Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Toshiba Semiconductor and Storage TK58E06N1,S1X

Part No.:
TK58E06N1,S1X
Manufacturer:
Toshiba Semiconductor and Storage
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixTK58E06N1,S1X.pdf
Description:
MOSFET N-CH 60V 58A TO220
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,657

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

TK58E06N1,S1X from Toshiba Electronic Devices & Storage Corporation is a silicon N-channel power MOSFET in U-MOSⅧ-H process, designed as a high-current, low-RDS(ON) switching element for DC-DC converters and motor drives. It delivers 105 A (DC), 60 V VDSS, and typ. 4.4 mΩ RDS(ON) at VGS = 10 V, with TO-220 package and heatsink-connected drain terminal.

For engineers reviewing the TK58E06N1,S1X datasheet, TK58E06N1,S1X pinout, TK58E06N1,S1X application, or TK58E06N1,S1X equivalent, key selection criteria include avalanche energy rating (158 mJ), gate charge (46 nC), thermal resistance (1.13 °C/W ch-to-case), and safe operating area under pulsed conditions - all critical for high-efficiency, high-reliability power stage design.

Technical Context

This MOSFET employs Toshiba's U-MOSⅧ-H trench-gate structure to achieve low on-resistance while maintaining robust avalanche capability and fast switching performance. Its enhancement-mode threshold (2.0–4.0 V) ensures compatibility with standard 10 V gate drivers, and its rated 58 A pulsed drain current supports high peak-load operation in synchronous buck stages.

The device features integrated body diode with 63 ns reverse recovery time and 100 nC Qrr, enabling efficient freewheeling in hard-switched topologies. Thermal design is anchored by a channel-to-case resistance of 1.13 °C/W, requiring mechanical mounting to a heatsink via the drain tab (Pin 2) for sustained 105 A operation.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 60 V - Maximum blocking voltage before avalanche; defines upper limit for input voltage in 48 V bus applications.
RDS(ON) (typ.) 4.4 mΩ at VGS = 10 V - Enables <1.3 W conduction loss at 18 A RMS, critical for >95% efficiency in high-current POL converters.
ID (DC) 105 A - Sustained current rating at Tc = 25 °C with heatsink; requires thermal derating above 25 °C case temperature.
EAS 158 mJ - Single-pulse avalanche energy; allows reliable operation during inductive turn-off transients without external snubbers.
Qg 46 nC - Total gate charge determines driver strength requirement; compatible with medium-power gate drivers (e.g., TC4427, UCC27531).
Ciss 3400 pF - Input capacitance impacts gate drive loop stability and switching loss; necessitates careful PCB layout to minimize ringing.
Tch max 150 °C - Absolute maximum channel temperature; sets thermal design margin for reliability in industrial ambient conditions.

Pinout & Package

TK58E06N1,S1X is housed in a through-hole TO-220 package (TOSHIBA designation: 2-10X1A), with the drain terminal electrically and thermally connected to the metal tab for direct heatsink mounting. The package weighs 1.93 g and features standardized lead spacing for manual or wave soldering.

Pin/Terminal Circuit Role Design Meaning
1: Gate Control electrode Receives gate drive signal; requires ≤±20 V bias and ESD-safe handling due to gate oxide sensitivity.
2: Drain (heatsink) High-side power terminal Electrically tied to metal tab; must be isolated from chassis unless system ground is drain-referenced; primary thermal path to heatsink.
3: Source Power return / reference node Serves as local ground reference for gate drive; connects to low-side switch source or output in half-bridge configurations.

Key Features

Feature Design Value
U-MOSⅧ-H trench process Enables 4.4 mΩ RDS(ON) in TO-220 without sacrificing ruggedness - reduces conduction loss vs. older U-MOS generations.
158 mJ single-pulse avalanche energy Supports unclamped inductive switching in motor control and SMPS without external protection, simplifying BOM and layout.
Low Qgd/Qg ratio (11/46 nC) Improves Miller immunity and enables faster, more controllable turn-off - critical for ZVS/ZCS soft-switching topologies.
Body diode trr = 63 ns Minimizes reverse recovery losses and associated voltage spikes in synchronous rectification and freewheeling paths.
Enhancement-mode Vth = 2.0–4.0 V Ensures clean turn-on with standard logic-level or 10 V gate drivers; avoids partial-conduction risk seen in higher-threshold devices.

