Toshiba Semiconductor and Storage TPN4R203NC,L1Q
- Part No.:
- TPN4R203NC,L1Q
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerVDFN
- Datasheet:
-
TPN4R203NC,L1Q.pdf
- Description:
- MOSFET N CH 30V 23A 8TSON-ADV
- Quantity:
- Payment:

- Shipping:

Inventory:8,862
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TPN4R203NC from Toshiba Electronic Devices & Storage Corporation is a silicon N-channel power MOSFET in TSON Advance package, designed for high-efficiency power switching in battery protection and load management circuits. It delivers RDS(ON) = 3.5 mΩ (typ.) at VGS = 10 V, supports 53 A DC drain current, and operates with VDSS = 30 V - enabling compact, low-loss switching in Li-ion battery packs and portable power systems.
For engineers reviewing the TPN4R203NC datasheet, TPN4R203NC pinout, TPN4R203NC application, or TPN4R203NC equivalent, key selection criteria include its low on-resistance, 8-pin TSON Advance thermal performance, gate threshold range (1.3–2.3 V), avalanche energy rating (62 mJ), and suitability for high-current, space-constrained battery protection ICs and power management switches.
Technical Context
This U-MOS VIII-generation device uses trench-gate structure to achieve low RDS(ON) and fast switching with Qg = 24 nC (typ.) and Ciss = 1370 pF (typ.). Its enhancement-mode operation and 1.3–2.3 V Vth ensure reliable turn-on with standard logic-level gate drivers.
The integrated body diode supports synchronous rectification and reverse-current handling up to 146 A (pulsed), while Rth(ch-c) = 5.68 °C/W enables efficient heat transfer to PCB copper when mounted per JEDEC MS-012 guidelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - maximum blocking voltage for 1-cell Li-ion and 12 V system applications |
| RDS(ON) (VGS = 10 V) | 3.5 mΩ (typ.) - enables <100 mW conduction loss at 11.5 A, critical for thermal budget in thin-profile battery packs |
| ID (DC) | 53 A - rated continuous current with Tc = 25 °C, limited by silicon not package (45 A package limit) |
| Vth | 1.3–2.3 V - logic-compatible gate threshold allowing direct drive from 3.3 V or 5 V controllers |
| EAS | 62 mJ - single-pulse avalanche energy at VDD = 24 V, supporting inductive load switching without external snubbers |
| Qg | 24 nC (typ.) - total gate charge determining driver strength requirement for <50 ns switching transitions |
| Rth(ch-c) | 5.68 °C/W - channel-to-case thermal resistance enabling >20 W dissipation with minimal heatsink area |
Pinout & Package
TSON Advance (TOSHIBA 2-3X1S) - 3.3 mm × 3.3 mm × 0.85 mm thin-outline package with exposed drain pad for enhanced thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source | Common source connection for low-side switching; tied to PCB ground plane for optimal EMI and thermal path |
| 4 | Gate | Control terminal requiring <24 nC charge; sensitive to ESD - requires gate resistor and TVS protection |
| 5, 6, 7, 8 | Drain | High-current output node; all four pins connected internally to exposed copper pad for <5.7 °C/W thermal path |
Key Features
| Feature | Design Value |
|---|---|
| U-MOS VIII trench process | Enables 3.5 mΩ RDS(ON) in 3.3×3.3 mm footprint - reduces board area vs. SO-8 equivalents by 45% |
| Logic-level gate drive | Vth range (1.3–2.3 V) ensures full enhancement with 3.3 V microcontrollers - eliminates level-shifter need |
| Low Qgd/Qg ratio | 4.9/24 nC = 0.20 - improves hard-switching efficiency and reduces Miller-induced shoot-through risk |
| Robust avalanche capability | 62 mJ single-pulse rating allows safe operation during inductive load interruption without external clamping |
| ESD-sensitive design | HBM Class 1B (≤250 V) - mandates handling per J-STD-020; gate oxide integrity verified to ±20 V stress |
Applications
| Lithium-Ion Battery Protection | Power Management Switch |
|---|---|
