Toshiba Semiconductor and Storage TK62N60X,S1F
- Part No.:
- TK62N60X,S1F
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- TO-247-3
- Datasheet:
-
TK62N60X,S1F.pdf
- Description:
- MOSFET N-CH 600V 61.8A TO247
- Quantity:
- Payment:

- Shipping:

Inventory:82
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Product details
Overview
TK62N60X from Toshiba is a silicon N-channel super-junction MOSFET designed for high-voltage switching in offline power supplies and industrial DC-DC converters. It delivers 600 V VDSS, 61.8 A ID (DC), RDS(ON) = 0.033 Ω (typ.), and operates with enhancement-mode gate threshold of 2.5–3.5 V - enabling direct drive from standard PWM controllers in 400 V bus applications.
For engineers reviewing the TK62N60X datasheet, TK62N60X pinout, TK62N60X application, or TK62N60X equivalent, this device is selected for high-efficiency, high-reliability 600 V switching stages where low conduction loss, robust avalanche capability (EAS = 698 mJ), and fast switching (ton = 90 ns, toff = 240 ns) are critical to thermal management and system efficiency.
Technical Context
This MOSFET employs Toshiba's DTMOS™-H super-junction structure to achieve ultra-low RDS(ON) while maintaining high dv/dt ruggedness (≥50 V/ns) and stable gate charge characteristics (Qg = 135 nC, Qgd = 50 nC). Its internal body diode supports synchronous rectification and ZVS operation in resonant topologies.
Designed for hard-switched and quasi-resonant converters, the TK62N60X features low Ciss (6500 pF) and Coss (140 pF) at VDS = 300 V, enabling high-frequency operation up to 100 kHz without excessive switching loss - validated under Tc = 25 °C with RG = 10 Ω and VDD ≈ 400 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 600 V - supports full-wave rectified 400 V AC mains input with margin for surge and ringing. |
| RDS(ON) | 0.033 Ω (typ.) - reduces conduction loss to ≤43 W at 61.8 A, enabling TO-247 thermal performance without forced cooling. |
| ID (DC) | 61.8 A - rated at Tc = 25 °C; usable up to 40 A continuous in typical PCB-mounted heatsink configurations. |
| EAS | 698 mJ - enables reliable single-pulse avalanche operation during overvoltage transients without derating. |
| ton/toff | 90 ns / 240 ns - supports >100 kHz switching in LLC and PFC stages with minimal dead-time overhead. |
| Qg/Qgd | 135 nC / 50 nC - ensures predictable gate drive power (≤1.35 W at 100 kHz, VGS = 10 V) and low Miller-induced shoot-through risk. |
| dv/dt Ruggedness | ≥50 V/ns - prevents false turn-on during high-slew-rate commutation in bridge-leg configurations. |
Pinout & Package
TK62N60X is housed in a TO-247 (JEITA SC-65, Toshiba 2-16L1A) package with isolated drain tab for direct heatsink mounting. Thermal resistance Rth(ch-c) = 0.313 °C/W enables efficient heat transfer from channel to case.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: Gate | Control electrode | Receives 2.5–3.5 V threshold signal; requires <1.6 Ω series gate resistor to suppress oscillation and limit peak current. |
| 2: Drain (Heatsink) | High-voltage power terminal | Electrically connected to metal tab; must be insulated from heatsink unless referenced to same potential as circuit ground. |
| 3: Source | Return path and reference node | Serves as local ground for gate drive; layout must minimize inductance to preserve switching speed and stability. |
Key Features
| Feature | Design Value |
|---|---|
| DTMOS™-H Super-Junction Structure | Enables 0.033 Ω RDS(ON) at 600 V - 30% lower than conventional planar MOSFETs, reducing conduction loss in PFC and main switch stages. |
| Low Crss (15 pF) | Minimizes Miller feedback, improving noise immunity and allowing faster turn-off with reduced gate drive energy. |
| Integrated Fast Body Diode | trr = 500 ns, Qrr = 7 µC - supports discontinuous conduction mode (DCM) flyback and active clamp forward converters with low reverse recovery loss. |
| Guaranteed Avalanche Energy | EAS = 698 mJ - eliminates need for external snubbers in inductive load switching and allows safe operation under short-circuit conditions. |
| RoHS-Compliant Packaging | [[G]]/RoHS compatible marking per JEDEC J-STD-609 - meets EU Directive 2011/65/EU without lead or hazardous substances. |
Applications
| Server PSU Primary Switch | Industrial Motor Drive Inverter |
|---|---|
|
Use Scenario: High-density 3 kW server power supply operating at 100 kHz with active clamp forward topology. IC Role / Device Role / Timing Role: Main switch handling 400 V DC bus, conducting 30–45 A RMS with 10–20% duty cycle. Use Value: Low RDS(ON) and fast toff reduce total losses by 18% vs. legacy 600 V MOSFETs, enabling 96% efficiency at full load. |
Use Scenario: 7.5 kW three-phase VFD driving induction motors in HVAC and pump systems. IC Role / Device Role / Timing Role: Upper-leg IGBT replacement in 600 V inverter leg, switching at 8–16 kHz with unipolar PWM. Use Value: Integrated body diode and 50 V/ns dv/dt rating eliminate need for external anti-parallel diodes and reduce EMI filter size. |
| Telecom Rectifier Module | EV Charger Onboard PFC Stage |
|
Use Scenario: -48 V telecom rectifier with dual-phase interleaved boost PFC stage operating at 120 kHz. IC Role / Device Role / Timing Role: Boost switch handling 400 V output, 25 A peak current, and 150 V/ns voltage slew. Use Value: Low Ciss and high dv/dt ruggedness prevent false triggering during phase-shift transitions, improving reliability over 10-year field life. |
Use Scenario: 6.6 kW onboard charger using continuous conduction mode (CCM) boost PFC with digital control. IC Role / Device Role / Timing Role: High-side PFC switch in 600 V rail, operating at 65 kHz with variable frequency modulation. Use Value: 61.8 A ID rating and 0.313 °C/W Rth(ch-c) allow 95% efficiency at 100% load without liquid cooling - meeting automotive thermal envelope limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW62N60M2 (STMicroelectronics) | RDS(ON) = 0.035 Ω (typ.), Qg = 125 nC, TO-247 package, same VDSS/ID ratings. | Lower Qgd (42 nC) improves hard-switching efficiency but has lower EAS (520 mJ). | Preferred for high-frequency PFC where gate drive loss dominates; less suitable for avalanche-prone motor drive clamping. |
| IPP60R040C7 (Infineon) | RDS(ON) = 0.040 Ω (typ.), 650 V rating, 60 A ID, CoolMOS™ C7 technology, TO-247. | Higher VDSS margin and superior Coss linearity support ZVS in resonant LLC, but higher RDS(ON) increases conduction loss. | Better for soft-switched SMPS; requires gate driver with higher peak current due to larger Qg (145 nC). |
Compared with STW62N60M2 and IPP60R040C7, the TK62N60X offers the lowest RDS(ON) and highest guaranteed avalanche energy - making it optimal for hard-switched industrial power stages where conduction loss and transient robustness are prioritized over ultra-high-frequency optimization.
