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Toshiba Semiconductor and Storage TK32E12N1,S1X

Part No.:
TK32E12N1,S1X
Manufacturer:
Toshiba Semiconductor and Storage
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixTK32E12N1,S1X.pdf
Description:
MOSFET N CH 120V 60A TO-220
Quantity:
Payment:
Payment
Shipping:
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Inventory:5,659

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Product details

Overview

TK32E12N1,S1X from Toshiba is a silicon N-channel power MOSFET in U-MOSⅧ-H process, designed as a high-current switching element in DC-DC converters and motor drives. It delivers RDS(ON) = 11.0 mΩ (typ.) at VGS = 10 V, supports 120 V drain-source breakdown voltage, and handles 60 A continuous drain current with TO-220 package thermal performance.

For engineers reviewing the TK32E12N1,S1X datasheet, TK32E12N1,S1X pinout, TK32E12N1,S1X application, or TK32E12N1,S1X equivalent, key selection criteria include low conduction loss for high-efficiency 12–48 V industrial power supplies, avalanche ruggedness (EAS = 48 mJ), and gate charge profile (Qg = 34 nC) for optimized PWM switching.

Technical Context

This MOSFET employs Toshiba's U-MOSⅧ-H trench-gate structure to achieve low RDS(ON) while maintaining robust avalanche capability and fast switching dynamics. Its enhancement-mode threshold (Vth = 2.0–4.0 V) ensures reliable turn-on with standard 10 V gate drive, and its integrated body diode exhibits trr = 73 ns and Qrr = 160 nC under specified conditions.

The device is rated for Tch ≤ 150 °C and features Rth(ch–c) = 1.27 °C/W, enabling high-power operation when mounted on a heatsink. Dynamic parameters-including Ciss = 2000 pF, Crss = 13 pF, and rg = 1.9 Ω-support stable gate driving in hard-switched topologies without excessive ringing.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 120 V - Maximum blocking voltage for 48 V bus applications with 2.5× safety margin
RDS(ON) (typ.) 11.0 mΩ at VGS = 10 V - Enables <1.8 W conduction loss at 40 A, reducing heatsink requirements
ID (DC) 60 A - Supports high-current output stages in server VRMs and industrial SMPS
EAS 48 mJ - Withstands single-pulse inductive energy in motor control and relay snubbing
Qg 34 nC - Determines gate driver power requirement and switching transition time in 100–500 kHz designs
tr/tf 14/14 ns - Fast edge rates minimize overlap loss but require careful PCB layout to suppress EMI
Rth(ch–c) 1.27 °C/W - Enables ~77 W dissipation at ΔT = 100 °C with properly mounted heatsink

Pinout & Package

TK32E12N1,S1X is housed in a TO-220 through-hole package (TOSHIBA designation: 2-10X1A), with the drain connected internally to the metal tab for direct heatsink mounting. The case serves as the primary thermal path and electrically connects to the drain terminal.

Pin/Terminal Circuit Role Design Meaning
1: Gate Control electrode Receives voltage-controlled signal; requires ≥10 V for full enhancement and minimal RDS(ON)
2: Drain (heatsink) High-side current path & thermal interface Electrically tied to metal tab; must be isolated from chassis unless circuit topology permits common-drain configuration
3: Source Reference node for gate drive & current return Serves as local ground reference for gate driver; trace inductance here directly impacts switching stability

Key Features

Feature Design Value
U-MOSⅧ-H trench process Reduces specific on-resistance by ~25% vs. prior U-MOS generations, improving power density in space-constrained designs
Low Qgd/Qg ratio (9.8/34 nC) Minimizes Miller plateau duration, enabling faster, more controllable hard switching with reduced risk of shoot-through
Body diode trr = 73 ns Supports synchronous rectification in buck converters without external Schottky, lowering BOM count and cost
Avalanche-rated (IAR = 32 A, EAS = 48 mJ) Eliminates need for external clamping in inductive load switching, simplifying protection circuitry in motor drivers
Vth = 2.0–4.0 V Ensures guaranteed turn-on with 3.3 V or 5 V logic-level gate drivers when used with bootstrap or isolated supply

Applications

Industrial DC-DC Converters Brushless DC Motor Drives

Use Scenario: Primary switch in 24–48 V input, 5–12 V output isolated forward or half-bridge converters for PLC I/O modules.

IC Role / Device Role / Timing Role: High-side main switch handling up to 60 A peak current during PWM on-time.

Use Value: Low RDS(ON) reduces conduction loss to <2.2 W at full load, enabling natural convection cooling in sealed enclosures.

Use Scenario: Upper-leg switch in three-phase inverter stage for 400 W–1 kW BLDC fans and pumps.

IC Role / Device Role / Timing Role: Fast-switching power stage element synchronized to 20 kHz PWM carrier with dead-time control.

Use Value: 14 ns rise/fall times and low Qg allow clean transitions at high frequency, minimizing switching loss and audible noise.

Server Voltage Regulators Industrial Power Supplies

Use Scenario: Point-of-load (POL) high-side FET in multiphase VRM supplying CPU core voltage from 12 V rail.

IC Role / Device Role / Timing Role: Synchronous rectifier switch operating at 300–600 kHz with precise gate timing.

Use Value: Body diode recovery characteristics (Qrr = 160 nC) reduce reverse recovery loss compared to discrete Schottky solutions.

Use Scenario: Main switching transistor in 1 kW open-frame AC-DC power supply with active PFC front-end.

IC Role / Device Role / Timing Role: Output stage switch in LLC resonant converter operating at 200–400 kHz.

