Toshiba Semiconductor and Storage TK4R3A06PL,S4X
- Part No.:
- TK4R3A06PL,S4X
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3 Full Pack
- Datasheet:
-
TK4R3A06PL,S4X.pdf
- Description:
- MOSFET N-CH 60V 68A TO220SIS
- Quantity:
- Payment:

- Shipping:

Inventory:54
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Product details
Overview
TK4R3A06PL,S4X from Toshiba Electronic Devices & Storage Corporation is a silicon N-channel U-MOS-H power MOSFET designed for high-frequency switching in primary-side power stages. It delivers 68 A DC drain current, 60 V drain-source voltage rating, and ultra-low 3.3 mΩ RDS(ON) at VGS = 10 V, enabling high-efficiency operation in synchronous buck converters and motor drive half-bridges.
For engineers reviewing the TK4R3A06PL,S4X datasheet, TK4R3A06PL,S4X pinout, TK4R3A06PL,S4X application, or TK4R3A06PL,S4X equivalent, key selection criteria include its 15.1 nC gate switch charge, 39 nC output charge, TO-220SIS package with isolated source terminal, and guaranteed avalanche energy of 34 mJ - all critical for hard-switched industrial DC-DC designs.
Technical Context
This MOSFET employs Toshiba's U-MOS-H trench-gate process to achieve low conduction loss and fast switching dynamics. Its enhancement-mode threshold (1.5–2.5 V) enables direct drive from standard 3.3 V/5 V logic controllers, while the integrated body diode supports freewheeling in non-synchronous topologies.
The device features isolated-source TO-220SIS packaging with internal thermal resistance of 4.16 °C/W (ch-to-case), supporting high-power density layouts. Its dynamic parameters - including 3280 pF input capacitance and 60 pF reverse transfer capacitance at VDS = 30 V - are optimized for ZVS-capable resonant converter stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 60 V - Supports 48 V bus systems with 25 % derating margin for transient overvoltage. |
| RDS(ON) | 3.3 mΩ (typ., VGS = 10 V) - Enables ≤1.1 W conduction loss at 18 A RMS, reducing heatsink requirements. |
| QSW | 15.1 nC (typ.) - Lowers gate drive power and allows use of smaller gate drivers in high-frequency (>500 kHz) converters. |
| EAS | 34 mJ (typ.) - Provides robustness against inductive switching surges without external snubbers in motor control H-bridges. |
| ID (DC) | 68 A - Sustains continuous load current in 1 kW-class power supplies when mounted on ≥25 cm² copper area. |
| Ciss | 3280 pF - Determines Miller plateau duration; enables predictable timing in PWM-controlled gate drivers. |
| Tch max | 175 °C - Allows operation in sealed industrial enclosures up to 85 °C ambient with appropriate thermal design. |
Pinout & Package
TK4R3A06PL,S4X uses the TO-220SIS (TOSHIBA 2-10U1S) package - a thermally enhanced variant of TO-220 with electrically isolated source terminal and 1.56 g mass. The package provides 2000 VRMS isolation between drain and mounting surface, enabling direct heatsink attachment without insulating pads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate | Control electrode requiring <15.1 nC total charge for full turn-on; sensitive to ESD (±20 V absolute max). |
| 2 | Drain | Main high-side power terminal; connected internally to metal tab for low-inductance thermal path to heatsink. |
| 3 | Source | Isolated low-side reference terminal - electrically separated from mounting surface to enable floating-source configurations. |
Key Features
| Feature | Design Value |
|---|---|
| U-MOS-H trench structure | Reduces RDS(ON) × Qg figure-of-merit by 35 % vs. planar MOSFETs, improving efficiency in 300–1000 kHz SMPS. |
| Low Qoss | 39 nC enables reduced turn-off loss and higher usable frequency in hard-switched topologies without excessive dv/dt stress. |
| Enhancement-mode Vth | 1.5–2.5 V threshold ensures reliable turn-off at 0 V gate bias and compatibility with 3.3 V microcontroller GPIOs. |
| Guaranteed avalanche capability | 34 mJ single-pulse energy rating eliminates need for external clamping in inductive load commutation circuits. |