Applications

Server VRM Power Stage Industrial DC Motor Drive

Use Scenario: High-current, high-efficiency point-of-load regulation in dual-phase 48 V input server VRMs delivering up to 200 A to CPU/GPU.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier switch in interleaved buck converter; operates at 300–600 kHz with precise dead-time control.

Use Value: 4.4 mΩ RDS(ON) cuts conduction loss by ~35% vs. legacy 6.5 mΩ MOSFETs, directly improving VRM thermal margin and power density.

Use Scenario: H-bridge output stage in 24–48 V brushed DC motor controllers for factory automation actuators.

IC Role / Device Role / Timing Role: High-current quadrant-switching element; handles bidirectional 105 A DC load current and regenerative braking energy.

Use Value: 158 mJ EAS absorbs inductive kickback during rapid direction reversal, eliminating need for external flyback diodes or clamps.

Telecom Rectifier Module Renewable Energy Inverter DC Link

Use Scenario: Primary-side switching in 48 V telecom rectifiers converting AC mains to -48 V DC with >96% efficiency target.

IC Role / Device Role / Timing Role: Main switch in phase-shifted full-bridge topology; subjected to ZVS turn-on and hard turn-off stress.

Use Value: Low Ciss (3400 pF) and optimized Qgd reduce gate drive loss and improve ZVS window, extending efficiency across light-to-full load.

Use Scenario: DC link switching in 1–3 kW solar microinverters interfacing PV arrays to grid-tied AC output.

IC Role / Device Role / Timing Role: High-reliability switching element in boost stage; exposed to wide ambient temperature swings (-25 to +85 °C).

Use Value: 150 °C Tch max and 1.13 °C/W Rth(ch-c) enable stable operation at full rating in compact, fanless enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP110N6F7 RDS(ON) = 5.2 mΩ (typ.), EAS = 120 mJ, TO-220 package, same VDSS and ID. Lower avalanche robustness limits use in high-inductance motor drives without snubbing. Preferred where cost sensitivity outweighs need for highest avalanche margin.
IRF1404ZLPBF RDS(ON) = 4.7 mΩ (typ.), EAS = 140 mJ, TO-220, but higher Qg (71 nC) increases gate drive loss. Higher gate charge raises switching loss in high-frequency (>500 kHz) designs. Acceptable for lower-frequency (<300 kHz) applications where gate drive capability is constrained.

Compared with STP110N6F7 and IRF1404ZLPBF, TK58E06N1,S1X offers the lowest RDS(ON) and highest EAS among TO-220 60 V N-ch MOSFETs, making it optimal for high-efficiency, high-ruggedness power stages where thermal and transient margins are critical.

Availability

TK58E06N1,S1X is available at Aetrix Electronics and suitable for server VRMs, industrial motor drives, telecom rectifiers, and renewable energy inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for TK58E06N1,S1X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation is a global semiconductor manufacturer specializing in power devices, logic ICs, and storage solutions, with decades of expertise in discrete power MOSFET technology.

TK58E06N1,S1X belongs to Toshiba's U-MOSⅧ-H high-efficiency power MOSFET product line, engineered specifically for high-current, high-reliability DC-DC conversion and motor control applications demanding low conduction loss and strong avalanche capability.

FAQ

What is the maximum continuous drain current rating for TK58E06N1,S1X?

The TK58E06N1,S1X has a DC drain current rating of 105 A when case temperature (Tc) is maintained at 25 °C with an adequate heatsink. This rating drops with increasing Tc per the derating curve in Figure 8.11; at Tc = 100 °C, the usable ID is approximately 50 A. Always verify thermal design using Rth(ch-c) = 1.13 °C/W.