Use Value: Avalanche energy rating enables safe operation during transient overloads without derating, improving system MTBF.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP60NF12 RDS(ON) = 14 mΩ (typ.), higher Qg = 55 nC, same VDSS = 120 V, TO-220 package Higher conduction and switching losses; less suitable for >300 kHz operation Acceptable for lower-frequency (<150 kHz), cost-sensitive industrial SMPS where thermal margin exists
IRF3205PBF RDS(ON) = 8.0 mΩ (typ.), but VDSS = 55 V only; TO-220; Qg = 71 nC Not rated for 120 V bus; unsuitable for 48 V systems with surge tolerance requirements Only viable in 24 V or lower bus applications where lower RDS(ON) justifies reduced voltage margin

Compared with STP60NF12 and IRF3205PBF, TK32E12N1,S1X offers optimal balance of 120 V rating, 11 mΩ on-resistance, and 34 nC gate charge-making it preferred for high-efficiency, medium-frequency industrial power stages where both voltage headroom and thermal performance are critical.

Availability

TK32E12N1,S1X is available at Aetrix Electronics and suitable for industrial DC-DC converters, brushless DC motor drives, and server voltage regulators requiring stable component supply across multi-year production cycles.

Supply support for TK32E12N1,S1X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors and power devices, with emphasis on high-reliability industrial and automotive-grade components.

TK32E12N1,S1X belongs to Toshiba's U-MOSⅧ-H power MOSFET family, engineered specifically for high-current, high-efficiency switching in industrial power conversion and motor control systems.

FAQ

What is the maximum continuous drain current rating for TK32E12N1,S1X?

The TK32E12N1,S1X is rated for 60 A DC drain current at Tc = 25 °C with proper heatsinking. Derating applies above 25 °C case temperature per the Rth(ch–c) = 1.27 °C/W thermal resistance curve. At Tc = 100 °C, the usable ID drops to approximately 32 A to maintain Tch ≤ 150 °C. This rating assumes adequate PCB copper area and thermal interface material for the TO-220 drain tab.

Does TK32E12N1,S1X support logic-level gate drive?

TK32E12N1,S1X has a gate threshold voltage range of 2.0–4.0 V, but it is not a true logic-level MOSFET. To achieve its specified RDS(ON) = 11.0 mΩ (typ.), a VGS of 10 V is required. While it will turn on with 3.3 V or 5 V gate signals, RDS(ON) rises significantly-exceeding 40 mΩ at VGS = 5 V-so external gate boosting or level-shifting is recommended for full-performance operation.

What is the significance of the "S1X" suffix in TK32E12N1,S1X?

The "S1X" suffix in TK32E12N1,S1X denotes Toshiba's standard tape-and-reel packaging variant for surface-mount compatible automated assembly, though the device itself remains a through-hole TO-220 part. It indicates compliance with JEDEC J-STD-020 moisture sensitivity level (MSL) requirements and includes standardized reel quantity, orientation, and labeling per Toshiba's ordering conventions-not a functional or electrical variant.

Can TK32E12N1,S1X replace older U-MOS VI or VII devices in existing designs?

Yes, TK32E12N1,S1X is a direct drop-in replacement for earlier Toshiba U-MOS VI and VII equivalents such as TK31E12N1 in identical TO-220 packages. It maintains identical pinout, absolute maximum ratings, and thermal footprint, while offering improved RDS(ON), lower gate charge, and enhanced avalanche ruggedness-enabling efficiency gains without layout changes.

Is the body diode in TK32E12N1,S1X suitable for synchronous rectification?

The body diode in TK32E12N1,S1X has trr = 73 ns and Qrr = 160 nC under specified test conditions (IDR = 32 A, dI/dt = 100 A/µs). While usable in non-critical synchronous rectification, its recovery characteristics are less optimized than dedicated sync-FETs. For high-frequency (>300 kHz) or high-efficiency designs, pairing with an external Schottky or using a dedicated low-Qrr MOSFET is recommended-but TK32E12N1,S1X remains viable in 100–200 kHz industrial converters.

TK32E12N1,S1X Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
U-MOSVIII-H
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
120 V
Current - Continuous Drain (Id) @ 25°C:
60A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
13.8mOhm @ 16A, 10V
Vgs(th) (Max) @ Id:
4V @ 500µA
Gate Charge (Qg) (Max) @ Vgs:
34 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2000 pF @ 60 V
FET Feature:
-
Power Dissipation (Max):
98W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220

TK32E12N1,S1X FAQ

1.How can I place an order for TK32E12N1,S1X through Aetrix?

Please submit a Request for Quotation (RFQ) for TK32E12N1,S1X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TK32E12N1,S1X reliable?

The price and inventory of TK32E12N1,S1X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK32E12N1,S1X is usually 5 days.

3.What payment methods are accepted for TK32E12N1,S1X?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK32E12N1,S1X transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TK32E12N1,S1X?

TK32E12N1,S1X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TK32E12N1,S1X order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TK32E12N1,S1X?

For technical support, including TK32E12N1,S1X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK32E12N1,S1X requirements.

6.How does Aetrix verify that TK32E12N1,S1X is sourced from the original manufacturer or authorized distributors?

All TK32E12N1,S1X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK32E12N1,S1X meets industry standards.

7.What is the process for return or replacement of TK32E12N1,S1X?

All TK32E12N1,S1X units undergo pre-shipment inspection (PSI). If there is an issue with TK32E12N1,S1X, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TK32E12N1,S1X part is unused and in its original packaging.

Return procedure for TK32E12N1,S1X:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TK32E12N1,S1X Tags

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