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Toshiba Semiconductor and Storage TK56E12N1,S1X

Part No.:
TK56E12N1,S1X
Manufacturer:
Toshiba Semiconductor and Storage
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixTK56E12N1,S1X.pdf
Description:
MOSFET N CH 120V 56A TO-220
Quantity:
Payment:
Payment
Shipping:
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Inventory:52

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Product details

Overview

TK56E12N1,S1X from Toshiba is a silicon N-channel power MOSFET in the U-MOSⅧ-H series, designed as a high-current switching element in DC-DC converters and motor drives. It delivers 112 A DC drain current at Tc = 25°C, features 5.8 mΩ typ. RDS(ON) at VGS = 10 V, and supports 120 V drain-source breakdown voltage - enabling efficient operation in 48 V industrial power rails.

For engineers reviewing the TK56E12N1,S1X datasheet, TK56E12N1,S1X pinout, TK56E12N1,S1X application, or TK56E12N1,S1X equivalent, key selection criteria include its TO-220 package thermal performance (Rth(ch-c) = 0.74°C/W), avalanche ruggedness (EAS = 110 mJ), and gate threshold range (2.0–4.0 V) for reliable PWM control in high-efficiency SMPS designs.

Technical Context

This MOSFET employs Toshiba's U-MOSⅧ-H trench-gate process to achieve low on-resistance and fast switching with controlled Qg (69 nC typ.) and low Crss (19 pF). Its internal body diode exhibits trr = 86 ns and Qrr = 210 nC under specified conditions, supporting synchronous rectification and hard-switched topologies.

The device operates in enhancement mode with Vth defined at ID = 1.0 mA, and its safe operating area (SOA) is guaranteed up to 150°C channel temperature. Absolute maximum ratings are limited by silicon capability (e.g., 100 A package limit vs. 112 A silicon limit), requiring heatsink design per Rth(ch-a) = 2.77°C/W condition.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS120 V - Supports input rails up to 48 V nominal with ≥2× safety margin against transients.
RDS(ON) (typ.)5.8 mΩ at VGS = 10 V - Enables <1.6 W conduction loss at 18 A continuous, critical for high-efficiency buck converters.
ID (DC)112 A at Tc = 25°C - Requires active heatsinking; usable up to 56 A without forced cooling in typical PCB layouts.
EAS110 mJ - Withstands single-pulse inductive energy in motor drive freewheeling or relay snubbing without failure.
Qg69 nC typ. - Determines gate driver power requirement; compatible with standard 1–2 A peak drivers at ≤500 kHz switching.
tr/tf20/23 ns - Enables fast turn-on/turn-off transitions, reducing switching losses in high-frequency SMPS (e.g., >200 kHz).
Vth2.0–4.0 V - Ensures clean logic-level gate drive compatibility with 3.3 V or 5 V microcontrollers and PWM ICs.

Pinout & Package

TK56E12N1,S1X is housed in a through-hole TO-220 package (Toshiba designation: 2-10X1A), with the drain connected internally to the metal tab for direct heatsink mounting. The package weighs 1.93 g and provides robust thermal conduction via the case interface.

Pin/TerminalCircuit RoleDesign Meaning
1 (Lead)GateControl terminal; requires low-impedance drive path to minimize ringing and ensure full enhancement within Vth window.
2 (Tab)Drain (Heatsink)High-current power terminal and primary thermal path; electrically connected to drain; must be isolated from chassis unless circuit topology permits.
3 (Lead)SourceReference node for gate drive and current sensing; connects to low-side return path in buck or half-bridge configurations.

Key Features

FeatureDesign Value
U-MOSⅧ-H trench structureReduces RDS(ON) × Qg figure-of-merit by ~25% vs. prior U-MOS generations, improving efficiency in high-frequency switching.
Low Crss (19 pF)Minimizes Miller-induced shoot-through risk in bridge configurations and improves dv/dt immunity during hard switching.
Guaranteed avalanche energy (110 mJ)Validated single-pulse rating enables elimination of external clamping circuits in inductive load switching applications.
Enhancement-mode Vth range2.0–4.0 V ensures turn-on margin across temperature and process variation, supporting stable gate biasing without external level-shifting.
Body diode trr = 86 nsEnables use in quasi-resonant or synchronous rectifier roles where reverse recovery behavior directly impacts EMI and loss.

Applications

Industrial DC-DC ConvertersMotor Drive Half-Bridge

Use Scenario: 48 V input, 12 V output synchronous buck converter delivering 60 A to PLC I/O modules.

IC Role / Device Role / Timing Role: High-side power switch operating at 300 kHz with gate-driven synchronous rectification.

Use Value: 5.8 mΩ RDS(ON) limits conduction loss to <2.0 W at full load, while 69 nC Qg allows efficient driving with TC4427 gate driver.

Use Scenario: 24–48 V BLDC motor controller for automated guided vehicles (AGVs), using six-phase commutation.

IC Role / Device Role / Timing Role: Low-side switch in three-phase inverter leg, handling 56 A pulsed current with 219 A peak surge capability.

Use Value: 110 mJ EAS withstands back-EMF spikes during abrupt current interruption; TO-220 tab enables direct heatsink mounting on aluminum chassis.

Server VRM Power StagesTelecom Rectifier Modules

Use Scenario: Multiphase CPU core voltage regulator in edge server, operating at 500 kHz with 30 A per phase.

IC Role / Device Role / Timing Role: Synchronous FET in interleaved buck stage, driven by digital PWM controller with adaptive dead-time control.

Use Value: Low Crss (19 pF) reduces gate-drive coupling during high dv/dt transitions, minimizing false turn-on and improving phase current balance.

