Toshiba Semiconductor and Storage TK9R6E15Q5,S1X
- Part No.:
- TK9R6E15Q5,S1X
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
TK9R6E15Q5,S1X.pdf
- Description:
- 150V UMOS10-HSD TO-220 9.6MOHM
- Quantity:
- Payment:

- Shipping:

Inventory:380
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Product details
Overview
TK9R6E15Q5,S1X from Toshiba Electronic Devices & Storage Corporation is a silicon N-channel U-MOS-H power MOSFET designed for high-frequency switching in primary-side power stages. It delivers RDS(ON) = 7.9 mΩ (typ.) at VGS = 10 V, trr = 40 ns (typ.), Qrr = 32 nC (typ.), and supports 150 V VDSS, enabling efficient operation in DC-DC converters up to 52 A continuous drain current.
For engineers reviewing the TK9R6E15Q5,S1X datasheet, TK9R6E15Q5,S1X pinout, TK9R6E15Q5,S1X application, or TK9R6E15Q5,S1X equivalent, key selection criteria include its fast body diode recovery, low gate charge (QSW = 17 nC), thermal resistance (Rth(ch-c) = 0.73 °C/W), TO-220 package with heatsink-connected drain, and suitability for hard-switched 150 V industrial power supplies.
Technical Context
This MOSFET employs Toshiba's U-MOS-H trench-gate structure to minimize conduction and switching losses simultaneously. Its optimized cell layout achieves low RDS(ON) while maintaining robust avalanche capability (EAS = 55 mJ) and controlled Qgd/Qgs ratio for stable dV/dt immunity in high-side configurations.
The device operates in enhancement mode with Vth = 3.1–4.5 V and integrates a fast-recovery intrinsic body diode-critical for synchronous rectification and freewheeling in buck, half-bridge, and motor drive topologies where reverse recovery charge directly impacts efficiency and EMI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 150 V - Supports input rails up to 120 V DC with margin for voltage spikes in industrial SMPS. |
| RDS(ON) | 7.9 mΩ (typ., VGS = 10 V) - Enables <1.1 W conduction loss at 26 A, reducing heatsink requirements. |
| trr | 40 ns (typ.) - Limits switching node ringing and reduces diode-induced cross-conduction loss in synchronous converters. |
| QSW | 17 nC (typ.) - Low gate switch charge enables faster turn-on/turn-off with standard 1-A drivers, cutting switching loss. |
| EAS | 55 mJ - Withstands single-pulse inductive energy without failure, supporting reliable operation in motor drive flyback. |
| Rth(ch-c) | 0.73 °C/W - Allows direct mounting to heatsink; enables 200 W power dissipation at ΔT = 146 °C (Tch − Tc). |
| ID (DC) | 52 A - Rated for continuous operation at Tc = 25 °C; derates to ~30 A at Tc = 100 °C per SOA curve. |
Pinout & Package
TO-220 package (TOSHIBA designation: 2-10X1A), 3-pin through-hole, drain-connected tab for direct heatsinking. Weight: 1.96 g (typ.).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate | Control terminal; requires 3.1–4.5 V threshold to fully enhance; sensitive to ESD (±20 V max VGSS). |
| 2 | Drain (heatsink) | Main high-side current path; electrically connected to metal tab for thermal transfer; must be isolated from chassis if floating. |
| 3 | Source | Reference node for gate drive; carries full load current; connects to ground or low-side switch source in half-bridge. |
Key Features
| Feature | Design Value |
|---|---|
| U-MOS-H trench structure | Reduces RDS(ON) × Qg figure-of-merit by 35% vs. prior U-MOS-V, improving efficiency in 100–500 kHz converters. |
| Fast body diode recovery | trr = 40 ns and Qrr = 32 nC minimize reverse recovery loss and associated EMI in hard-switched topologies. |
| Low QSW | 17 nC total gate switch charge enables clean, low-loss switching with minimal driver power consumption. |
| Robust avalanche rating | 55 mJ single-pulse EAS ensures reliability during transient overloads in motor control and inductive load switching. |
| Enhancement-mode threshold | Vth = 3.1–4.5 V provides noise-immune turn-on while remaining compatible with 3.3 V and 5 V logic-level gate drivers. |
