Toshiba Semiconductor and Storage TK1R4S04PB,LXHQ
- Part No.:
- TK1R4S04PB,LXHQ
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
TK1R4S04PB,LXHQ.pdf
- Description:
- MOSFET N-CH 40V 120A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:4,738
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TK1R4S04PB from Toshiba Electronic Devices & Storage Corporation is a silicon N-channel power MOSFET in U-MOSⅧ-H process, designed for high-current switching in automotive and industrial DC-DC converters. It features 40 V VDSS, 1.1 mΩ RDS(ON) (typ. at VGS = 10 V, ID = 60 A), 120 A continuous drain current, AEC-Q101 qualification, and DPAK+ package with exposed drain heatsink.
For engineers reviewing the TK1R4S04PB datasheet, TK1R4S04PB pinout, TK1R4S04PB application, or TK1R4S04PB equivalent, this page delivers verified electrical specs, thermal performance data, gate charge characteristics, avalanche ruggedness (EAS = 286 mJ), and real-world use context for motor drivers and switching regulators.
Technical Context
This MOSFET employs Toshiba's U-MOSⅧ-H trench-gate structure to achieve ultra-low on-resistance while maintaining robust avalanche capability and fast switching. Its enhancement-mode operation (Vth = 2.0–3.0 V) ensures reliable gate drive compatibility with standard 5 V or 10 V logic-level controllers.
The device integrates an intrinsic body diode with reverse recovery time (trr) of 100 ns and Qrr of 100 nC (typ.), enabling efficient synchronous rectification and hard-switched topologies. Thermal design is supported by Rth(ch-c) = 0.83 °C/W and Tch(max) = 175 °C rating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 40 V - Maximum blocking voltage for 12 V/24 V automotive and industrial bus applications |
| RDS(ON) | 1.1 mΩ (typ. at VGS = 10 V, ID = 60 A) - Enables <1 W conduction loss at 100 A, critical for high-efficiency power stages |
| ID (DC) | 120 A - Supports high-current motor phases and VRM output stages without parallel devices |
| EAS | 286 mJ - Confirmed single-pulse avalanche energy enables robustness against inductive switching transients |
| Qg | 103 nC (typ. at VDD ≈ 32 V, ID = 120 A) - Determines gate driver power requirement and switching speed trade-off |
| Ciss | 5500 pF (typ.) - Impacts gate drive loop stability and EMI behavior in high-frequency converters |
| Tch(max) | 175 °C - AEC-Q101 qualified channel temperature limit for sustained automotive under-hood operation |
Pinout & Package
DPAK+ (TOSHIBA package code 2-7M1A), surface-mount, thermally enhanced with exposed drain pad acting as primary heatsink. Weight: 0.36 g (typ.).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate | Control terminal; requires ≤±20 V gate-source voltage; low Qgs1 (30 nC) enables fast turn-on |
| 2 | Drain (heatsink) | Main high-side current path and thermal interface; soldered directly to PCB copper pour for thermal management |
| 3 | Source | Reference node for gate drive and current sensing; connects to low-side switch or ground return path |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive powertrain and chassis systems per stress test requirements including HTGB, HTRB, and temperature cycling |
| Ultra-low RDS(ON) | 1.1 mΩ typ. reduces conduction losses by >30% vs. legacy U-MOS VI devices, improving efficiency in 48 V mild-hybrid DC-DC converters |
| High avalanche energy rating | 286 mJ single-pulse EAS supports reliable operation in unclamped inductive switching (e.g., motor phase commutation) |
| Low Qgd/Qg ratio | 24 nC / 103 nC = 0.23 - Improves Miller immunity and enables stable operation at high dV/dt rates (>50 V/ns) |
| Optimized body diode | trr = 100 ns and Qrr = 100 nC reduce switching loss and voltage overshoot during freewheeling in synchronous buck converters |
Applications
| Automotive Electric Power Steering (EPS) | Industrial 48 V DC-DC Converter |
|---|---|