Use Scenario: Primary overcurrent and short-circuit protection in 1S–2S Li-ion battery packs for power tools and medical portables. IC Role / Device Role / Timing Role: Low-side switch in battery protection IC (e.g., DW01A) configuration, conducting up to 50 A during normal operation and interrupting fault current within microseconds. Use Value: 3.5 mΩ RDS(ON) limits voltage drop to <175 mV at 50 A, preserving pack capacity and minimizing self-heating during discharge cycles. | Use Scenario: High-efficiency main power switch in USB-C PD sink designs and portable power banks. IC Role / Device Role / Timing Role: Load switch controlling 5–20 V input rails; driven by dedicated PMIC (e.g., TPS6598x) with soft-start and current limiting. Use Value: 24 nC Qg enables <1 µs turn-on with 10 Ω gate resistor, reducing inrush overshoot and improving transient response to load steps. |
| Motor Driver Half-Bridge | Hot-Swap Controller |
Use Scenario: Low-side switch in brushed DC motor drivers for robotics and consumer appliances operating from 12 V supplies. IC Role / Device Role / Timing Role: Synchronous rectifier in H-bridge topology; commutated at ≤20 kHz with dead-time control to prevent shoot-through. Use Value: 146 A pulsed drain current supports 3× motor stall current, while 5.68 °C/W Rth(ch-c) sustains 15 W dissipation without forced air cooling. | Use Scenario: Inrush current limiter and fault disconnect in industrial backplane power distribution modules. IC Role / Device Role / Timing Role: Controlled ramp-up switch activated by hot-swap controller (e.g., LM5069); monitors current via sense resistor and triggers shutdown on overcurrent. Use Value: 10 µA max IDSS ensures negligible leakage during standby, extending shelf life of powered-off subsystems in always-on infrastructure equipment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLML6344TRPBF | RDS(ON) = 4.5 mΩ (VGS = 4.5 V); 20 V VDSS; SOT-23 package | Lower voltage rating limits use to ≤12 V systems; smaller package reduces thermal mass and current handling | Select when board space is critical and 20 V blocking suffices - not suitable for 30 V Li-ion applications |
| SiR20DP-T1-GE3 | RDS(ON) = 3.0 mΩ (VGS = 10 V); 30 V VDSS; PowerPAK® 1212-8 package | Higher thermal resistance (Rth(ch-a) = 42 °C/W vs. 65.7 °C/W for TPN4R203NC on same board) but larger footprint | Choose for higher peak power needs where PCB real estate permits larger package and improved long-term reliability margin |
Compared with IRLML6344TRPBF and SiR20DP-T1-GE3, the TPN4R203NC offers optimal balance of ultra-low RDS(ON), 30 V rating, and compact TSON Advance footprint - making it preferred for space-constrained, high-current battery protection where thermal performance must be maximized without increasing board area.
Availability
TPN4R203NC is available at Aetrix Electronics and suitable for lithium-ion battery protection, power management switches, and motor driver half-bridges requiring stable component supply and consistent parametric performance across production lots.
Supply support for TPN4R203NC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and storage solutions with emphasis on reliability, miniaturization, and energy efficiency.
The TPN4R203NC belongs to Toshiba's U-MOS VIII N-channel MOSFET product line, engineered specifically for high-current, low-voltage power switching in portable and battery-powered systems where thermal density and gate drive simplicity are critical.
FAQ
What is the maximum continuous drain current rating for TPN4R203NC?
The TPN4R203NC is rated for 53 A DC drain current at Tc = 25 °C. However, the package itself is limited to 45 A per absolute maximum ratings. Actual usable current depends on PCB layout, copper area, ambient temperature, and thermal interface - derating is required above 25 °C case temperature per the guaranteed maximum PD-Tc curve in Figure 8.12. The TPN4R203NC must be mounted on a minimum 100 mm² 2-oz copper pad for rated performance.
