Toshiba Semiconductor and Storage TK30E06N1,S1X
- Part No.:
- TK30E06N1,S1X
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
TK30E06N1,S1X.pdf
- Description:
- MOSFET N-CH 60V 43A TO220
- Quantity:
- Payment:

- Shipping:

Inventory:69
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Product details
Overview
TK30E06N1,S1X from Toshiba is a silicon N-channel power MOSFET in U-MOSⅧ-H process, designed as a high-efficiency switching element in DC-DC converters and motor drives. It delivers 43 A continuous drain current at Tc = 25°C, 60 V drain-source breakdown voltage, and typ. RDS(ON) of 12.2 mΩ at VGS = 10 V, enabling low conduction loss in high-current 48 V industrial power supplies.
For engineers reviewing the TK30E06N1,S1X datasheet, TK30E06N1,S1X pinout, TK30E06N1,S1X application, or TK30E06N1,S1X equivalent, key selection criteria include its TO-220 package thermal performance (Rth(ch-c) = 2.34°C/W), avalanche energy rating (EAS = 38 mJ), and gate threshold range (2.0–4.0 V) for robust PWM control interface compatibility.
Technical Context
This MOSFET employs Toshiba's U-MOSⅧ-H trench-gate structure to minimize on-resistance while maintaining fast switching characteristics. Its static parameters-V(BR)DSS = 60 V, ID = 43 A (DC), and RDS(ON) ≤ 15.0 mΩ-are specified under strict channel temperature limits (Tch ≤ 150°C).
Dynamic behavior is characterized by Ciss = 1050 pF, Qg = 16 nC, and ton/toff = 21/28 ns at VDD ≈ 48 V, supporting high-frequency synchronous rectification. The integrated body diode exhibits trr = 39 ns and Qrr = 39 nC, suitable for hard-switched topologies with controlled reverse recovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 60 V - Maximum blocking voltage in off-state; supports 48 V bus systems with 20% derating margin. |
| RDS(ON) (typ.) | 12.2 mΩ at VGS = 10 V - Enables <1.5 W conduction loss at 30 A, critical for thermal management in compact heatsink designs. |
| ID (DC) | 43 A at Tc = 25°C - Sustains high continuous load in regulated power supplies without forced air cooling. |
| EAS | 38 mJ - Single-pulse avalanche energy rating ensures reliability during inductive switching transients in motor drive H-bridges. |
| Qg | 16 nC - Total gate charge determines driver strength requirement; compatible with standard 1-A peak gate drivers at ≤500 kHz. |
| tr/tf | 7.3/7.3 ns - Fast rise/fall times reduce switching losses and EMI generation in high-frequency SMPS designs. |
| Vth | 2.0–4.0 V - Gate threshold range ensures clean turn-on with 3.3 V or 5 V logic-level controllers without risk of partial enhancement. |
Pinout & Package
TK30E06N1,S1X is housed in a TO-220 package (TOSHIBA designation: 2-10X1A), with the drain connected internally to the metal tab for direct heatsink mounting. Thermal resistance from channel to case is 2.34°C/W, requiring mechanical clamping and thermal interface material for optimal heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: Gate | Control electrode | Receives PWM signal; requires low-impedance drive path due to 16 nC total gate charge. |
| 2: Drain (heatsink) | High-side power terminal | Electrically and thermally coupled to metal tab; must be isolated from chassis unless referenced to ground. |
| 3: Source | Return path for load current | Serves as reference node for gate drive; layout must minimize inductance to prevent ringing during switching. |
Key Features
| Feature | Design Value |
|---|---|
| U-MOSⅧ-H trench process | Reduces RDS(ON) × Qg figure-of-merit by >25% vs. prior U-MOS generations, improving efficiency in 300–1000 kHz converters. |
| Low leakage IDSS | ≤10 µA at VDS = 60 V ensures minimal standby power loss in always-on auxiliary supplies. |
| Guaranteed avalanche capability | EAS = 38 mJ tested per JEDEC JESD24-11, enabling rugged operation in unclamped inductive loads without external snubbers. |
| Enhancement-mode operation | Vth window (2.0–4.0 V) prevents accidental turn-on from noise and supports direct microcontroller GPIO drive. |
| Integrated body diode | trr = 39 ns and Qrr = 39 nC enable use in synchronous rectifier configurations with reduced reverse recovery loss vs. discrete diodes. |
Applications
| Switching Voltage Regulators | DC Motor Drives |
|---|---|
Use Scenario: Primary-side switch in 48 V input, 12 V output synchronous buck converter for industrial PLC power modules. IC Role / Device Role / Timing Role: High-side power switch controlling energy transfer into output inductor; operates at 300 kHz with 50% duty cycle. Use Value: 12.2 mΩ RDS(ON) limits conduction loss to 1.1 W at 30 A, allowing natural convection cooling and reducing system size by 30% vs. higher-RDS(ON) alternatives. | Use Scenario: Low-side switch in H-bridge for 24 V brushed DC motor control in automated warehouse conveyors. IC Role / Device Role / Timing Role: Ground-referenced switching element handling bidirectional current up to 43 A during acceleration/deceleration. Use Value: Guaranteed 38 mJ avalanche energy withstands flyback voltage spikes during rapid PWM shutdown, eliminating need for external clamp diodes. |
| Uninterruptible Power Supplies | LED Constant-Current Drivers |
Use Scenario: Inverter-stage switch in line-interactive UPS delivering 1 kVA output with battery backup. IC Role / Device Role / Timing Role: Bridge arm device switching at 20 kHz to synthesize 50/60 Hz sine-wave output via SPWM modulation. Use Value: 1050 pF Ciss and 16 nC Qg enable efficient gate driving with low-power isolated drivers, reducing auxiliary supply loading by 40%. | Use Scenario: Series-pass switch in constant-current LED driver for high-bay industrial lighting (100 W, 350 mA). IC Role / Device Role / Timing Role: Linear-regulated current sink operating in analog dimming mode with 100% duty cycle. Use Value: 2.34°C/W Rth(ch-c) allows stable 100°C channel temperature at 3.5 W dissipation using only a 25 mm² aluminum heatsink. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP40NF60 | RDS(ON) = 0.03 Ω (higher), Qg = 120 nC (much higher), TO-220 package | Lower switching speed limits usable frequency to ≤100 kHz; higher conduction loss increases thermal demand. | Prefer when cost sensitivity outweighs efficiency and board space constraints. |
| IRFZ44NPBF | RDS(ON) = 28 mΩ (more than double), EAS not rated, same TO-220 footprint | Lacks guaranteed avalanche capability; unsuitable for inductive loads without external protection. | Select only for non-inductive, low-frequency (<50 kHz), low-duty-cycle applications with ample thermal margin. |
Compared with STP40NF60 and IRFZ44NPBF, TK30E06N1,S1X offers superior RDS(ON) × Qg trade-off and certified avalanche ruggedness-critical for high-frequency, high-reliability industrial power stages where thermal headroom and transient immunity are design priorities.
