Toshiba Semiconductor and Storage TPN14006NH,L1Q
- Part No.:
- TPN14006NH,L1Q
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
TPN14006NH,L1Q.pdf
- Description:
- MOSFET N CH 60V 13A 8TSON-ADV
- Quantity:
- Payment:

- Shipping:

Inventory:9,535
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPN14006NH,L1Q from Toshiba Electronic Devices & Storage Corporation is a silicon N-channel power MOSFET in the U-MOS-H process, designed for high-efficiency switching in DC-DC converters and motor drivers. It delivers RDS(ON) = 11 mΩ (typ.) at VGS = 10 V, QSW = 5.5 nC (typ.), and supports VDSS = 60 V, ID = 33 A (DC), with TSON Advance package for thermal performance in compact power stages.
For engineers reviewing the TPN14006NH,L1Q datasheet, TPN14006NH,L1Q pinout, TPN14006NH,L1Q application, or TPN14006NH,L1Q equivalent, key selection criteria include gate charge optimization for synchronous buck topologies, low conduction loss at 6.5 A, avalanche ruggedness (EAS = 43 mJ), and thermal resistance (Rth(ch-c) = 4.16 °C/W) under PCB-constrained layouts.
Technical Context
This MOSFET employs Toshiba's U-MOS-H trench-gate structure to achieve low RDS(ON) and fast switching with minimal gate drive energy. Its enhancement-mode threshold (Vth = 2.0–4.0 V) ensures reliable turn-on with standard 3.3 V or 5 V logic-level gate drivers.
Designed for hard-switched topologies, it features low Ciss = 1000 pF (typ.) and Crss = 25 pF (typ.), enabling high-frequency operation up to 1 MHz while maintaining low EMI. The integrated body diode supports freewheeling in buck and half-bridge configurations with VDSF = −1.2 V (typ.) at IDR = 13 A.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 60 V - Maximum drain-source blocking voltage compatible with 48 V input DC-DC systems |
| RDS(ON) @ 10 V | 11 mΩ (typ.) - Enables ≤75 mW conduction loss at 6.5 A continuous current |
| QSW | 5.5 nC (typ.) - Reduces gate drive power and enables efficient 500 kHz–1 MHz switching |
| EAS | 43 mJ - Supports single-pulse avalanche energy handling without failure in inductive load transients |
| Rth(ch-c) | 4.16 °C/W - Allows 30 W power dissipation with ≤125 °C channel-to-case temperature rise |
| ID (DC) | 33 A - Rated continuous drain current at Tc = 25 °C for heatsink-mounted operation |
| Vth | 2.0–4.0 V - Ensures robust turn-on margin with 3.3 V microcontroller GPIO or dedicated gate drivers |
Pinout & Package
TSON Advance (TOSHIBA 2-3X1S) surface-mount package with exposed drain pad for thermal management; 0.02 g typical weight; 3.0 × 3.0 × 0.85 mm footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source | Common return path for load current; electrically tied to internal source metallization and thermal slug |
| 4 | Gate | Control terminal requiring <5.5 nC total charge for full enhancement; sensitive to ESD |
| 5, 6, 7, 8 | Drain | High-side switching node; connected to exposed copper pad for low-inductance, high-current routing |
Key Features
| Feature | Design Value |
|---|---|
| U-MOS-H trench process | Delivers 11 mΩ RDS(ON) in 3×3 mm TSON Advance, reducing board area vs. SO-8 equivalents |
| Low QSW/Qg ratio | 5.5 nC switch charge enables faster dV/dt control and lower gate driver losses than comparable 60 V MOSFETs |
| Guaranteed avalanche capability | 43 mJ single-pulse rating allows safe operation during inductive turn-off without external snubbers |
| Enhancement-mode Vth | 2.0–4.0 V range ensures compatibility with both 3.3 V and 5 V logic-level gate drivers without level-shifting |
| Low leakage IDSS | ≤10 µA at VDS = 60 V minimizes standby power loss in always-on power rails |
Applications
| Switching Voltage Regulators | Motor Drivers |
|---|---|
Use Scenario: Synchronous buck converter in point-of-load (POL) supplies for FPGA or ASIC core rails. IC Role / Device Role / Timing Role: High-side power switch controlling energy transfer from input to output inductor. Use Value: 11 mΩ RDS(ON) and 5.5 nC QSW reduce conduction + switching losses, enabling >92% efficiency at 12 V input/1.2 V@15 A output. | Use Scenario: H-bridge leg in 24 V brushed DC motor control for industrial actuators. IC Role / Device Role / Timing Role: Low-side switching element handling bidirectional current during PWM commutation. Use Value: Avalanche ruggedness (43 mJ) absorbs inductive kickback during rapid direction reversal, eliminating need for external flyback diodes. |
| DC-DC Converters | Power OR-ing Circuits |
Use Scenario: Primary-side switch in isolated forward or active-clamp forward converters for telecom power modules. IC Role / Device Role / Timing Role: Main power switch synchronizing with transformer reset and clamp timing. Use Value: 60 V VDSS and 33 A ID support 48 V input designs with margin for line transients and duty-cycle variation. | Use Scenario: Back-to-back configuration in redundant 12 V power distribution for network switches. IC Role / Device Role / Timing Role: Ideal diode replacement providing forward conduction and reverse blocking. Use Value: Low VDSF = −1.2 V (typ.) and fast body diode recovery minimize forward drop and reverse recovery loss vs. Schottky solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLML6344TRPBF | RDS(ON) = 22 mΩ @ 4.5 V; smaller 1.6×1.6 mm package; lower ID = 4.3 A | Better suited for space-constrained, low-current (<5 A) logic-level loads | Select when gate drive is limited to 3.3–4.5 V and current demand is ≤5 A; not suitable for 33 A thermal design. |
| DMN3025LSD-13 | RDS(ON) = 2.5 mΩ @ 10 V; dual-SO8 package; higher Qg = 19 nC | Optimized for ultra-low-loss, high-current (>20 A) but less efficient at high frequency due to higher gate charge | Prefer for low-frequency, high-current applications where switching loss is secondary to conduction loss. |
Compared with IRLML6344TRPBF and DMN3025LSD-13, the TPN14006NH,L1Q balances mid-range current handling (33 A), low gate charge (5.5 nC), and compact TSON Advance packaging-making it optimal for 500 kHz–1 MHz DC-DC converters where layout area, thermal density, and switching efficiency are jointly constrained.
