Toshiba Semiconductor and Storage TK32E12N1,S1X
- Part No.:
- TK32E12N1,S1X
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
TK32E12N1,S1X.pdf
- Description:
- MOSFET N CH 120V 60A TO-220
- Quantity:
- Payment:

- Shipping:

Inventory:5,659
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TK32E12N1,S1X from Toshiba is a silicon N-channel power MOSFET in U-MOSⅧ-H process, designed as a high-current switching element in DC-DC converters and motor drives. It delivers RDS(ON) = 11.0 mΩ (typ.) at VGS = 10 V, supports 120 V drain-source breakdown voltage, and handles 60 A continuous drain current with TO-220 package thermal performance.
For engineers reviewing the TK32E12N1,S1X datasheet, TK32E12N1,S1X pinout, TK32E12N1,S1X application, or TK32E12N1,S1X equivalent, key selection criteria include low conduction loss for high-efficiency 12–48 V industrial power supplies, avalanche ruggedness (EAS = 48 mJ), and gate charge profile (Qg = 34 nC) for optimized PWM switching.
Technical Context
This MOSFET employs Toshiba's U-MOSⅧ-H trench-gate structure to achieve low RDS(ON) while maintaining robust avalanche capability and fast switching dynamics. Its enhancement-mode threshold (Vth = 2.0–4.0 V) ensures reliable turn-on with standard 10 V gate drive, and its integrated body diode exhibits trr = 73 ns and Qrr = 160 nC under specified conditions.
The device is rated for Tch ≤ 150 °C and features Rth(ch–c) = 1.27 °C/W, enabling high-power operation when mounted on a heatsink. Dynamic parameters-including Ciss = 2000 pF, Crss = 13 pF, and rg = 1.9 Ω-support stable gate driving in hard-switched topologies without excessive ringing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 120 V - Maximum blocking voltage for 48 V bus applications with 2.5× safety margin |
| RDS(ON) (typ.) | 11.0 mΩ at VGS = 10 V - Enables <1.8 W conduction loss at 40 A, reducing heatsink requirements |
| ID (DC) | 60 A - Supports high-current output stages in server VRMs and industrial SMPS |
| EAS | 48 mJ - Withstands single-pulse inductive energy in motor control and relay snubbing |
| Qg | 34 nC - Determines gate driver power requirement and switching transition time in 100–500 kHz designs |
| tr/tf | 14/14 ns - Fast edge rates minimize overlap loss but require careful PCB layout to suppress EMI |
| Rth(ch–c) | 1.27 °C/W - Enables ~77 W dissipation at ΔT = 100 °C with properly mounted heatsink |
Pinout & Package
TK32E12N1,S1X is housed in a TO-220 through-hole package (TOSHIBA designation: 2-10X1A), with the drain connected internally to the metal tab for direct heatsink mounting. The case serves as the primary thermal path and electrically connects to the drain terminal.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: Gate | Control electrode | Receives voltage-controlled signal; requires ≥10 V for full enhancement and minimal RDS(ON) |
| 2: Drain (heatsink) | High-side current path & thermal interface | Electrically tied to metal tab; must be isolated from chassis unless circuit topology permits common-drain configuration |
| 3: Source | Reference node for gate drive & current return | Serves as local ground reference for gate driver; trace inductance here directly impacts switching stability |
Key Features
| Feature | Design Value |
|---|---|
| U-MOSⅧ-H trench process | Reduces specific on-resistance by ~25% vs. prior U-MOS generations, improving power density in space-constrained designs |
| Low Qgd/Qg ratio (9.8/34 nC) | Minimizes Miller plateau duration, enabling faster, more controllable hard switching with reduced risk of shoot-through |
| Body diode trr = 73 ns | Supports synchronous rectification in buck converters without external Schottky, lowering BOM count and cost |
| Avalanche-rated (IAR = 32 A, EAS = 48 mJ) | Eliminates need for external clamping in inductive load switching, simplifying protection circuitry in motor drivers |
| Vth = 2.0–4.0 V | Ensures guaranteed turn-on with 3.3 V or 5 V logic-level gate drivers when used with bootstrap or isolated supply |
Applications
| Industrial DC-DC Converters | Brushless DC Motor Drives |
|---|---|
|
Use Scenario: Primary switch in 24–48 V input, 5–12 V output isolated forward or half-bridge converters for PLC I/O modules. IC Role / Device Role / Timing Role: High-side main switch handling up to 60 A peak current during PWM on-time. Use Value: Low RDS(ON) reduces conduction loss to <2.2 W at full load, enabling natural convection cooling in sealed enclosures. |
Use Scenario: Upper-leg switch in three-phase inverter stage for 400 W–1 kW BLDC fans and pumps. IC Role / Device Role / Timing Role: Fast-switching power stage element synchronized to 20 kHz PWM carrier with dead-time control. Use Value: 14 ns rise/fall times and low Qg allow clean transitions at high frequency, minimizing switching loss and audible noise. |
| Server Voltage Regulators | Industrial Power Supplies |
|
Use Scenario: Point-of-load (POL) high-side FET in multiphase VRM supplying CPU core voltage from 12 V rail. IC Role / Device Role / Timing Role: Synchronous rectifier switch operating at 300–600 kHz with precise gate timing. Use Value: Body diode recovery characteristics (Qrr = 160 nC) reduce reverse recovery loss compared to discrete Schottky solutions. |
Use Scenario: Main switching transistor in 1 kW open-frame AC-DC power supply with active PFC front-end. IC Role / Device Role / Timing Role: Output stage switch in LLC resonant converter operating at 200–400 kHz. Use Value: Avalanche energy rating enables safe operation during transient overloads without derating, improving system MTBF. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP60NF12 | RDS(ON) = 14 mΩ (typ.), higher Qg = 55 nC, same VDSS = 120 V, TO-220 package | Higher conduction and switching losses; less suitable for >300 kHz operation | Acceptable for lower-frequency (<150 kHz), cost-sensitive industrial SMPS where thermal margin exists |
| IRF3205PBF | RDS(ON) = 8.0 mΩ (typ.), but VDSS = 55 V only; TO-220; Qg = 71 nC | Not rated for 120 V bus; unsuitable for 48 V systems with surge tolerance requirements | Only viable in 24 V or lower bus applications where lower RDS(ON) justifies reduced voltage margin |
Compared with STP60NF12 and IRF3205PBF, TK32E12N1,S1X offers optimal balance of 120 V rating, 11 mΩ on-resistance, and 34 nC gate charge-making it preferred for high-efficiency, medium-frequency industrial power stages where both voltage headroom and thermal performance are critical.
Availability
TK32E12N1,S1X is available at Aetrix Electronics and suitable for industrial DC-DC converters, brushless DC motor drives, and server voltage regulators requiring stable component supply across multi-year production cycles.
Supply support for TK32E12N1,S1X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors and power devices, with emphasis on high-reliability industrial and automotive-grade components.
TK32E12N1,S1X belongs to Toshiba's U-MOSⅧ-H power MOSFET family, engineered specifically for high-current, high-efficiency switching in industrial power conversion and motor control systems.
FAQ
What is the maximum continuous drain current rating for TK32E12N1,S1X?
The TK32E12N1,S1X is rated for 60 A DC drain current at Tc = 25 °C with proper heatsinking. Derating applies above 25 °C case temperature per the Rth(ch–c) = 1.27 °C/W thermal resistance curve. At Tc = 100 °C, the usable ID drops to approximately 32 A to maintain Tch ≤ 150 °C. This rating assumes adequate PCB copper area and thermal interface material for the TO-220 drain tab.
Does TK32E12N1,S1X support logic-level gate drive?
TK32E12N1,S1X has a gate threshold voltage range of 2.0–4.0 V, but it is not a true logic-level MOSFET. To achieve its specified RDS(ON) = 11.0 mΩ (typ.), a VGS of 10 V is required. While it will turn on with 3.3 V or 5 V gate signals, RDS(ON) rises significantly-exceeding 40 mΩ at VGS = 5 V-so external gate boosting or level-shifting is recommended for full-performance operation.
What is the significance of the "S1X" suffix in TK32E12N1,S1X?
The "S1X" suffix in TK32E12N1,S1X denotes Toshiba's standard tape-and-reel packaging variant for surface-mount compatible automated assembly, though the device itself remains a through-hole TO-220 part. It indicates compliance with JEDEC J-STD-020 moisture sensitivity level (MSL) requirements and includes standardized reel quantity, orientation, and labeling per Toshiba's ordering conventions-not a functional or electrical variant.
Can TK32E12N1,S1X replace older U-MOS VI or VII devices in existing designs?
Yes, TK32E12N1,S1X is a direct drop-in replacement for earlier Toshiba U-MOS VI and VII equivalents such as TK31E12N1 in identical TO-220 packages. It maintains identical pinout, absolute maximum ratings, and thermal footprint, while offering improved RDS(ON), lower gate charge, and enhanced avalanche ruggedness-enabling efficiency gains without layout changes.
Is the body diode in TK32E12N1,S1X suitable for synchronous rectification?
The body diode in TK32E12N1,S1X has trr = 73 ns and Qrr = 160 nC under specified test conditions (IDR = 32 A, dI/dt = 100 A/µs). While usable in non-critical synchronous rectification, its recovery characteristics are less optimized than dedicated sync-FETs. For high-frequency (>300 kHz) or high-efficiency designs, pairing with an external Schottky or using a dedicated low-Qrr MOSFET is recommended-but TK32E12N1,S1X remains viable in 100–200 kHz industrial converters.
TK32E12N1,S1X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- U-MOSVIII-H
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 120 V
- Current - Continuous Drain (Id) @ 25°C:
- 60A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 13.8mOhm @ 16A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 500µA
- Gate Charge (Qg) (Max) @ Vgs:
- 34 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2000 pF @ 60 V
- FET Feature:
- -
- Power Dissipation (Max):
- 98W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220
TK32E12N1,S1X FAQ
1.How can I place an order for TK32E12N1,S1X through Aetrix?
Please submit a Request for Quotation (RFQ) for TK32E12N1,S1X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TK32E12N1,S1X reliable?
The price and inventory of TK32E12N1,S1X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK32E12N1,S1X is usually 5 days.
3.What payment methods are accepted for TK32E12N1,S1X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK32E12N1,S1X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TK32E12N1,S1X?
TK32E12N1,S1X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TK32E12N1,S1X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TK32E12N1,S1X?
For technical support, including TK32E12N1,S1X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK32E12N1,S1X requirements.
6.How does Aetrix verify that TK32E12N1,S1X is sourced from the original manufacturer or authorized distributors?
All TK32E12N1,S1X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK32E12N1,S1X meets industry standards.
7.What is the process for return or replacement of TK32E12N1,S1X?
All TK32E12N1,S1X units undergo pre-shipment inspection (PSI). If there is an issue with TK32E12N1,S1X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TK32E12N1,S1X part is unused and in its original packaging.
Return procedure for TK32E12N1,S1X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TK32E12N1,S1X Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