Applications
| Server VRM Power Stage | Industrial DC-DC Converter |
|---|---|
Use Scenario: Primary-side high-side switch in multiphase buck converters powering CPU/GPU cores at ≤1 V, 100+ A. IC Role / Device Role / Timing Role: High-frequency (300–600 kHz) synchronous rectifier with fast body diode for dead-time conduction. Use Value: Low RDS(ON) and QSW reduce conduction + switching loss; TO-220 tab enables direct heatsink attachment for thermal management under burst loads. | Use Scenario: Isolated forward or active-clamp forward converter in programmable logic controller (PLC) power supplies. IC Role / Device Role / Timing Role: Main switch operating at 100–200 kHz with 150 V bus, requiring ruggedness against line surges and transformer leakage spikes. Use Value: 150 V VDSS and 55 mJ EAS ensure safe operation during 120 VAC line transients; low Qrr suppresses secondary-side ringing. |
| Brushless DC Motor Driver | Telecom Rectifier Module |
Use Scenario: Half-bridge high-side switch in 24–48 V BLDC drives for HVAC fans and pumps. IC Role / Device Role / Timing Role: Commutation switch with integrated body diode conducting freewheeling current during PWM off-time. Use Value: 40 ns trr minimizes diode conduction loss and prevents shoot-through during high-dV/dt commutation edges. | Use Scenario: Primary switch in 48 V telecom rectifier modules converting -54 V to -57 V DC input to 12 V output. IC Role / Device Role / Timing Role: Hard-switched 150 V MOSFET handling bidirectional surge currents during hot-swap events. Use Value: 250 A pulsed IDP rating and 10 µA IDSS at 150 V support long-term reliability in harsh telecom environments with frequent load transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP10NK150ZFP | 150 V VDSS, RDS(ON) = 120 mΩ (higher), trr = 120 ns (slower), TO-220FP package (isolated tab) | Lower efficiency in high-current DC-DC; better suited for lower-frequency, lower-power motor controls | Select when isolation between drain and heatsink is required; avoid where fast recovery or low RDS(ON) is critical. |
| IXTH16N15X2 | 150 V VDSS, RDS(ON) = 90 mΩ, Qrr = 125 nC, TO-247 package (larger footprint, higher Ciss) | Higher thermal mass but slower switching; used in high-voltage industrial inverters with snubbers | Prefer for high-temperature ambient (>105 °C) designs where TO-220 thermal limits are exceeded; not drop-in due to different pinout and size. |
Compared with STP10NK150ZFP and IXTH16N15X2, TK9R6E15Q5,S1X offers superior switching efficiency in compact 150 V systems due to its 7.9 mΩ RDS(ON), 40 ns trr, and TO-220 thermal performance-making it optimal for space-constrained, high-frequency power stages where loss budget is tight.
Availability
TK9R6E15Q5,S1X is available at Aetrix Electronics and suitable for high-efficiency DC-DC converters, switching voltage regulators, and motor drivers requiring stable component supply and production-ready lead times.
Supply support for TK9R6E15Q5,S1X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and storage solutions with emphasis on reliability, efficiency, and industrial-grade performance.
The TK9R6E15Q5,S1X belongs to Toshiba's U-MOS-H series of high-voltage N-channel MOSFETs, engineered specifically for high-frequency, high-efficiency power conversion in industrial, telecom, and motor control applications.
FAQ
What is the maximum continuous drain current rating for TK9R6E15Q5,S1X?
The TK9R6E15Q5,S1X is rated for 52 A continuous drain current (ID) at case temperature Tc = 25 °C. This rating decreases with rising case temperature per the Safe Operating Area (SOA) curve-derating to approximately 30 A at Tc = 100 °C. The device also supports 250 A pulsed drain current (IDP) for t ≤ 100 µs, enabling robust handling of short-duration overload conditions.
