr = 2.7 µC reduce reverse recovery loss and associated EMI in discontinuous-mode PFC. |
| Thermally enhanced DFN8x8 | Rth(ch-c) = 0.8 °C/W enables >150 W power handling with 4-layer PCB and 2 oz copper thermal pads. |
Applications
| Server PSU Primary Switch | Industrial AC-DC Adapter |
|---|---|
Use Scenario: High-efficiency 80 PLUS Titanium server power supply operating at 300–500 kHz in LLC resonant topology. IC Role / Device Role / Timing Role: Primary-side high-side switch in half-bridge configuration, handling 650 V bus and 15–20 A peak current. Use Value: Low RDS(ON) and optimized Qgd reduce total switching + conduction loss to <2.5 W, enabling >96% efficiency at full load. |
Use Scenario: 200–300 W industrial AC-DC adapter with universal input and reinforced isolation. IC Role / Device Role / Timing Role: Main switch in active-clamp forward converter, operating at 200–300 kHz with 650 V blocking requirement. Use Value: Avalanche rating and thermal resistance allow stable operation under line surges and ambient temperatures up to 70 °C without forced air. |
| Telecom Rectifier Module | EV Charger Auxiliary Power Supply |
Use Scenario: -48 V telecom rectifier with hold-up time extension using boost PFC followed by phase-shifted full-bridge. IC Role / Device Role / Timing Role: Boost switch in continuous-conduction-mode PFC stage, conducting 17.3 A DC with 300 V output. Use Value: Body diode trr and Qrr values minimize boost diode reverse recovery loss, improving light-load efficiency by 1.2%. |
Use Scenario: 30–60 W auxiliary power supply in on-board EV charger, powering gate drivers and MCU from 400–800 V DC link. IC Role / Device Role / Timing Role: Primary switch in flyback converter operating in quasi-resonant mode with 650 V VDSS margin. Use Value: Single-pulse avalanche energy rating eliminates need for clamping circuits, simplifying BOM and improving reliability under DC-link transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP17N65M2 | RDS(ON) = 0.22 Ω (typ.), TO-220FP package, Rth(j-a) = 50 °C/W vs. TK17V65W's 0.8 °C/W (ch-c) | Requires larger heatsink and through-hole layout; less suitable for high-density SMT designs | Choose STP17N65M2 only when through-hole assembly or legacy footprint compatibility is required. |
| IXTH17N65X2 | RDS(ON) = 0.19 Ω (typ.), TO-247 package, higher Qg = 52 nC, no specified trr or Qrr | Lacks documented body diode recovery specs; not recommended for PFC or synchronous rectification | Prefer TK17V65W for designs requiring predictable diode behavior and superior thermal performance in SMT form factor. |
Compared with STP17N65M2 and IXTH17N65X2, the TK17V65W delivers lower thermal resistance, tighter gate threshold control, and characterized body diode recovery-making it the preferred choice for space-constrained, high-efficiency offline SMPS where thermal management and EMI control are critical.
Availability
TK17V65W is available at Aetrix Electronics and suitable for server power supplies, industrial AC-DC adapters, and telecom rectifier modules requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for TK17V65W includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, logic ICs, and storage solutions, with decades of expertise in high-voltage MOSFET technology.
The TK17V65W belongs to Toshiba's DTMOS™ IV super-junction MOSFET product line, engineered specifically for high-efficiency, high-power-density offline switching applications including datacenter PSUs and industrial power conversion.
FAQ
What is the maximum continuous drain current rating for TK17V65W?
The TK17V65W is rated for 17.3 A DC drain current at case temperature (Tc) of 25 °C. At higher case temperatures, current must be derated per the Safe Operating Area curve in the datasheet; for example, at Tc = 100 °C, the usable ID drops to approximately 9.5 A. This rating assumes proper PCB thermal design with ≥200 mm² of 2 oz copper connected to the drain pad.
Does TK17V65W support gate drive from a 5 V microcontroller?
The TK17V65W has a gate threshold voltage (Vth) range of 2.5–3.5 V, so it will turn on with a 5 V gate drive. However, for low RDS(ON) and minimal conduction loss, the datasheet specifies RDS(ON) = 0.175 Ω at VGS = 10 V. Driving TK17V65W at only 5 V results in significantly higher on-resistance (~0.45 Ω typ.), increasing power loss. A dedicated gate driver or level shifter is recommended for optimal performance.
How is the drain pad of TK17V65W thermally connected in layout?
The drain terminal (Pin 5) of TK17V65W is an exposed metal pad on the bottom of the DFN8x8 package and serves as both electrical connection and primary thermal path. In PCB layout, it must be connected to a large copper pour (minimum 200 mm², 2 oz thickness) with ≥8 thermal vias (0.3 mm diameter) to inner ground or thermal planes. This achieves the specified Rth(ch-c) = 0.8 °C/W and prevents channel temperature exceedance beyond 150 °C.
Is TK17V65W suitable for use in PFC boost circuits?
Yes, TK17V65W is well-suited for continuous-conduction-mode (CCM) PFC boost stages due to its 650 V VDSS, low RDS(ON), and characterized body diode with trr = 300 ns and Qrr = 2.7 µC. These parameters enable efficient operation at typical PFC switching frequencies (65–150 kHz) while minimizing reverse recovery loss and associated EMI-key advantages confirmed in Toshiba's application notes for CCM PFC designs using DTMOS™ IV devices.
What precautions are needed when handling TK17V65W?
The TK17V65W is sensitive to electrostatic discharge (ESD), as noted in the datasheet. It must be handled using standard ESD-safe practices: grounded wrist straps, conductive foam storage, ionized air workstations, and ESD-safe packaging during transport. Additionally, the gate oxide is vulnerable to overvoltage; gate-source voltage must never exceed ±30 V, and gate drive traces should be short and shielded from noisy nodes to prevent unintended turn-on or latch-up.
TK17V65W,LQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 4-VSFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- 17.3A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 210mOhm @ 8.7A, 10V
- Vgs(th) (Max) @ Id:
- 3.5V @ 900µA
- Gate Charge (Qg) (Max) @ Vgs:
- 45 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1800 pF @ 300 V
- FET Feature:
- -
- Power Dissipation (Max):
- 156W (Tc)
- Operating Temperature:
- 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-DFN-EP (8x8)
TK17V65W,LQ FAQ
1.How can I place an order for TK17V65W,LQ through Aetrix?
Please submit a Request for Quotation (RFQ) for TK17V65W,LQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TK17V65W,LQ reliable?
The price and inventory of TK17V65W,LQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK17V65W,LQ is usually 5 days.
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TK17V65W,LQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TK17V65W,LQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TK17V65W,LQ?
For technical support, including TK17V65W,LQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK17V65W,LQ requirements.
6.How does Aetrix verify that TK17V65W,LQ is sourced from the original manufacturer or authorized distributors?
All TK17V65W,LQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK17V65W,LQ meets industry standards.
7.What is the process for return or replacement of TK17V65W,LQ?
All TK17V65W,LQ units undergo pre-shipment inspection (PSI). If there is an issue with TK17V65W,LQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TK17V65W,LQ part is unused and in its original packaging.
Return procedure for TK17V65W,LQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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