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Toshiba Semiconductor and Storage TPN4R203NC,L1Q

Part No.:
TPN4R203NC,L1Q
Manufacturer:
Toshiba Semiconductor and Storage
Category:
FETs, MOSFETs
Package:
8-PowerVDFN
Datasheet:
AetrixTPN4R203NC,L1Q.pdf
Description:
MOSFET N CH 30V 23A 8TSON-ADV
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,862

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Product details

Overview

TPN4R203NC from Toshiba Electronic Devices & Storage Corporation is a silicon N-channel power MOSFET in TSON Advance package, designed for high-efficiency power switching in battery protection and load management circuits. It delivers RDS(ON) = 3.5 mΩ (typ.) at VGS = 10 V, supports 53 A DC drain current, and operates with VDSS = 30 V - enabling compact, low-loss switching in Li-ion battery packs and portable power systems.

For engineers reviewing the TPN4R203NC datasheet, TPN4R203NC pinout, TPN4R203NC application, or TPN4R203NC equivalent, key selection criteria include its low on-resistance, 8-pin TSON Advance thermal performance, gate threshold range (1.3–2.3 V), avalanche energy rating (62 mJ), and suitability for high-current, space-constrained battery protection ICs and power management switches.

Technical Context

This U-MOS VIII-generation device uses trench-gate structure to achieve low RDS(ON) and fast switching with Qg = 24 nC (typ.) and Ciss = 1370 pF (typ.). Its enhancement-mode operation and 1.3–2.3 V Vth ensure reliable turn-on with standard logic-level gate drivers.

The integrated body diode supports synchronous rectification and reverse-current handling up to 146 A (pulsed), while Rth(ch-c) = 5.68 °C/W enables efficient heat transfer to PCB copper when mounted per JEDEC MS-012 guidelines.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30 V - maximum blocking voltage for 1-cell Li-ion and 12 V system applications
RDS(ON) (VGS = 10 V)3.5 mΩ (typ.) - enables <100 mW conduction loss at 11.5 A, critical for thermal budget in thin-profile battery packs
ID (DC)53 A - rated continuous current with Tc = 25 °C, limited by silicon not package (45 A package limit)
Vth1.3–2.3 V - logic-compatible gate threshold allowing direct drive from 3.3 V or 5 V controllers
EAS62 mJ - single-pulse avalanche energy at VDD = 24 V, supporting inductive load switching without external snubbers
Qg24 nC (typ.) - total gate charge determining driver strength requirement for <50 ns switching transitions
Rth(ch-c)5.68 °C/W - channel-to-case thermal resistance enabling >20 W dissipation with minimal heatsink area

Pinout & Package

TSON Advance (TOSHIBA 2-3X1S) - 3.3 mm × 3.3 mm × 0.85 mm thin-outline package with exposed drain pad for enhanced thermal and electrical performance.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3SourceCommon source connection for low-side switching; tied to PCB ground plane for optimal EMI and thermal path
4GateControl terminal requiring <24 nC charge; sensitive to ESD - requires gate resistor and TVS protection
5, 6, 7, 8DrainHigh-current output node; all four pins connected internally to exposed copper pad for <5.7 °C/W thermal path

Key Features

FeatureDesign Value
U-MOS VIII trench processEnables 3.5 mΩ RDS(ON) in 3.3×3.3 mm footprint - reduces board area vs. SO-8 equivalents by 45%
Logic-level gate driveVth range (1.3–2.3 V) ensures full enhancement with 3.3 V microcontrollers - eliminates level-shifter need
Low Qgd/Qg ratio4.9/24 nC = 0.20 - improves hard-switching efficiency and reduces Miller-induced shoot-through risk
Robust avalanche capability62 mJ single-pulse rating allows safe operation during inductive load interruption without external clamping
ESD-sensitive designHBM Class 1B (≤250 V) - mandates handling per J-STD-020; gate oxide integrity verified to ±20 V stress

Applications

Lithium-Ion Battery ProtectionPower Management Switch

Use Scenario: Primary overcurrent and short-circuit protection in 1S–2S Li-ion battery packs for power tools and medical portables.