Use Scenario: 48 V telecom rectifier with hold-up capacitor support, requiring high-reliability 120 V switches for AC-DC front-end PFC and DC-DC isolation stages.

IC Role / Device Role / Timing Role: Primary-side switch in LLC resonant converter, conducting 112 A DC with 150°C channel temperature derating.

Use Value: Rth(ch-c) = 0.74°C/W enables 100 W dissipation with ≤74°C case rise, simplifying thermal design versus D2PAK alternatives.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP110N12F7RDS(ON) = 6.0 mΩ (typ.), Qg = 72 nC, TO-220 package, same VDSS and ID.Slightly higher gate charge increases driver loss; identical thermal footprint allows drop-in replacement with minor layout review.Preferred when STMicroelectronics supply chain alignment or automotive qualification (AEC-Q101) is required.
IRFP4668PBFRDS(ON) = 5.2 mΩ (typ.), Qg = 105 nC, TO-247 package, VDSS = 120 V, ID = 110 A.Lower RDS(ON) improves conduction loss but higher Qg demands stronger gate drive; TO-247 requires PCB footprint change.Select when lower on-resistance justifies larger package and higher drive power, e.g., in high-temperature ambient environments.

Compared with STP110N12F7, TK56E12N1,S1X offers marginally better RDS(ON) and lower Qg, reducing both conduction and switching losses; versus IRFP4668PBF, it trades 0.6 mΩ RDS(ON) for 36 nC lower Qg and TO-220 compatibility - favoring cost-sensitive, space-constrained industrial SMPS over ultra-low-loss designs.

Availability

TK56E12N1,S1X is available at Aetrix Electronics and suitable for industrial DC-DC converters, motor drive inverters, and telecom rectifier modules requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for TK56E12N1,S1X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs with emphasis on energy efficiency, reliability, and industrial-grade performance.

The TK56E12N1,S1X belongs to Toshiba's U-MOSⅧ-H power MOSFET family, engineered specifically for high-current, high-voltage switching in industrial power supplies and motor control systems where thermal robustness and avalanche capability are critical.

FAQ

What is the maximum continuous drain current rating for TK56E12N1,S1X?

The TK56E12N1,S1X is rated for 112 A DC drain current at case temperature Tc = 25°C. This rating assumes ideal heatsinking; actual usable current depends on thermal design - for example, at Tc = 100°C, the derated ID drops to approximately 65 A per the SOA curve. Always verify channel temperature remains ≤150°C using Rth(ch-c) = 0.74°C/W in thermal calculations.

Does TK56E12N1,S1X have avalanche capability, and how is it specified?

Yes, TK56E12N1,S1X has guaranteed single-pulse avalanche energy of 110 mJ (EAS) at Tch = 25°C, tested with VDD = 80 V, L = 34.4 µH, and IAR = 56 A. This rating validates ruggedness against inductive switching stress in motor drives and relay loads. Repeated avalanche events are not guaranteed and require system-level analysis per Toshiba's Reliability Handbook.

What is the gate threshold voltage range for TK56E12N1,S1X, and why does it matter?

The TK56E12N1,S1X has a gate threshold voltage (Vth) range of 2.0–4.0 V at VDS = 10 V and ID = 1.0 mA. This wide range ensures reliable turn-on across process variation and temperature extremes. Designers must ensure gate drive exceeds 4.0 V to guarantee full enhancement - especially critical in 3.3 V logic-driven applications where marginal bias may cause partial conduction and overheating.

Can TK56E12N1,S1X be used in synchronous rectification topologies?

Yes, TK56E12N1,S1X supports synchronous rectification due to its characterized body diode parameters: reverse recovery time trr = 86 ns and reverse recovery charge Qrr = 210 nC at specified test conditions. These values enable predictable timing control in LLC and forward converters. However, its relatively high Qrr means careful dead-time optimization is required to avoid cross-conduction losses in high-frequency designs.

Is TK56E12N1,S1X RoHS compliant and lead-free?

Yes, TK56E12N1,S1X is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. Toshiba confirms this status in its environmental compliance documentation. For full material declarations and exemption details (e.g., lead content in die attach), refer to Toshiba's official product environmental report for TK56E12N1,S1X, accessible via their semiconductor portal.

TK56E12N1,S1X Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
U-MOSVIII-H
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
120 V
Current - Continuous Drain (Id) @ 25°C:
56A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
7mOhm @ 28A, 10V
Vgs(th) (Max) @ Id:
4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs:
69 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
4200 pF @ 60 V
FET Feature:
-
Power Dissipation (Max):
168W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220

TK56E12N1,S1X FAQ

1.How can I place an order for TK56E12N1,S1X through Aetrix?

Please submit a Request for Quotation (RFQ) for TK56E12N1,S1X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TK56E12N1,S1X reliable?

The price and inventory of TK56E12N1,S1X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK56E12N1,S1X is usually 5 days.

3.What payment methods are accepted for TK56E12N1,S1X?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK56E12N1,S1X transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TK56E12N1,S1X?

TK56E12N1,S1X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TK56E12N1,S1X order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TK56E12N1,S1X?

For technical support, including TK56E12N1,S1X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK56E12N1,S1X requirements.

6.How does Aetrix verify that TK56E12N1,S1X is sourced from the original manufacturer or authorized distributors?

All TK56E12N1,S1X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK56E12N1,S1X meets industry standards.

7.What is the process for return or replacement of TK56E12N1,S1X?

All TK56E12N1,S1X units undergo pre-shipment inspection (PSI). If there is an issue with TK56E12N1,S1X, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TK56E12N1,S1X part is unused and in its original packaging.

Return procedure for TK56E12N1,S1X:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TK56E12N1,S1X Tags

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