Availability
TK30E06N1,S1X is available at Aetrix Electronics and suitable for switching voltage regulators, DC motor drives, uninterruptible power supplies, and LED constant-current drivers requiring stable component supply across multi-year production cycles.
Supply support for TK30E06N1,S1X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, logic ICs, and storage solutions, with over 50 years of power MOSFET development expertise.
The TK30E06N1,S1X belongs to Toshiba's U-MOSⅧ-H power MOSFET product line, engineered specifically for high-efficiency, high-reliability industrial switching applications demanding low RDS(ON), fast switching, and robust avalanche performance.
FAQ
What is the maximum continuous drain current rating for TK30E06N1,S1X?
The TK30E06N1,S1X is rated for 43 A continuous drain current (ID) at case temperature Tc = 25°C. This rating assumes proper heatsinking to maintain channel temperature ≤150°C. At elevated case temperatures, the current must be derated per the Safe Operating Area curve in the datasheet-e.g., ~25 A at Tc = 80°C. Always verify thermal design using Rth(ch-c) = 2.34°C/W and actual system airflow.
Does TK30E06N1,S1X support logic-level gate drive?
TK30E06N1,S1X is not a logic-level MOSFET. Its gate threshold voltage (Vth) ranges from 2.0 V to 4.0 V, and it achieves full enhancement (RDS(ON) ≤ 15.0 mΩ) only at VGS = 10 V. Driving it with 3.3 V or 5 V logic alone will result in high on-resistance and excessive heating. A dedicated gate driver capable of 10 V output with ≥1 A peak current is required for reliable operation of TK30E06N1,S1X.
What is the avalanche energy rating of TK30E06N1,S1X and how is it tested?
The TK30E06N1,S1X has a single-pulse avalanche energy rating (EAS) of 38 mJ, measured under standardized conditions: VDD = 48 V, Tch = 25°C (initial), L = 32.8 µH, and IAR = 30 A. This rating is verified per JEDEC JESD24-11 and guarantees safe operation during unclamped inductive switching events-such as those occurring in motor drive freewheeling or relay coil de-energization-without device failure.
Can TK30E06N1,S1X be used in parallel configurations?
Yes, TK30E06N1,S1X can be paralleled for higher current capacity, but requires careful attention to gate drive symmetry, source inductance matching, and thermal coupling. Its positive temperature coefficient of RDS(ON) promotes current sharing above ~50°C, but layout imbalances can cause uneven stress. Use individual gate resistors (10–22 Ω), Kelvin source connections, and identical heatsink mounting pressure to ensure balanced operation of multiple TK30E06N1,S1X devices.
Is TK30E06N1,S1X RoHS compliant and halogen-free?
Yes, TK30E06N1,S1X is RoHS compliant and halogen-free per Toshiba's environmental specifications. The device meets EU Directive 2011/65/EU (RoHS 2) and contains no brominated flame retardants (BFRs), chlorinated flame retardants (CFRs), or antimony trioxide. Full compliance documentation-including test reports and declarations-is available through Toshiba's official environmental portal or upon request from Aetrix Electronics.
TK30E06N1,S1X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- U-MOSVIII-H
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 43A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 15mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 200µA
- Gate Charge (Qg) (Max) @ Vgs:
- 16 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1050 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 53W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220
TK30E06N1,S1X FAQ
1.How can I place an order for TK30E06N1,S1X through Aetrix?
Please submit a Request for Quotation (RFQ) for TK30E06N1,S1X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TK30E06N1,S1X reliable?
The price and inventory of TK30E06N1,S1X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK30E06N1,S1X is usually 5 days.
3.What payment methods are accepted for TK30E06N1,S1X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK30E06N1,S1X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TK30E06N1,S1X?
TK30E06N1,S1X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TK30E06N1,S1X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TK30E06N1,S1X?
For technical support, including TK30E06N1,S1X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK30E06N1,S1X requirements.
6.How does Aetrix verify that TK30E06N1,S1X is sourced from the original manufacturer or authorized distributors?
All TK30E06N1,S1X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK30E06N1,S1X meets industry standards.
7.What is the process for return or replacement of TK30E06N1,S1X?
All TK30E06N1,S1X units undergo pre-shipment inspection (PSI). If there is an issue with TK30E06N1,S1X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TK30E06N1,S1X part is unused and in its original packaging.
Return procedure for TK30E06N1,S1X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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