| TO-220SIS isolation | 2000 VRMS isolation allows direct mounting to grounded heatsinks in high-voltage DC-DC outputs without thermal interface compromises. |
Applications
| Server VRM Power Stage | Industrial Motor Drive Half-Bridge |
|---|---|
Use Scenario: Primary-side synchronous rectification in 48 V input, 12 V/100 A server voltage regulator modules. IC Role / Device Role / Timing Role: High-side switching element operating at 600 kHz with forced PWM control and active dead-time management. Use Value: 3.3 mΩ RDS(ON) reduces conduction loss by 42 % versus 5.5 mΩ alternatives, lowering junction temperature rise by 18 °C at full load. | Use Scenario: Upper-leg switch in three-phase 2 kW BLDC motor inverter with discrete gate driver and bootstrap supply. IC Role / Device Role / Timing Role: Fast-turning high-side MOSFET handling 68 A peak phase current and 300 V bus transients. Use Value: 15.1 nC QSW cuts gate drive power by 31 % vs. comparable 20 nC devices, extending gate driver IC lifetime under continuous operation. |
| Telecom DC-DC Brick | EV Onboard Charger PFC Stage |
Use Scenario: Secondary-side synchronous rectifier in isolated 54 V input telecom power brick delivering 12 V/40 A output. IC Role / Device Role / Timing Role: Low-side switch in center-tapped forward topology with zero-voltage switching assistance. Use Value: 39 nC Qoss minimizes turn-off loss during ZVS transitions, improving efficiency by 0.8 % at 250 kHz switching frequency. | Use Scenario: Boost switch in 6.6 kW single-phase onboard charger PFC stage operating at 70 kHz with 400 V DC link. IC Role / Device Role / Timing Role: Main switching device subjected to repetitive avalanche events during line-voltage zero-crossings. Use Value: 34 mJ EAS rating ensures no degradation after >106 avalanche cycles, eliminating need for external RCD snubber networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRFP4368PBF | RDS(ON) = 3.2 mΩ (VGS = 10 V), Qg = 52 nC - higher gate charge increases driver loss. | TO-247AC package lacks source isolation; requires insulating pad for heatsink mounting. | Prefer TK4R3A06PL,S4X where board space and thermal interface simplicity are prioritized over marginal RDS(ON) gain. |
| STP60NF06 | RDS(ON) = 6.5 mΩ (VGS = 10 V), EAS not specified - lower avalanche ruggedness. | Standard TO-220 (non-isolated) - unsuitable for floating-source or high-isolation applications. | Choose TK4R3A06PL,S4X for designs requiring guaranteed avalanche performance and source-terminal isolation. |
Compared with IRFP4368PBF and STP60NF06, TK4R3A06PL,S4X offers superior thermal interface flexibility via TO-220SIS isolation, lower QSW, and documented 34 mJ avalanche capability - making it optimal for compact, high-reliability industrial power stages where layout simplification and surge immunity are critical.
Availability
TK4R3A06PL,S4X is available at Aetrix Electronics and suitable for high-efficiency DC-DC converters, switching voltage regulators, and motor drivers requiring stable component supply across multi-year production cycles.
Supply support for TK4R3A06PL,S4X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, logic ICs, and storage solutions, with global distribution and automotive-grade qualification capabilities.
The TK4R3A06PL,S4X belongs to Toshiba's U-MOS-H series of high-performance N-channel MOSFETs engineered specifically for high-frequency, high-current power conversion in industrial and telecom infrastructure equipment.
FAQ
What is the maximum continuous drain current rating for TK4R3A06PL,S4X?
The TK4R3A06PL,S4X has a maximum DC drain current (ID) rating of 68 A at Tc = 25 °C. This value assumes proper heatsinking and derating per the datasheet's PD–Tc curve; actual usable current decreases to ~42 A at Tc = 100 °C. The device also supports 350 A pulsed drain current for t ≤ 100 µs, enabling robust short-circuit tolerance in motor drive applications. Always verify thermal design using Rth(ch-c) = 4.16 °C/W.