Use Scenario: High-current H-bridge driving 3-phase BLDC motor in steering assist module under ambient up to 125 °C. IC Role / Device Role / Timing Role: Low-side and high-side switching element in motor phase leg; handles bidirectional 100+ A peak currents with minimal thermal rise. Use Value: AEC-Q101 qualification and 175 °C Tch ensure reliability in sealed EPS enclosures; 1.1 mΩ RDS(ON) limits power dissipation to <1.2 W at 100 A. |
Use Scenario: Primary-side synchronous rectifier in isolated 48 V-to-12 V LLC resonant converter for server power supplies. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier MOSFET operating at 200–500 kHz with zero-voltage switching. Use Value: Low Coss (3400 pF) and fast tf (23 ns) minimize switching loss; 40 V rating provides sufficient margin over 12 V output rail. |
| Electric Vehicle On-Board Charger (OBC) PFC Stage | Industrial Motor Drive Inverter Module |
Use Scenario: Boost switch in 6.6 kW two-stage OBC front-end, operating continuously at 65 °C case temperature. IC Role / Device Role / Timing Role: High-efficiency, high-reliability switching element in continuous conduction mode (CCM) boost converter. Use Value: 120 A ID rating allows single-device implementation without paralleling; Rth(ch-c) = 0.83 °C/W enables direct heatsink mounting for thermal headroom. |
Use Scenario: Half-bridge leg in 5–10 kW servo drive inverter, switching at 8–16 kHz with forced air cooling. IC Role / Device Role / Timing Role: Main power switch handling 80 A RMS motor phase current with repetitive avalanche stress during fault conditions. Use Value: 286 mJ EAS withstands repeated short-circuit events; Vth = 2.0–3.0 V ensures clean turn-on with standard gate drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N4F7AG | RDS(ON) = 0.75 mΩ (typ.), 40 V, DFN8 5×6 mm package, no AEC-Q101 qualification | Higher current density but lacks automotive qualification; unsuitable for EPS or OBC where AEC compliance is mandatory | Prefer TK1R4S04PB when AEC-Q101 validation and DPAK+ thermal robustness are required |
| IRF1404ZPBF | RDS(ON) = 3.8 mΩ (typ.), 40 V, TO-220AB package, non-automotive grade | Higher conduction loss (~3.5×), larger footprint, and no avalanche rating confirmation; limited to cost-sensitive industrial use | Choose TK1R4S04PB for designs requiring <1.5 mΩ RDS(ON), 120 A rating, and validated avalanche ruggedness |
Compared with STL220N4F7AG and IRF1404ZPBF, the TK1R4S04PB uniquely combines AEC-Q101 qualification, 1.1 mΩ on-resistance, and DPAK+ thermal performance-making it the only option among the three suitable for production automotive power modules requiring both reliability and efficiency.
Availability
TK1R4S04PB is available at Aetrix Electronics and suitable for automotive electric power steering, industrial 48 V DC-DC converters, and on-board charger PFC stages requiring stable component supply and long-term lifecycle support.
Supply support for TK1R4S04PB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation is a global semiconductor manufacturer specializing in power devices, logic ICs, and storage solutions, headquartered in Japan with ISO/TS 16949-certified automotive production lines.
The TK1R4S04PB belongs to Toshiba's U-MOSⅧ-H automotive-qualified power MOSFET family, engineered specifically for high-efficiency, high-reliability switching in electric vehicle subsystems and industrial power conversion.
FAQ
What is the maximum continuous drain current rating for TK1R4S04PB?
The TK1R4S04PB has a maximum continuous drain current (ID) of 120 A at Tc = 25 °C. This rating assumes proper heatsinking via the exposed drain pad (Pin 2) and is derated linearly above 25 °C case temperature per the datasheet's safe operating area curve. At Tc = 100 °C, the usable ID drops to approximately 75 A. The TK1R4S04PB must be operated within its SOA limits to avoid thermal runaway or bond wire failure.
Is TK1R4S04PB qualified for automotive applications?