Does TK9R6E15Q5,S1X have a built-in body diode, and what are its recovery characteristics?
Yes, TK9R6E15Q5,S1X integrates a fast-recovery intrinsic body diode with reverse recovery time trr = 40 ns (typ.) and reverse recovery charge Qrr = 32 nC (typ.) at IDR = 13 A and −dIDR/dt = 100 A/µs. These values are measured under standardized conditions and enable reduced switching loss and EMI in synchronous rectification and freewheeling applications compared to standard MOSFETs.
What is the gate threshold voltage range for TK9R6E15Q5,S1X, and how does it affect drive compatibility?
The gate threshold voltage Vth of TK9R6E15Q5,S1X is specified as 3.1–4.5 V (VDS = 10 V, ID = 1.1 mA), making it compatible with both 3.3 V and 5 V logic-level gate drivers. This range ensures reliable turn-on while providing sufficient noise margin to prevent spurious conduction in electrically noisy industrial environments.
Is TK9R6E15Q5,S1X suitable for avalanche-prone circuits like motor drives or inductive switching?
Yes, TK9R6E15Q5,S1X is rated for 55 mJ single-pulse avalanche energy (EAS) at Tc = 25 °C, confirming its ability to absorb inductive energy safely during switching transitions. This specification is validated per JEDEC standards and supports reliable operation in motor driver half-bridges and relay/snubber-free inductive load switching without external clamping.
What thermal resistance values apply to TK9R6E15Q5,S1X, and how do they impact heatsink design?
TK9R6E15Q5,S1X has a channel-to-case thermal resistance Rth(ch-c) of 0.73 °C/W (max), meaning a 100 W power dissipation results in a 73 °C temperature rise from case to channel. Its channel-to-ambient Rth(ch-a) is 83.3 °C/W (max), underscoring the necessity of mechanical heatsinking via the drain-connected tab. Effective thermal design requires mounting the TO-220 tab to a heatsink with thermal interface material and torque-controlled screws (0.6 N·m max).
TK9R6E15Q5,S1X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- U-MOSX-H
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 150 V
- Current - Continuous Drain (Id) @ 25°C:
- 104A (Ta), 52A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 8V, 10V
- Rds On (Max) @ Id, Vgs:
- 9.6mOhm @ 26A, 10V
- Vgs(th) (Max) @ Id:
- 4.5V @ 1.1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 50 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3690 pF @ 75 V
- FET Feature:
- -
- Power Dissipation (Max):
- 200W (Tc)
- Operating Temperature:
- 175°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220
TK9R6E15Q5,S1X FAQ
1.How can I place an order for TK9R6E15Q5,S1X through Aetrix?
Please submit a Request for Quotation (RFQ) for TK9R6E15Q5,S1X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TK9R6E15Q5,S1X reliable?
The price and inventory of TK9R6E15Q5,S1X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TK9R6E15Q5,S1X is usually 5 days.
3.What payment methods are accepted for TK9R6E15Q5,S1X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TK9R6E15Q5,S1X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TK9R6E15Q5,S1X?
TK9R6E15Q5,S1X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TK9R6E15Q5,S1X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TK9R6E15Q5,S1X?
For technical support, including TK9R6E15Q5,S1X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TK9R6E15Q5,S1X requirements.
6.How does Aetrix verify that TK9R6E15Q5,S1X is sourced from the original manufacturer or authorized distributors?
All TK9R6E15Q5,S1X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TK9R6E15Q5,S1X meets industry standards.
7.What is the process for return or replacement of TK9R6E15Q5,S1X?
All TK9R6E15Q5,S1X units undergo pre-shipment inspection (PSI). If there is an issue with TK9R6E15Q5,S1X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TK9R6E15Q5,S1X part is unused and in its original packaging.
Return procedure for TK9R6E15Q5,S1X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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