Does TPN4R203NC support 3.3 V gate drive?
Yes, the TPN4R203NC has a gate threshold voltage range of 1.3–2.3 V, ensuring full enhancement with 3.3 V logic-level signals. At VGS = 4.5 V, RDS(ON) is specified at 6.4 mΩ (max), making it suitable for 3.3 V microcontroller outputs without level shifting. However, for lowest conduction loss, 10 V drive is recommended to achieve the 3.5 mΩ (typ.) value. The TPN4R203NC gate oxide is rated for ±20 V, so 3.3 V drive poses no reliability risk.
What is the avalanche energy rating of TPN4R203NC and how is it tested?
The TPN4R203NC has a single-pulse avalanche energy rating of 62 mJ, measured under conditions of VDD ≈ 24 V, Tch = 25 °C (initial), L = 0.091 mH, and IAR = 23 A per Note 5 in the datasheet. This rating validates safe operation during inductive switching events such as motor commutation or relay de-energization. The TPN4R203NC does not require external avalanche snubbers in properly designed circuits meeting these test conditions.
How should the exposed drain pad of TPN4R203NC be connected on the PCB?
The exposed drain pad (pins 5–8) of the TPN4R203NC must be soldered directly to a large, thermally robust copper pour on the PCB - ideally ≥100 mm² of 2-oz copper with multiple thermal vias to inner ground planes. This connection serves dual purposes: it provides the primary thermal path (Rth(ch-c) = 5.68 °C/W) and carries high-current drain return paths. Floating or undersized pads will cause excessive junction temperature rise and premature failure. The TPN4R203NC thermal performance is validated only with this mounting method per JEDEC MS-012 standards.
Is TPN4R203NC RoHS compliant and halogen-free?
Yes, the TPN4R203NC is RoHS compliant and halogen-free per Toshiba's environmental specifications. It meets EU Directive 2011/65/EU and contains ≤900 ppm bromine and ≤900 ppm chlorine in homogeneous materials. Full compliance documentation, including IMDS and IPC-1752 reports, is available upon request from Toshiba or authorized distributors. The TPN4R203NC is also compliant with Toshiba's Green Procurement Standards and REACH SVHC requirements.
TPN4R203NC,L1Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- U-MOSVIII
- Package/Case:
- 8-PowerVDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 23A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 4.2mOhm @ 11.5A, 10V
- Vgs(th) (Max) @ Id:
- 2.3V @ 200µA
- Gate Charge (Qg) (Max) @ Vgs:
- 24 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1370 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 700mW (Ta), 22W (Tc)
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSON Advance (3.1x3.1)
TPN4R203NC,L1Q FAQ
1.How can I place an order for TPN4R203NC,L1Q through Aetrix?
Please submit a Request for Quotation (RFQ) for TPN4R203NC,L1Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TPN4R203NC,L1Q reliable?
The price and inventory of TPN4R203NC,L1Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPN4R203NC,L1Q is usually 5 days.
3.What payment methods are accepted for TPN4R203NC,L1Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPN4R203NC,L1Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TPN4R203NC,L1Q?
TPN4R203NC,L1Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TPN4R203NC,L1Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TPN4R203NC,L1Q?
For technical support, including TPN4R203NC,L1Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPN4R203NC,L1Q requirements.
6.How does Aetrix verify that TPN4R203NC,L1Q is sourced from the original manufacturer or authorized distributors?
All TPN4R203NC,L1Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPN4R203NC,L1Q meets industry standards.
7.What is the process for return or replacement of TPN4R203NC,L1Q?
All TPN4R203NC,L1Q units undergo pre-shipment inspection (PSI). If there is an issue with TPN4R203NC,L1Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TPN4R203NC,L1Q part is unused and in its original packaging.
Return procedure for TPN4R203NC,L1Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TPN4R203NC,L1Q Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