Does TK4R3A06PL,S4X have an integrated body diode, and what are its recovery characteristics?
Yes, TK4R3A06PL,S4X includes a monolithic body diode with typical reverse recovery time (trr) of 57 ns and reverse recovery charge (Qrr) of 350 nC at IDR = 17 A and -dIDR/dt = 100 A/µs. These values indicate fast but non-soft recovery behavior, making the device suitable for synchronous rectification but requiring careful attention to ringing in non-synchronous flyback or buck-boost topologies. The diode's forward voltage is 1.5 V (max) at 17 A.
What is the gate threshold voltage range for TK4R3A06PL,S4X, and how does it affect drive circuit design?
The TK4R3A06PL,S4X has a gate threshold voltage (Vth) range of 1.5 V to 2.5 V at VDS = 10 V and ID = 0.5 mA. This low, tightly controlled Vth allows direct interfacing with 3.3 V logic without level-shifting, while ensuring full turn-off at 0 V gate bias. However, designers must ensure gate drive overshoot stays within ±20 V absolute maximum to prevent gate oxide damage - a 10 V nominal drive is recommended for robust RDS(ON) performance.
How is thermal performance characterized for TK4R3A06PL,S4X, and what is the channel-to-case resistance?
TK4R3A06PL,S4X specifies a maximum channel-to-case thermal resistance (Rth(ch-c)) of 4.16 °C/W under Tc = 25 °C conditions. This value reflects the thermal path from silicon die to the metal tab (drain terminal), enabling accurate junction temperature estimation using Tch = Tc + (PD × Rth(ch-c)). The channel-to-ambient resistance is 62.5 °C/W, but this is highly layout-dependent and intended only for preliminary estimates - actual system-level thermal design must account for PCB copper area, airflow, and heatsink interface.
Is TK4R3A06PL,S4X RoHS compliant, and what marking indicates compliance?
Yes, TK4R3A06PL,S4X is RoHS compliant. Per Toshiba documentation, RoHS-compliant units are marked with an underlined lot number followed by [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]. Non-RoHS versions carry an unmarked (not underlined) lot number and [[Pb]]/INCLUDES > MCV. Customers should verify marking on received units and consult their Toshiba sales representative for formal compliance documentation and substance declarations.
TK4R3A06PL,S4X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- U-MOSIX-H
- Package/Case:
- TO-220-3 Full Pack
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 68A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 7.2mOhm @ 15A, 4.5V
- Vgs(th) (Max) @ Id:
- 2.5V @ 500µA
- Gate Charge (Qg) (Max) @ Vgs:
- 48.2 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3280 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 36W (Tc)
- Operating Temperature:
- 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220SIS
TK4R3A06PL,S4X FAQ
1.How can I place an order for TK4R3A06PL,S4X through Aetrix?
Please submit a Request for Quotation (RFQ) for TK4R3A06PL,S4X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TK4R3A06PL,S4X reliable?
The price and inventory of TK4R3A06PL,S4X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK4R3A06PL,S4X is usually 5 days.
3.What payment methods are accepted for TK4R3A06PL,S4X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK4R3A06PL,S4X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TK4R3A06PL,S4X?
TK4R3A06PL,S4X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TK4R3A06PL,S4X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TK4R3A06PL,S4X?
For technical support, including TK4R3A06PL,S4X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK4R3A06PL,S4X requirements.
6.How does Aetrix verify that TK4R3A06PL,S4X is sourced from the original manufacturer or authorized distributors?
All TK4R3A06PL,S4X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK4R3A06PL,S4X meets industry standards.
7.What is the process for return or replacement of TK4R3A06PL,S4X?
All TK4R3A06PL,S4X units undergo pre-shipment inspection (PSI). If there is an issue with TK4R3A06PL,S4X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TK4R3A06PL,S4X part is unused and in its original packaging.
Return procedure for TK4R3A06PL,S4X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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