Toshiba Semiconductor and Storage TPH3R203NL,L1Q
- Part No.:
- TPH3R203NL,L1Q
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
TPH3R203NL,L1Q.pdf
- Description:
- MOSFET N-CH 30V 47A 8SOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,990
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Product details
Overview
TPH3R203NL from Toshiba Electronic Devices & Storage Corporation is a silicon N-channel power MOSFET in U-MOSⅧ-H process, designed as a high-efficiency synchronous rectifier or main switch in DC-DC converters. It delivers 3.8 mΩ RDS(ON) at VGS = 4.5 V, 5.2 nC gate charge (QSW), and 84 A DC drain current, enabling compact, high-frequency switching power stages in server VRMs and POL converters.
For engineers reviewing the TPH3R203NL datasheet, TPH3R203NL pinout, TPH3R203NL application, or TPH3R203NL equivalent, key selection criteria include low RDS(ON) at 4.5 V drive, fast switching with minimal Qg, thermal performance on FR-4 PCBs, and SOP Advance package compatibility with automated assembly.
Technical Context
This MOSFET uses Toshiba's U-MOSⅧ-H trench-gate structure to achieve enhanced cell density and reduced specific on-resistance. Its enhancement-mode threshold voltage (1.3–2.3 V) ensures reliable turn-on with standard logic-level gate drivers, while low Crss (53 pF typ.) minimizes Miller-induced shoot-through risk in half-bridge configurations.
The device is rated for 30 V VDSS, ±20 V VGSS, and operates up to 150 °C channel temperature. Its 2.84 °C/W Rth(ch-c) enables high-power dissipation when mounted on copper-clad PCBs with thermal vias, supporting continuous operation at 47 A with proper heatsinking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum blocking voltage for 12 V input bus applications with margin against transients. |
| RDS(ON) @ 4.5 V | 3.8 mΩ (typ.) - Enables <1 W conduction loss at 23.5 A, critical for high-current POL regulators. |
| QSW | 5.2 nC (typ.) - Reduces switching energy loss and gate driver power requirement in >500 kHz designs. |
| ID (DC) | 84 A - Supports high-current single-phase buck stages without paralleling, simplifying layout. |
| Rth(ch-c) | 2.84 °C/W - Allows ~15 W power dissipation with ≤45 °C case-to-channel delta, suitable for thermally constrained modules. |
| Vth | 1.3–2.3 V - Ensures robust turn-on with 3.3 V or 5 V gate drive while avoiding false triggering from noise. |
| Ciss | 1600 pF (typ.) - Balances gate drive strength needs and EMI control in hard-switched topologies. |
Pinout & Package
TPH3R203NL is housed in the SOP Advance surface-mount package (TOSHIBA designation: 2-5Q1S), featuring exposed drain pads for enhanced thermal conduction and mechanical stability. The 8-pin configuration supports high-current routing with multiple parallel drain terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source | Common source connection for internal parallel cells; requires low-inductance ground plane routing. |
| 4 | Gate | Single-point gate input; sensitive to ESD-requires series resistor and proximity to driver IC. |
| 5, 6, 7, 8 | Drain | Four parallel drain terminals tied to internal die metallization; must be connected to high-current power plane. |
Key Features
| Feature | Design Value |
|---|---|
| U-MOSⅧ-H trench process | Enables 3.8 mΩ RDS(ON) at 4.5 V while maintaining rugged avalanche capability (EAS = 94 mJ). |
| Low QSW / Qgd ratio | QSW = 5.2 nC and Qgd = 5.6 nC minimize Miller plateau duration, improving hard-switching efficiency. |
| SOP Advance thermal pad | Exposed drain leads provide direct thermal path to PCB copper, reducing Rth(ch-a) to 44.6 °C/W (t = 10 s). |
| Enhancement-mode Vth | 1.3–2.3 V threshold ensures compatibility with 3.3 V microcontroller GPIO or dedicated gate drivers without level shifters. |
| Low IDSS leakage | ≤10 µA at VDS = 30 V prevents significant standby power loss in always-on converter stages. |
Applications
| Server Point-of-Load Regulator | Industrial DC-DC Converter |
|---|---|
Use Scenario: High-current, high-efficiency 12 V → 0.8 V conversion for CPU/GPU VRMs in data center servers. IC Role / Device Role / Timing Role: Synchronous rectifier in multiphase buck converter, operating at 500–1000 kHz with interleaved timing. Use Value: 3.8 mΩ RDS(ON) reduces conduction loss by >30% vs. legacy 6 mΩ MOSFETs, directly lowering thermal load on VRM modules. |
Use Scenario: Isolated or non-isolated 24 V → 5/12 V conversion in programmable logic controllers and motor drives. IC Role / Device Role / Timing Role: Primary-side high-side switch in active clamp forward or synchronous buck topology. Use Value: Fast 4.4 ns rise time and 5.7 ns fall time support tight dead-time control, minimizing cross-conduction losses in industrial-grade SMPS. |
| Telecom Power Supply | Automotive ADAS Power Module |
Use Scenario: 48 V intermediate bus conversion to 12 V/5 V for base station RF amplifiers and signal processing boards. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in phase-shifted full-bridge or LLC resonant converter. Use Value: Low Crss (53 pF) suppresses voltage spikes during ZVS transitions, improving reliability under dynamic load steps. |
Use Scenario: 12 V → 3.3 V/5 V power for radar sensors and camera ECUs in ASIL-B compliant ADAS subsystems. IC Role / Device Role / Timing Role: Compact, high-reliability buck converter switch in space-constrained automotive modules. Use Value: 150 °C max channel temperature rating and -55 °C to 150 °C storage range meet automotive under-hood thermal requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLHS6342TRPBF | RDS(ON) = 4.0 mΩ @ 4.5 V; Qg = 11.5 nC; SO-8 package with smaller thermal pad. | Higher gate charge increases driver loss; lower thermal conductivity limits continuous current to ~60 A on same PCB. | Prefer TPH3R203NL where <6 nC QSW and 2.84 °C/W Rth(ch-c) are required for >70 A operation. |
| DMN3029LFG-7 | RDS(ON) = 3.2 mΩ @ 4.5 V; QSW = 7.8 nC; 8-pin LFPAK56 package with superior Rth(ch-c) (1.6 °C/W). | Lower RDS(ON) improves conduction loss, but higher QSW degrades high-frequency efficiency; LFPAK56 footprint differs. | Select DMN3029LFG-7 only if board redesign allows larger thermal pad area and layout accommodates different pin spacing. |
Compared with IRLHS6342TRPBF and DMN3029LFG-7, the TPH3R203NL offers the optimal balance of ultra-low QSW, competitive RDS(ON), and SOP Advance compatibility-making it ideal for space-constrained, high-frequency POL designs where gate drive loss and thermal resistance are critical.