Availability
TPN14006NH,L1Q is available at Aetrix Electronics and suitable for switching voltage regulators, motor drivers, and DC-DC converters requiring stable component supply, RoHS-compliant sourcing, and long-term industrial lifecycle support.
Supply support for TPN14006NH,L1Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation is a global semiconductor manufacturer specializing in power devices, logic ICs, and storage solutions, with decades of expertise in silicon process innovation and reliability engineering.
The TPN series targets high-efficiency power conversion in industrial, computing, and consumer applications, emphasizing low RDS(ON), fast switching, and ruggedness in compact surface-mount packages like TSON Advance.
FAQ
What is the maximum continuous drain current rating for TPN14006NH,L1Q?
The TPN14006NH,L1Q has a maximum continuous drain current (ID) of 33 A at case temperature Tc = 25 °C. This rating assumes proper PCB copper area and thermal vias under the exposed drain pad. At higher temperatures or with limited heatsinking, derating per the Rth(ch-c) = 4.16 °C/W curve is required. The TPN14006NH,L1Q datasheet specifies 13 A for Ta = 25 °C on standard FR-4, confirming its dependency on thermal design.
Does TPN14006NH,L1Q support logic-level gate drive?
Yes, the TPN14006NH,L1Q is a logic-level MOSFET with Vth = 2.0–4.0 V and specified RDS(ON) down to 14 mΩ at VGS = 4.5 V. It fully enhances using standard 3.3 V or 5 V microcontroller outputs or gate drivers, making it suitable for direct interface without level shifters. The TPN14006NH,L1Q achieves 11 mΩ at VGS = 10 V, offering headroom for improved efficiency in higher-drive systems.
What is the avalanche energy rating of TPN14006NH,L1Q and how is it tested?
The TPN14006NH,L1Q is rated for single-pulse avalanche energy EAS = 43 mJ under conditions of VDD ≈ 48 V, Tch = 25 °C (initial), L = 0.2 mH, RG = 1 Ω, and IAR = 13 A. This rating is verified per JEDEC JESD24-11 and guarantees safe operation during inductive turn-off transients without device failure. The TPN14006NH,L1Q datasheet explicitly lists this value in Absolute Maximum Ratings Table 4.
Is TPN14006NH,L1Q suitable for synchronous rectification?
Yes, the TPN14006NH,L1Q is suitable for synchronous rectification due to its low RDS(ON) = 11 mΩ and fast body diode with VDSF = −1.2 V (typ.) at IDR = 13 A. Its low Qgd/Qgs ratio improves controllability during zero-voltage switching transitions. However, external gate timing control is required to avoid shoot-through; the TPN14006NH,L1Q does not integrate drivers or protection logic.
What package type and thermal characteristics define TPN14006NH,L1Q's mounting requirements?
The TPN14006NH,L1Q uses the TSON Advance (TOSHIBA 2-3X1S) package: 3.0 × 3.0 × 0.85 mm with an exposed drain pad. Its Rth(ch-c) = 4.16 °C/W requires soldering the drain pad to ≥100 mm² of 2-oz copper with ≥6 thermal vias for rated 30 W dissipation. The TPN14006NH,L1Q datasheet Figure 5.1 defines the recommended land pattern and via placement for optimal thermal performance.
TPN14006NH,L1Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- U-MOSVIII-H
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 13A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 6.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 14mOhm @ 6.5A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 200µA
- Gate Charge (Qg) (Max) @ Vgs:
- 15 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1300 pF @ 30 V
- FET Feature:
- -
- Power Dissipation (Max):
- 700mW (Ta), 30W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSON Advance (3.1x3.1)
TPN14006NH,L1Q FAQ
1.How can I place an order for TPN14006NH,L1Q through Aetrix?
Please submit a Request for Quotation (RFQ) for TPN14006NH,L1Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPN14006NH,L1Q reliable?
The price and inventory of TPN14006NH,L1Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPN14006NH,L1Q is usually 5 days.
3.What payment methods are accepted for TPN14006NH,L1Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPN14006NH,L1Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPN14006NH,L1Q?
TPN14006NH,L1Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPN14006NH,L1Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPN14006NH,L1Q?
For technical support, including TPN14006NH,L1Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPN14006NH,L1Q requirements.
6.How does Aetrix verify that TPN14006NH,L1Q is sourced from the original manufacturer or authorized distributors?
All TPN14006NH,L1Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPN14006NH,L1Q meets industry standards.
7.What is the process for return or replacement of TPN14006NH,L1Q?
All TPN14006NH,L1Q units undergo pre-shipment inspection (PSI). If there is an issue with TPN14006NH,L1Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPN14006NH,L1Q part is unused and in its original packaging.
Return procedure for TPN14006NH,L1Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPN14006NH,L1Q Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