Availability
TK62N60X is available at Aetrix Electronics and suitable for server power supplies, industrial motor drives, telecom rectifiers, and EV onboard chargers requiring stable component supply across multi-year production cycles.
Supply support for TK62N60X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power ICs, and logic devices with focus on energy efficiency, reliability, and industrial-grade performance.
The TK62N60X belongs to Toshiba's DTMOS™-H super-junction MOSFET product line, engineered specifically for high-voltage, high-current switching in offline AC-DC and DC-DC power conversion systems demanding low loss and high ruggedness.
FAQ
What is the maximum continuous drain current rating for TK62N60X?
The TK62N60X is rated for 61.8 A DC drain current at Tc = 25 °C. In practical board-level designs with standard TO-247 heatsinking, sustained operation above 40 A requires careful thermal design to maintain channel temperature below 150 °C - verified via Rth(ch-c) = 0.313 °C/W and ambient derating curves in the TK62N60X datasheet.
Does TK62N60X have an integrated body diode, and what are its key recovery parameters?
Yes, the TK62N60X includes a monolithic body diode optimized for power switching. Its reverse recovery time (trr) is 500 ns and reverse recovery charge (Qrr) is 7 µC at IDR = 30.9 A and dIDR/dt = 50 A/µs - enabling use in DCM flyback and active-clamp forward converters without external diode supplementation.
What gate drive voltage range is required to fully enhance TK62N60X?
The TK62N60X is an enhancement-mode MOSFET with Vth = 2.5–3.5 V (VDS = 10 V, ID = 3.1 mA). To achieve specified RDS(ON) = 0.033 Ω, a minimum VGS of 10 V is required. Operation between 4.5 V and 10 V yields partial enhancement and higher on-resistance - not recommended for high-efficiency designs.
Is TK62N60X suitable for avalanche-rated applications, and what is its single-pulse energy rating?
Yes, the TK62N60X is fully characterized for avalanche operation with a guaranteed single-pulse avalanche energy (EAS) of 698 mJ at Tch = 25 °C. This enables robust protection against inductive switching transients in motor drives and relay drivers without external clamping components - confirmed per test condition VDD = 90 V, L = 5.08 mH, RG = 25 Ω, IAR = 15.5 A.
What is the thermal resistance from channel to case (Rth(ch-c)) for TK62N60X, and how does it impact heatsink selection?
The TK62N60X has a maximum channel-to-case thermal resistance Rth(ch-c) of 0.313 °C/W. This low value reflects its TO-247 package with electrically isolated drain tab, allowing direct mounting to heatsinks. For a 40 W dissipation scenario, this translates to ≤12.5 °C temperature rise from junction to case - meaning heatsink thermal resistance (Rth(c-a)) must be ≤2.5 °C/W to hold Tch ≤ 150 °C at 25 °C ambient.
TK62N60X,S1F Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- DTMOSIV-H
- Package/Case:
- TO-247-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 61.8A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 40mOhm @ 21A, 10V
- Vgs(th) (Max) @ Id:
- 3.5V @ 3.1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 135 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 6500 pF @ 300 V
- FET Feature:
- -
- Power Dissipation (Max):
- 400W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-247
TK62N60X,S1F FAQ
1.How can I place an order for TK62N60X,S1F through Aetrix?
Please submit a Request for Quotation (RFQ) for TK62N60X,S1F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TK62N60X,S1F reliable?
The price and inventory of TK62N60X,S1F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK62N60X,S1F is usually 5 days.
3.What payment methods are accepted for TK62N60X,S1F?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK62N60X,S1F transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TK62N60X,S1F?
TK62N60X,S1F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TK62N60X,S1F order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TK62N60X,S1F?
For technical support, including TK62N60X,S1F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK62N60X,S1F requirements.
6.How does Aetrix verify that TK62N60X,S1F is sourced from the original manufacturer or authorized distributors?
All TK62N60X,S1F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK62N60X,S1F meets industry standards.
7.What is the process for return or replacement of TK62N60X,S1F?
All TK62N60X,S1F units undergo pre-shipment inspection (PSI). If there is an issue with TK62N60X,S1F, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TK62N60X,S1F part is unused and in its original packaging.
Return procedure for TK62N60X,S1F:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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