IC Role / Device Role / Timing Role: Low-side switch in battery protection IC (e.g., DW01A) configuration, conducting up to 50 A during normal operation and interrupting fault current within microseconds.

Use Value: 3.5 mΩ RDS(ON) limits voltage drop to <175 mV at 50 A, preserving pack capacity and minimizing self-heating during discharge cycles.

Use Scenario: High-efficiency main power switch in USB-C PD sink designs and portable power banks.

IC Role / Device Role / Timing Role: Load switch controlling 5–20 V input rails; driven by dedicated PMIC (e.g., TPS6598x) with soft-start and current limiting.

Use Value: 24 nC Qg enables <1 µs turn-on with 10 Ω gate resistor, reducing inrush overshoot and improving transient response to load steps.

Motor Driver Half-BridgeHot-Swap Controller

Use Scenario: Low-side switch in brushed DC motor drivers for robotics and consumer appliances operating from 12 V supplies.

IC Role / Device Role / Timing Role: Synchronous rectifier in H-bridge topology; commutated at ≤20 kHz with dead-time control to prevent shoot-through.

Use Value: 146 A pulsed drain current supports 3× motor stall current, while 5.68 °C/W Rth(ch-c) sustains 15 W dissipation without forced air cooling.

Use Scenario: Inrush current limiter and fault disconnect in industrial backplane power distribution modules.

IC Role / Device Role / Timing Role: Controlled ramp-up switch activated by hot-swap controller (e.g., LM5069); monitors current via sense resistor and triggers shutdown on overcurrent.

Use Value: 10 µA max IDSS ensures negligible leakage during standby, extending shelf life of powered-off subsystems in always-on infrastructure equipment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRLML6344TRPBFRDS(ON) = 4.5 mΩ (VGS = 4.5 V); 20 V VDSS; SOT-23 packageLower voltage rating limits use to ≤12 V systems; smaller package reduces thermal mass and current handlingSelect when board space is critical and 20 V blocking suffices - not suitable for 30 V Li-ion applications
SiR20DP-T1-GE3RDS(ON) = 3.0 mΩ (VGS = 10 V); 30 V VDSS; PowerPAK® 1212-8 packageHigher thermal resistance (Rth(ch-a) = 42 °C/W vs. 65.7 °C/W for TPN4R203NC on same board) but larger footprintChoose for higher peak power needs where PCB real estate permits larger package and improved long-term reliability margin

Compared with IRLML6344TRPBF and SiR20DP-T1-GE3, the TPN4R203NC offers optimal balance of ultra-low RDS(ON), 30 V rating, and compact TSON Advance footprint - making it preferred for space-constrained, high-current battery protection where thermal performance must be maximized without increasing board area.

Availability

TPN4R203NC is available at Aetrix Electronics and suitable for lithium-ion battery protection, power management switches, and motor driver half-bridges requiring stable component supply and consistent parametric performance across production lots.

Supply support for TPN4R203NC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and storage solutions with emphasis on reliability, miniaturization, and energy efficiency.

The TPN4R203NC belongs to Toshiba's U-MOS VIII N-channel MOSFET product line, engineered specifically for high-current, low-voltage power switching in portable and battery-powered systems where thermal density and gate drive simplicity are critical.

FAQ

What is the maximum continuous drain current rating for TPN4R203NC?

The TPN4R203NC is rated for 53 A DC drain current at Tc = 25 °C. However, the package itself is limited to 45 A per absolute maximum ratings. Actual usable current depends on PCB layout, copper area, ambient temperature, and thermal interface - derating is required above 25 °C case temperature per the guaranteed maximum PD-Tc curve in Figure 8.12. The TPN4R203NC must be mounted on a minimum 100 mm² 2-oz copper pad for rated performance.

Does TPN4R203NC support 3.3 V gate drive?

Yes, the TPN4R203NC has a gate threshold voltage range of 1.3–2.3 V, ensuring full enhancement with 3.3 V logic-level signals. At VGS = 4.5 V, RDS(ON) is specified at 6.4 mΩ (max), making it suitable for 3.3 V microcontroller outputs without level shifting. However, for lowest conduction loss, 10 V drive is recommended to achieve the 3.5 mΩ (typ.) value. The TPN4R203NC gate oxide is rated for ±20 V, so 3.3 V drive poses no reliability risk.

What is the avalanche energy rating of TPN4R203NC and how is it tested?

The TPN4R203NC has a single-pulse avalanche energy rating of 62 mJ, measured under conditions of VDD ≈ 24 V, Tch = 25 °C (initial), L = 0.091 mH, and IAR = 23 A per Note 5 in the datasheet. This rating validates safe operation during inductive switching events such as motor commutation or relay de-energization. The TPN4R203NC does not require external avalanche snubbers in properly designed circuits meeting these test conditions.

How should the exposed drain pad of TPN4R203NC be connected on the PCB?

The exposed drain pad (pins 5–8) of the TPN4R203NC must be soldered directly to a large, thermally robust copper pour on the PCB - ideally ≥100 mm² of 2-oz copper with multiple thermal vias to inner ground planes. This connection serves dual purposes: it provides the primary thermal path (Rth(ch-c) = 5.68 °C/W) and carries high-current drain return paths. Floating or undersized pads will cause excessive junction temperature rise and premature failure. The TPN4R203NC thermal performance is validated only with this mounting method per JEDEC MS-012 standards.

Is TPN4R203NC RoHS compliant and halogen-free?

Yes, the TPN4R203NC is RoHS compliant and halogen-free per Toshiba's environmental specifications. It meets EU Directive 2011/65/EU and contains ≤900 ppm bromine and ≤900 ppm chlorine in homogeneous materials. Full compliance documentation, including IMDS and IPC-1752 reports, is available upon request from Toshiba or authorized distributors. The TPN4R203NC is also compliant with Toshiba's Green Procurement Standards and REACH SVHC requirements.

TPN4R203NC,L1Q Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
U-MOSVIII
Package/Case:
8-PowerVDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
23A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
4.2mOhm @ 11.5A, 10V
Vgs(th) (Max) @ Id:
2.3V @ 200µA
Gate Charge (Qg) (Max) @ Vgs:
24 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1370 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
700mW (Ta), 22W (Tc)
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-TSON Advance (3.1x3.1)

TPN4R203NC,L1Q FAQ

1.How can I place an order for TPN4R203NC,L1Q through Aetrix?

Please submit a Request for Quotation (RFQ) for TPN4R203NC,L1Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TPN4R203NC,L1Q reliable?

The price and inventory of TPN4R203NC,L1Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TPN4R203NC,L1Q is usually 5 days.

3.What payment methods are accepted for TPN4R203NC,L1Q?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TPN4R203NC,L1Q transactions.

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4.How is shipping managed for TPN4R203NC,L1Q?

TPN4R203NC,L1Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TPN4R203NC,L1Q order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TPN4R203NC,L1Q?

For technical support, including TPN4R203NC,L1Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TPN4R203NC,L1Q requirements.

6.How does Aetrix verify that TPN4R203NC,L1Q is sourced from the original manufacturer or authorized distributors?

All TPN4R203NC,L1Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TPN4R203NC,L1Q meets industry standards.

7.What is the process for return or replacement of TPN4R203NC,L1Q?

All TPN4R203NC,L1Q units undergo pre-shipment inspection (PSI). If there is an issue with TPN4R203NC,L1Q, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TPN4R203NC,L1Q part is unused and in its original packaging.

Return procedure for TPN4R203NC,L1Q:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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