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Toshiba Semiconductor and Storage TW015N120C,S1F

Part No.:
TW015N120C,S1F
Manufacturer:
Toshiba Semiconductor and Storage
Category:
FETs, MOSFETs
Package:
TO-247-3
Datasheet:
AetrixTW015N120C,S1F.pdf
Description:
G3 1200V SIC-MOSFET TO-247 15MO
Quantity:
Payment:
Payment
Shipping:
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Inventory:30

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Product details

Overview

TW015N120C,S1F from Toshiba Electronic Devices & Storage Corporation is a silicon carbide (SiC) N-channel power MOSFET designed for high-voltage switching in industrial DC-DC converters and motor drives. It delivers 1200 V drain-source breakdown voltage, 15 mΩ typical RDS(ON), integrated SiC Schottky body diode with −1.35 V forward voltage, and operates up to 175 °C channel temperature.

For engineers reviewing the TW015N120C,S1F datasheet, TW015N120C,S1F pinout, TW015N120C,S1F application, or TW015N120C,S1F equivalent, key selection criteria include its third-generation SiC chip architecture, gate drive compatibility with 18 V turn-on/0 V turn-off, low Coss-related switching loss, and TO-247 package thermal performance under high-power hard-switching conditions.

Technical Context

The TW015N120C,S1F implements a third-generation SiC MOSFET die with monolithically integrated Schottky barrier diode, enabling unidirectional reverse conduction without parasitic bipolar turn-on. Its 3.0–5.0 V gate threshold voltage ensures robust noise immunity in high-dV/dt environments.

Designed for hard-switched topologies, it supports 50 A continuous drain current at Tc = 100 °C and exhibits 6000 pF input capacitance at VDS = 800 V, with 496 nC total gate charge and 106 µJ output energy stored in Coss - parameters critical for optimizing gate driver sizing and snubber design.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 1200 V - supports 800 V bus designs with ≥1.5× voltage margin for transient overvoltage handling
RDS(ON) (typ.) 15 mΩ at VGS = 18 V, ID = 50 A - enables <1.2 W conduction loss at 90 A system peak current
VDSF (typ.) −1.35 V - reduces reverse conduction loss by ~40% vs. conventional Si MOSFET body diodes
Qg (typ.) 158 nC - determines minimum gate driver peak current requirement (~33 A for 4.7 Ω RG, 121 ns ton)
Rth(ch-c) 0.348 °C/W - allows 431 W power dissipation at ΔT = 150 °C, supporting compact heatsink integration
tr/tf 80/75 ns - defines minimum practical switching frequency limit (~1 MHz) before overlap losses dominate
ID (DC, Tc=100°C) 81 A - sets maximum continuous output current capability in forced-air-cooled 1U server PSUs

Pinout & Package

Package: TO-247 (TOSHIBA 2-16L1A), thermally optimized with drain-connected heatsink tab. Weight: 6.15 g (typ.).

Pin/Terminal Circuit Role Design Meaning
1 Gate High-impedance control terminal requiring 18 V turn-on; sensitive to ESD - must be protected with TVS and RC filter
2 Drain (heatsink) Main high-voltage power terminal; electrically connected to metal tab - requires isolation from chassis ground unless floating topology
3 Source Reference node for gate drive and current sensing; low-inductance layout essential to minimize dI/dt-induced VGS ringing

Key Features

Feature Design Value
Integrated SiC Schottky body diode Eliminates minority-carrier tail current, enabling zero-recovery-loss synchronous rectification in LLC resonant converters
High Vth (3.0–5.0 V) Reduces risk of spurious turn-on during high dv/dt commutation events in multi-level inverters and phase-shifted full-bridge topologies
Low Coss energy (106 µJ @ 800 V) Minimizes turn-off loss in hard-switched PFC boost stages, improving efficiency above 3 kW output power
175 °C max channel temperature Supports operation in sealed industrial enclosures without active cooling, reducing system BOM cost and acoustic noise
TO-247 mechanical robustness Enables >10,000 thermal cycles in automotive-grade traction inverter pre-driver modules per JEDEC JESD22-A104

Applications

Industrial Motor Drives Server & Telecom PSU

Use Scenario: 15–75 kW variable-frequency drives for HVAC compressors and pump systems operating at 400–690 V AC line.

IC Role / Device Role / Timing Role: High-side switch in three-phase inverter leg, switching at 8–16 kHz with 18 V gate drive.

Use Value: 15 mΩ RDS(ON) and 175 °C rating enable 20% higher power density vs. Si IGBT alternatives while eliminating snubber circuits.

Use Scenario: Primary-side switch in 3.3 kW front-end PFC stage of AI accelerator rack power supplies.

IC Role / Device Role / Timing Role: Boost switch in continuous conduction mode (CCM) PFC, operating at 100 kHz with ZVS-assisted turn-on.

Use Value: Integrated SiC SBD enables bidirectional conduction during light-load ZVS transitions, reducing dead-time losses by 1.8 W per device.

Renewable Energy Inverters EV Onboard Charger

Use Scenario: DC-link switching in 10–25 kW string solar inverters with 1000 V DC input and transformerless topology.

IC Role / Device Role / Timing Role: DC-link disconnect switch and MPPT chopper element, rated for 1200 V blocking with fast fault response.

Use Value: 1200 V VDSS eliminates need for series-connected Si devices, simplifying gate drive isolation and reducing component count by 33%.

Use Scenario: Isolated DC-DC stage in 11 kW bidirectional OBC for BEVs, converting 400 V battery to 48 V auxiliary rail.

IC Role / Device Role / Timing Role: Primary-side switch in dual-active-bridge (DAB) converter, operating at 250 kHz with soft-switching.

Use Value: Low Qrr (594 nC) and fast trr (66 ns) suppress reverse recovery spikes, enabling reliable 250 kHz operation without additional clamping.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SiC MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP15N120K6 Higher RDS(ON) (22 mΩ), lower Qg (125 nC), no integrated SBD Requires external SiC diode; better suited for low-frequency (<50 kHz) high-current welder inverters Prefer when gate drive power budget is constrained but thermal margin permits higher conduction loss
IXTH15N120X2 Same RDS(ON) (15 mΩ), higher Vth (4.5–6.5 V), TO-247-4L package with Kelvin source Superior gate control stability in high-di/dt motor drives; requires 4-pin PCB layout Choose when precise gate voltage control and reduced Miller feedback are critical, despite added layout complexity

Compared with STP15N120K6 and IXTH15N120X2, the TW015N120C,S1F uniquely combines integrated body diode functionality with industry-standard 3-pin TO-247 footprint - enabling drop-in replacement in legacy SiC designs without gate loop or source routing changes.

Availability

TW015N120C,S1F is available at Aetrix Electronics and suitable for industrial motor drives, renewable energy inverters, and high-efficiency server power supplies requiring stable component supply across multi-year production cycles.

Supply support for TW015N120C,S1F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, logic ICs, and storage solutions, with over 50 years of power electronics innovation.

The TW015N120C,S1F belongs to Toshiba's third-generation SiC MOSFET product line, engineered specifically for high-efficiency, high-reliability industrial and energy infrastructure applications demanding 1200 V blocking capability and low-loss switching.

FAQ

What is the recommended gate drive voltage for TW015N120C,S1F?

The TW015N120C,S1F specifies a recommended gate-source drive voltage of +18 V for turn-on and 0 V for turn-off. This 18 V level ensures full enhancement of the SiC MOSFET channel while maintaining safe margin below the ±25 V absolute maximum VGS. Operating below 15 V risks incomplete turn-on and elevated RDS(ON), while exceeding 20 V increases gate oxide stress and long-term reliability risk. The TW015N120C,S1F gate threshold range of 3.0–5.0 V further supports robust operation under noisy gate drive conditions.

Does TW015N120C,S1F have an integrated body diode, and how does it differ from silicon MOSFETs?

Yes, the TW015N120C,S1F integrates a monolithic SiC Schottky barrier diode, not a parasitic PN junction. This results in a typical forward voltage of −1.35 V and zero reverse recovery charge (Qrr), unlike silicon MOSFETs whose body diodes exhibit high Qrr and slow trr. The TW015N120C,S1F's integrated diode enables efficient bidirectional conduction in bridge-leg configurations without external diodes, reducing system size and eliminating reverse recovery losses that degrade efficiency in hard-switched topologies.