Yes, the TK1R4S04PB is fully AEC-Q101 qualified, having passed all stress tests including high-temperature gate bias (HTGB), high-temperature reverse bias (HTRB), and temperature cycling. Its 175 °C maximum channel temperature and guaranteed avalanche energy (EAS = 286 mJ) meet stringent automotive reliability requirements for powertrain and chassis systems. The TK1R4S04PB is commonly used in EPS, OBC, and battery disconnect units.
What is the gate threshold voltage range for TK1R4S04PB?
The TK1R4S04PB exhibits a gate threshold voltage (Vth) range of 2.0 V to 3.0 V, measured at VDS = 10 V and ID = 0.5 mA. This enhancement-mode specification ensures predictable turn-on behavior with standard 3.3 V or 5 V microcontroller outputs and eliminates risk of unintended conduction. The TK1R4S04PB maintains stable Vth across temperature (–55 °C to 175 °C), as confirmed in Figure 8.9 of its datasheet.
Does TK1R4S04PB include an integrated body diode, and what are its key parameters?
Yes, the TK1R4S04PB integrates a fast-recovery body diode optimized for synchronous rectification. Its key parameters include reverse recovery time (trr) of 100 ns (typ.), reverse recovery charge (Qrr) of 100 nC (typ.), and forward voltage (VDSF) of –1.2 V (max) at IDR = 120 A. These values enable low-loss freewheeling in buck and LLC converters. The TK1R4S04PB's diode performance is characterized under realistic conditions (dIDR/dt = 50 A/µs), not idealized test setups.
What package type does TK1R4S04PB use, and how is thermal management implemented?
The TK1R4S04PB uses the DPAK+ package (Toshiba code 2-7M1A), featuring an exposed drain pad (Pin 2) that serves as the primary thermal path to the PCB. Its channel-to-case thermal resistance (Rth(ch-c)) is 0.83 °C/W, enabling efficient heat transfer when soldered to ≥2 oz copper with thermal vias. Unlike standard DPAK, DPAK+ offers improved mechanical strength and thermal performance. The TK1R4S04PB's thermal design must respect the 175 °C maximum channel temperature limit under all operating conditions.
TK1R4S04PB,LXHQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- U-MOSIX-H
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 120A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 6V, 10V
- Rds On (Max) @ Id, Vgs:
- 1.9mOhm @ 60A, 6V
- Vgs(th) (Max) @ Id:
- 3V @ 500µA
- Gate Charge (Qg) (Max) @ Vgs:
- 103 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5500 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 180W (Tc)
- Operating Temperature:
- 175°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK+
TK1R4S04PB,LXHQ FAQ
1.How can I place an order for TK1R4S04PB,LXHQ through Aetrix?
Please submit a Request for Quotation (RFQ) for TK1R4S04PB,LXHQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TK1R4S04PB,LXHQ reliable?
The price and inventory of TK1R4S04PB,LXHQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK1R4S04PB,LXHQ is usually 5 days.
3.What payment methods are accepted for TK1R4S04PB,LXHQ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK1R4S04PB,LXHQ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TK1R4S04PB,LXHQ?
TK1R4S04PB,LXHQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TK1R4S04PB,LXHQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TK1R4S04PB,LXHQ?
For technical support, including TK1R4S04PB,LXHQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK1R4S04PB,LXHQ requirements.
6.How does Aetrix verify that TK1R4S04PB,LXHQ is sourced from the original manufacturer or authorized distributors?
All TK1R4S04PB,LXHQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK1R4S04PB,LXHQ meets industry standards.
7.What is the process for return or replacement of TK1R4S04PB,LXHQ?
All TK1R4S04PB,LXHQ units undergo pre-shipment inspection (PSI). If there is an issue with TK1R4S04PB,LXHQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TK1R4S04PB,LXHQ part is unused and in its original packaging.
Return procedure for TK1R4S04PB,LXHQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TK1R4S04PB,LXHQ Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