Availability
TPH3R203NL is available at Aetrix Electronics and suitable for server point-of-load regulators, industrial DC-DC converters, and telecom power supplies requiring stable component supply, consistent parametric performance across production lots, and long-term lifecycle support.
Supply support for TPH3R203NL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and storage solutions with emphasis on efficiency, reliability, and miniaturization for industrial and computing markets.
The TPH3R203NL belongs to Toshiba's U-MOSⅧ-H power MOSFET family, engineered specifically for high-current, high-frequency DC-DC conversion in data center, telecom, and industrial power systems where low gate charge and thermal performance are decisive.
FAQ
What is the maximum continuous drain current for TPH3R203NL at 25 °C ambient?
The TPH3R203NL supports 84 A DC drain current (ID) at Tc = 25 °C, limited by silicon capability-not package. In practice, sustained 84 A requires aggressive heatsinking due to its 2.84 °C/W channel-to-case thermal resistance; typical PCB-mounted operation limits usable ID to ~47 A without additional cooling. Always verify channel temperature stays ≤150 °C using Rth(ch-c) and actual power dissipation.
Does TPH3R203NL support 3.3 V gate drive in logic-level applications?
Yes, the TPH3R203NL is specified with a gate threshold voltage (Vth) of 1.3–2.3 V at VDS = 10 V and ID = 0.3 mA, making it fully compatible with 3.3 V logic-level gate drivers. At VGS = 4.5 V, it achieves its rated 3.8 mΩ RDS(ON); at 3.3 V, RDS(ON) rises to ~5.5 mΩ (typ., extrapolated from Vth and transfer characteristics), which remains viable for moderate-current applications.
What is the avalanche energy rating of TPH3R203NL and how is it tested?
The TPH3R203NL has a single-pulse avalanche energy rating (EAS) of 94 mJ, measured under conditions of VDD = 24 V, Tch = 25 °C (initial), L = 33 µH, and IAR = 47 A. This rating reflects ruggedness against inductive switching transients in hard-switched topologies. Avalanche testing follows JEDEC JESD24-11 guidelines, and operation within this limit does not require derating-but repeated avalanche events degrade reliability.
How does the SOP Advance package of TPH3R203NL improve thermal performance over standard SO-8?
The SOP Advance package (2-5Q1S) used by TPH3R203NL features an enlarged exposed drain paddle and optimized internal leadframe geometry, achieving a channel-to-case thermal resistance (Rth(ch-c)) of 2.84 °C/W-nearly 2× better than standard SO-8 MOSFETs (~5–6 °C/W). This allows higher power dissipation on standard FR-4 PCBs without external heatsinks, especially when using thermal vias under the drain pads.
Is TPH3R203NL suitable for automotive applications per AEC-Q101?
No, the TPH3R203NL is not AEC-Q101 qualified. While its absolute maximum ratings include -55 °C to 150 °C storage temperature and 150 °C channel temperature-meeting some automotive thermal requirements-it lacks the stress test validation (HTOL, UHAST, TC, etc.) and traceability controls mandated for AEC-Q101. For automotive ADAS or body electronics, use only AEC-Q101-certified variants such as Toshiba's TKxxx series.
TPH3R203NL,L1Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- U-MOSVIII-H
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 47A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 3.2mOhm @ 23.5A, 10V
- Vgs(th) (Max) @ Id:
- 2.3V @ 300µA
- Gate Charge (Qg) (Max) @ Vgs:
- 21 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2100 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.6W (Ta), 44W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOP Advance (5x5)
TPH3R203NL,L1Q FAQ
1.How can I place an order for TPH3R203NL,L1Q through Aetrix?
Please submit a Request for Quotation (RFQ) for TPH3R203NL,L1Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPH3R203NL,L1Q reliable?
The price and inventory of TPH3R203NL,L1Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPH3R203NL,L1Q is usually 5 days.
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4.How is shipping managed for TPH3R203NL,L1Q?
TPH3R203NL,L1Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPH3R203NL,L1Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPH3R203NL,L1Q?
For technical support, including TPH3R203NL,L1Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPH3R203NL,L1Q requirements.
6.How does Aetrix verify that TPH3R203NL,L1Q is sourced from the original manufacturer or authorized distributors?
All TPH3R203NL,L1Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPH3R203NL,L1Q meets industry standards.
7.What is the process for return or replacement of TPH3R203NL,L1Q?
All TPH3R203NL,L1Q units undergo pre-shipment inspection (PSI). If there is an issue with TPH3R203NL,L1Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPH3R203NL,L1Q part is unused and in its original packaging.
Return procedure for TPH3R203NL,L1Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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