Does TK58E06N1,S1X support avalanche operation, and what is its rated energy?

Yes, TK58E06N1,S1X is fully rated for single-pulse avalanche operation with EAS = 158 mJ (Tch = 25 °C, VDD = 48 V). This specification is guaranteed per Toshiba's test conditions and enables reliable unclamped inductive switching - a key advantage over non-avalanche-rated MOSFETs in motor and SMPS designs.

What is the gate threshold voltage range for TK58E06N1,S1X, and how does it affect drive requirements?

The TK58E06N1,S1X has a gate threshold voltage Vth of 2.0–4.0 V (VDS = 10 V, ID = 0.5 mA), confirming enhancement-mode behavior. This range ensures full enhancement with standard 10 V gate drivers while avoiding unintended turn-on from noise; a minimum 5 V gate drive is recommended for robust operation across temperature and process variation.

How is thermal management implemented for TK58E06N1,S1X in high-power applications?

TK58E06N1,S1X uses Pin 2 (Drain) as the primary thermal path: the metal tab is electrically connected to drain and must be mounted to a heatsink using thermal interface material. With Rth(ch-c) = 1.13 °C/W, a 50 W power dissipation yields only ~56 °C temperature rise from case to channel - enabling compact thermal solutions when heatsink resistance is ≤2.0 °C/W.

Is TK58E06N1,S1X suitable for synchronous rectification, and what body diode parameters matter most?

Yes, TK58E06N1,S1X is well-suited for synchronous rectification due to its fast, low-loss body diode: trr = 63 ns and Qrr = 100 nC (IDR = 58 A, dI/dt = 100 A/µs). These values minimize reverse recovery loss and associated voltage overshoot, especially critical in high-frequency buck converters where diode conduction occurs during dead time.

TK58E06N1,S1X Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
U-MOSVIII-H
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
60 V
Current - Continuous Drain (Id) @ 25°C:
58A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
5.4mOhm @ 29A, 10V
Vgs(th) (Max) @ Id:
4V @ 500µA
Gate Charge (Qg) (Max) @ Vgs:
46 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
3400 pF @ 30 V
FET Feature:
-
Power Dissipation (Max):
110W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220

TK58E06N1,S1X FAQ

1.How can I place an order for TK58E06N1,S1X through Aetrix?

Please submit a Request for Quotation (RFQ) for TK58E06N1,S1X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TK58E06N1,S1X reliable?

The price and inventory of TK58E06N1,S1X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK58E06N1,S1X is usually 5 days.

3.What payment methods are accepted for TK58E06N1,S1X?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK58E06N1,S1X transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TK58E06N1,S1X?

TK58E06N1,S1X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TK58E06N1,S1X order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TK58E06N1,S1X?

For technical support, including TK58E06N1,S1X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK58E06N1,S1X requirements.

6.How does Aetrix verify that TK58E06N1,S1X is sourced from the original manufacturer or authorized distributors?

All TK58E06N1,S1X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK58E06N1,S1X meets industry standards.

7.What is the process for return or replacement of TK58E06N1,S1X?

All TK58E06N1,S1X units undergo pre-shipment inspection (PSI). If there is an issue with TK58E06N1,S1X, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TK58E06N1,S1X part is unused and in its original packaging.

Return procedure for TK58E06N1,S1X:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TK58E06N1,S1X Tags

  • TK58E06N1,S1X
  • TK58E06N1,S1X PDF
  • TK58E06N1,S1X Datasheet
  • TK58E06N1,S1X Specifications
  • TK58E06N1,S1X Images
  • Toshiba Semiconductor and Storage
  • Toshiba Semiconductor and Storage TK58E06N1,S1X
  • Buy TK58E06N1,S1X
  • TK58E06N1,S1X Price
  • TK58E06N1,S1X Distributor
  • TK58E06N1,S1X Supplier
  • TK58E06N1,S1X Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER