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Toshiba Semiconductor and Storage TK40E10N1,S1X

Part No.:
TK40E10N1,S1X
Manufacturer:
Toshiba Semiconductor and Storage
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixTK40E10N1,S1X.pdf
Description:
MOSFET N CH 100V 90A TO220
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:24

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Product details

Overview

TK40E10N1,S1X from Toshiba is a silicon N-channel power MOSFET in U-MOSⅧ-H process, designed as a high-current switching element in DC-DC converters and motor drives. It delivers 90 A DC drain current, 100 V drain-source breakdown voltage, and ultra-low 6.8 mΩ typical RDS(ON) at VGS = 10 V for efficient high-power regulation.

For engineers reviewing the TK40E10N1,S1X datasheet, TK40E10N1,S1X pinout, TK40E10N1,S1X application, or TK40E10N1,S1X equivalent, key selection criteria include avalanche energy rating (74 mJ), thermal resistance (0.99 °C/W channel-to-case), gate charge (49 nC), and TO-220 package compatibility with heatsink mounting.

Technical Context

This MOSFET employs Toshiba's U-MOSⅧ-H trench-gate structure to achieve low on-resistance and fast switching with controlled gate charge distribution. Its enhancement-mode operation (Vth = 2.0–4.0 V) ensures reliable turn-on under standard logic-level gate drive, while integrated body diode supports synchronous rectification and freewheeling in buck and half-bridge topologies.

The device features rated single-pulse avalanche energy of 74 mJ at Tch = 25 °C and supports pulsed drain currents up to 171 A. Thermal design is enabled by its 0.99 °C/W channel-to-case resistance when mounted on a heatsink, and its gate threshold voltage remains stable across temperature per Figure 8.9.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS100 V - Supports input rails up to 80 V in industrial DC-DC converters with margin against transients.
RDS(ON) (typ.)6.8 mΩ @ VGS = 10 V - Enables <1.4 W conduction loss at 60 A, reducing heatsink requirements.
ID (DC)90 A @ Tc = 25 °C - Sustains continuous load current in high-power motor control and server VRMs.
EAS74 mJ - Withstands inductive switching surges without failure in hard-switched flyback or LLC resonant converters.
Qg49 nC - Matches gate drivers capable of ≥2 A peak output for <60 ns turn-on time in 100 kHz+ applications.
Ciss3000 pF - Determines Miller effect and gate drive power; requires ≥1 W driver dissipation at 500 kHz switching.
Rth(ch-c)0.99 °C/W - Enables 126 W power dissipation with ≤125 °C temperature rise above heatsink surface.

Pinout & Package

TK40E10N1,S1X is housed in a TO-220 package (TOSHIBA designation: 2-10X1A), with exposed drain tab serving as both electrical terminal and thermal interface to heatsink. Weight is 1.93 g (typ.).

Pin/TerminalCircuit RoleDesign Meaning
1GateControl terminal requiring 10 V drive for full enhancement; sensitive to ESD-must be handled with grounded tools.
2Drain (heatsink)Main high-side current path and primary thermal conduction path to heatsink; electrically connected to metal tab.
3SourceReference node for gate drive and current sensing; connects to low-side switch or ground return path.

Key Features

FeatureDesign Value
U-MOSⅧ-H trench processDelivers 6.8 mΩ RDS(ON) in TO-220, enabling higher current density than planar MOSFETs without die size increase.
Low Qgd/Qg ratio14/49 nC = 0.29 - Reduces Miller-induced switching delay and improves controllability in high-dV/dt environments.
Body diode trr67 ns - Limits reverse recovery losses in synchronous rectifier mode, supporting >200 kHz operation.
Avalanche-ratedGuaranteed 74 mJ single-pulse energy - Eliminates need for external snubbers in inductive load switching.
Enhancement-mode Vth2.0–4.0 V - Ensures turn-off at 0 V gate bias and compatibility with 3.3 V/5 V microcontroller outputs.

Applications

Server Voltage Regulator ModulesIndustrial Motor Drives

Use Scenario: High-efficiency 12 V input → 0.8–1.8 V output VRM for CPU/GPU power delivery in data center servers.

IC Role / Device Role / Timing Role: High-side synchronous rectifier switch operating at 300–600 kHz with precise dead-time control.

Use Value: 6.8 mΩ RDS(ON) reduces conduction loss by >35% vs. legacy 12 mΩ MOSFETs, improving VRM efficiency from 92% to 94.5% at 60 A.

Use Scenario: Three-phase inverter stage driving 3 kW AC induction motors in CNC machinery and pumps.

IC Role / Device Role / Timing Role: Low-side switching element in IGBT/MOSFET hybrid inverter, handling 90 A continuous phase current.

Use Value: 0.99 °C/W Rth(ch-c) allows direct heatsink mounting without thermal interface pads, simplifying mechanical design and lowering thermal impedance by 40%.

Solar MicroinvertersEV Onboard Chargers

Use Scenario: DC-AC H-bridge switching stage converting 40–60 V PV string output to 230 VAC grid-synchronized output.

IC Role / Device Role / Timing Role: Fast-switching bridge leg with body-diode commutation during zero-voltage switching transitions.

Use Value: 67 ns reverse recovery time and 130 nC Qrr minimize switching losses during soft-commutation, increasing inverter efficiency by 1.2% at full load.

Use Scenario: Isolated DC-DC stage in 6.6 kW OBC converting 400 V battery to 14 V auxiliary supply.

IC Role / Device Role / Timing Role: Primary-side switch in phase-shifted full-bridge topology operating at 100–150 kHz.

Use Value: 74 mJ avalanche energy rating withstands reflected voltage spikes during transformer saturation events, eliminating need for clamping circuits.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP90NF10RDS(ON) = 10.5 mΩ (typ.), higher Qg = 120 nC, TO-220 packageLower switching speed; suited for <100 kHz hard-switched SMPS where conduction loss dominatesSelect STP90NF10 only if gate drive capability is limited and thermal margin exceeds 25 °C.
IRF540NRDS(ON) = 44 mΩ (typ.), lower VDSS = 100 V, same TO-220 footprintNot suitable for high-current (>30 A) or high-frequency (>50 kHz) use due to excessive conduction loss and slow switchingIRF540N may serve as a low-cost prototyping substitute but requires full thermal and efficiency revalidation.

Compared with STP90NF10 and IRF540N, TK40E10N1,S1X offers superior conduction efficiency and switching performance in high-power, high-frequency applications-its 6.8 mΩ RDS(ON) and 49 nC Qg enable 30% lower total power loss in 300 kHz VRMs, justifying its use where thermal headroom and efficiency are critical.

Availability

TK40E10N1,S1X is available at Aetrix Electronics and suitable for server VRMs, industrial motor drives, solar microinverters, and EV onboard chargers requiring stable component supply and long-term industrial lifecycle support.

Supply support for TK40E10N1,S1X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on industrial reliability and energy efficiency.

The TK40E10N1,S1X belongs to Toshiba's U-MOSⅧ-H power MOSFET family, engineered specifically for high-current, high-frequency switching in power conversion systems where low RDS(ON), robust avalanche capability, and thermal performance are essential.

FAQ

What is the maximum continuous drain current rating for TK40E10N1,S1X?

The TK40E10N1,S1X is rated for 90 A DC drain current at case temperature (Tc) = 25 °C. This rating assumes proper heatsinking to maintain channel temperature ≤150 °C. At higher case temperatures, derating applies per Figure 8.11; for example, at Tc = 100 °C, the usable DC current drops to approximately 45 A. Always verify thermal design using Rth(ch-c) = 0.99 °C/W.

Does TK40E10N1,S1X support logic-level gate drive?

TK40E10N1,S1X is not a logic-level MOSFET-it requires 10 V gate-source voltage for specified RDS(ON) performance. Its gate threshold voltage (Vth) ranges from 2.0 to 4.0 V, meaning it will begin conducting at 3.3 V but will not achieve low on-resistance without ≥10 V drive. For true logic-level operation, consider alternatives like the TK40E10N1,S1X's companion part TK35E10N1 with lower Vth spec.

What is the avalanche energy rating of TK40E10N1,S1X and how is it tested?

The TK40E10N1,S1X has a guaranteed single-pulse avalanche energy rating of 74 mJ at Tch = 25 °C, tested per JEDEC JESD24-11 with VDD = 80 V, L = 35.9 µH, and IAR = 40 A. This rating validates its ability to absorb inductive energy during unclamped inductive switching events without failure, making it suitable for flyback, forward, and half-bridge topologies where voltage overshoot may occur.

Can TK40E10N1,S1X be used in parallel configurations?

Yes, TK40E10N1,S1X can be paralleled for higher current capacity, but careful attention must be paid to gate drive layout symmetry, source inductance matching, and thermal coupling. Its positive temperature coefficient for RDS(ON) (per Figure 8.6) promotes current sharing, but mismatched gate resistances or PCB trace lengths can cause imbalance. Use individual gate resistors and Kelvin source connections to ensure stable parallel operation.

Is TK40E10N1,S1X RoHS compliant and halogen-free?

Yes, TK40E10N1,S1X complies with EU RoHS Directive 2011/65/EU and is halogen-free per Toshiba's environmental specifications. The device uses lead-free plating and meets JEDEC JS-001 ESD classification (HBM Class 2, ≥2 kV). Full compliance documentation-including substance declarations and test reports-is available through Toshiba's official product page or authorized distributors like Digi-Key and Mouser.

TK40E10N1,S1X Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
U-MOSVIII-H
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
90A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
8.2mOhm @ 20A, 10V
Vgs(th) (Max) @ Id:
4V @ 500µA
Gate Charge (Qg) (Max) @ Vgs:
49 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
3000 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
126W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220

TK40E10N1,S1X FAQ

1.How can I place an order for TK40E10N1,S1X through Aetrix?

Please submit a Request for Quotation (RFQ) for TK40E10N1,S1X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TK40E10N1,S1X reliable?

The price and inventory of TK40E10N1,S1X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK40E10N1,S1X is usually 5 days.

3.What payment methods are accepted for TK40E10N1,S1X?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK40E10N1,S1X transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TK40E10N1,S1X?

TK40E10N1,S1X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TK40E10N1,S1X order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TK40E10N1,S1X?

For technical support, including TK40E10N1,S1X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK40E10N1,S1X requirements.

6.How does Aetrix verify that TK40E10N1,S1X is sourced from the original manufacturer or authorized distributors?

All TK40E10N1,S1X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK40E10N1,S1X meets industry standards.

7.What is the process for return or replacement of TK40E10N1,S1X?

All TK40E10N1,S1X units undergo pre-shipment inspection (PSI). If there is an issue with TK40E10N1,S1X, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TK40E10N1,S1X part is unused and in its original packaging.

Return procedure for TK40E10N1,S1X:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TK40E10N1,S1X Tags

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