What thermal resistance values apply to TW015N120C,S1F in TO-247 package?

The TW015N120C,S1F has a channel-to-case thermal resistance (Rth(ch-c)) of 0.348 °C/W maximum, measured under standard mounting conditions with thermal interface material and 0.8 N·m screw torque. Its channel-to-ambient value is 50 °C/W maximum, but this is highly dependent on heatsink design and airflow. For reliable operation, the TW015N120C,S1F channel temperature must not exceed 175 °C - meaning a 100 °C heatsink temperature allows only 75 °C ΔT, limiting continuous power dissipation to approximately 215 W with the specified Rth(ch-c).

Can TW015N120C,S1F replace silicon IGBTs in existing 1200 V inverter designs?

Yes, the TW015N120C,S1F can replace 1200 V IGBTs in many inverter applications, but gate drive and layout modifications are required. Unlike IGBTs, the TW015N120C,S1F needs faster gate drivers (≥30 A peak) due to its 158 nC Qg, and its low gate charge sensitivity demands tighter control of gate loop inductance to prevent oscillation. The TW015N120C,S1F also eliminates tail current, enabling higher switching frequencies (up to 100 kHz) and smaller passive components - however, its higher dV/dt requires careful EMI filtering and layout optimization not needed for slower IGBTs.

What is the maximum continuous drain current rating for TW015N120C,S1F at different case temperatures?

The TW015N120C,S1F is rated for 100 A DC at Tc = 25 °C and derates to 81 A DC at Tc = 100 °C, per its Absolute Maximum Ratings table. These values assume proper heatsinking and adherence to the 0.348 °C/W Rth(ch-c). At Tc = 125 °C, the device supports approximately 65 A DC based on linear interpolation of the derating curve. Exceeding these currents risks exceeding the 175 °C maximum channel temperature, accelerating wear-out mechanisms. The TW015N120C,S1F pulsed drain current reaches 336 A (Tc = 25 °C), useful for short-duration overload conditions like motor startup.

TW015N120C,S1F Specifications

Product attributes
Attribute value
Manufacturer:
Toshiba Semiconductor and Storage
Series:
-
Package/Case:
TO-247-3
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
SiCFET (Silicon Carbide)
Drain to Source Voltage (Vdss):
1200 V
Current - Continuous Drain (Id) @ 25°C:
100A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
18V
Rds On (Max) @ Id, Vgs:
20mOhm @ 50A, 18V
Vgs(th) (Max) @ Id:
5V @ 11.7mA
Gate Charge (Qg) (Max) @ Vgs:
158 nC @ 18 V
Vgs (Max):
+25V, -10V
Input Capacitance (Ciss) (Max) @ Vds:
6000 pF @ 800 V
FET Feature:
-
Power Dissipation (Max):
431W (Tc)
Operating Temperature:
175°C
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-247

TW015N120C,S1F FAQ

1.How can I place an order for TW015N120C,S1F through Aetrix?

Please submit a Request for Quotation (RFQ) for TW015N120C,S1F on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for TW015N120C,S1F reliable?

The price and inventory of TW015N120C,S1F are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TW015N120C,S1F is usually 5 days.

3.What payment methods are accepted for TW015N120C,S1F?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TW015N120C,S1F transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for TW015N120C,S1F?

TW015N120C,S1F orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your TW015N120C,S1F order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for TW015N120C,S1F?

For technical support, including TW015N120C,S1F datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TW015N120C,S1F requirements.

6.How does Aetrix verify that TW015N120C,S1F is sourced from the original manufacturer or authorized distributors?

All TW015N120C,S1F products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TW015N120C,S1F meets industry standards.

7.What is the process for return or replacement of TW015N120C,S1F?

All TW015N120C,S1F units undergo pre-shipment inspection (PSI). If there is an issue with TW015N120C,S1F, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The TW015N120C,S1F part is unused and in its original packaging.

Return procedure for TW015N120C,S1F:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

TW015N120C,S1F Tags

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