Renesas UPA2717GR-E1-AT
- Part No.:
- UPA2717GR-E1-AT
- Manufacturer:
- Renesas
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerSOIC (0.173", 4.40mm Width)
- Datasheet:
-
UPA2717GR-E1-AT.pdf
- Description:
- P-CHANNEL POWER MOSFET
- Quantity:
- Payment:

- Shipping:

Inventory:7,081
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Product details
Overview
UPA2717GR-E1-AT from Renesas Electronics is a P-channel power MOSFET designed for high-efficiency power switching in notebook computer power management and Li-ion battery protection circuits. It delivers RDS(on) = 5.5 mΩ (VGS = −10 V, ID = −7.5 A), supports −30 V drain-source voltage, and operates with gate-to-source voltage up to −20 V. Its Power SOP8 package enables compact, surface-mount integration in space-constrained portable systems.
For engineers reviewing the UPA2717GR-E1-AT datasheet, UPA2717GR-E1-AT pinout, UPA2717GR-E1-AT application, or UPA2717GR-E1-AT equivalent, key selection criteria include low-voltage gate drive capability (RDS(on) ≤ 8.9 mΩ at VGS = −4.5 V), built-in gate ESD protection diode, avalanche energy rating (EAS = 22.5 mJ), and thermal performance on standard PCBs.
Technical Context
This device is a single P-channel enhancement-mode MOSFET optimized for synchronous rectification and reverse-polarity protection in DC-DC converters and battery safety IC interfaces. Its body diode exhibits VF(S-D) = 0.82 V (IF = 15 A) and trr = 500 ns, enabling efficient freewheeling without external diodes in many configurations.
The gate charge profile (QG = 130 nC, QGD = 36 nC) and switching times (td(off) = 920 ns, tf = 510 ns) reflect design trade-offs favoring low conduction loss over ultra-fast switching-suitable for <1 MHz buck converter topologies where efficiency at light-to-moderate loads is prioritized.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | −30 V - Maximum blocking voltage for Li-ion battery pack protection (up to 3S configuration). |
| RDS(on)1 | 5.5 mΩ max @ VGS = −10 V, ID = −7.5 A - Enables <1 W conduction loss at 7.5 A, critical for thermal budget in thin notebooks. |
| RDS(on)2 | 8.9 mΩ max @ VGS = −4.5 V, ID = −7.5 A - Supports logic-level gate drive from common 5 V or 3.3 V controllers. |
| QG | 130 nC - Determines gate driver current requirement; ~13 mA average for 1 MHz switching at 10 V swing. |
| EAS | 22.5 mJ - Specifies single-pulse avalanche robustness during inductive load turn-off transients in battery disconnect circuits. |
| Ciss | 3550 pF typ - Impacts gate drive power loss and Miller effect; requires careful layout to avoid oscillation at high dV/dt. |
| Tch max | 150 °C - Defines maximum junction temperature; derating required above 25 °C ambient on standard FR4 boards. |
Pinout & Package
UPA2717GR-E1-AT is housed in a Power SOP8 (Surface Mount Small Outline Package, 8-pin) with exposed drain pad for thermal enhancement. The package measures 6.0 mm × 4.4 mm × 1.8 mm and features pure Sn (lead-free) plating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source | Common return path for load current; electrically tied to internal substrate; must be low-inductance connection to ground plane. |
| 4 | Gate | Control input requiring −10 V to fully enhance; includes integrated gate-source ESD protection diode. |
| 5, 6, 7, 8 | Drain | Main power output node; pins 5–8 and exposed underside pad are internally connected to handle high pulsed currents (ID(pulse) = −150 A). |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) at −4.5 V gate drive | 8.9 mΩ max enables use with 5 V microcontrollers or battery monitor ICs without level-shifting circuitry. |
| Built-in gate protection diode | Integrated Zener between gate and source provides ESD immunity per JESD22-A114 (≥2 kV HBM), reducing external protection component count. |
| High avalanche energy rating | 22.5 mJ single-pulse capability allows safe operation during battery short-circuit events or hot-plug transients without failure. |
| Optimized for Li-ion battery protection | Specified RDS(on) and thermal resistance validated under conditions matching typical battery pack FET placement (e.g., ceramic substrate mounting). |
| Lead-free and RoHS-compliant | Pure Sn plating meets EU RoHS Directive 2011/65/EU and JEDEC JS-709B, supporting environmentally compliant manufacturing. |
Applications
| Li-ion Battery Protection Circuit | Notebook Computer Power Switch |
|---|---|
|
Use Scenario: Integrated into smart battery packs to disconnect cells during overcurrent, overvoltage, or overtemperature faults. IC Role / Device Role / Timing Role: Primary power switch in series with battery stack; controlled by dedicated protection IC (e.g., S-8261) via gate driver. Use Value: Low RDS(on) minimizes voltage drop and self-heating during normal operation, extending runtime and improving fault detection accuracy. |
Use Scenario: Used as main system power switch in notebook motherboards to enable/disable +5 V or +3.3 V rails based on AC adapter presence or sleep state. IC Role / Device Role / Timing Role: High-side P-channel switch controlled by PMIC or EC (Embedded Controller) GPIO with open-drain pull-down. Use Value: Gate threshold compatibility with 3.3 V logic ensures clean turn-on/turn-off without external level shifters, simplifying board design. |
| USB-C Power Delivery Sink | Industrial Portable Equipment Power Path |
|
Use Scenario: Implements reverse-polarity and overcurrent protection in USB-C PD sink applications where VBUS may be applied before controller initialization. IC Role / Device Role / Timing Role: Input protection FET placed between USB-C connector and PD controller; gate driven by internal bias or auxiliary LDO. Use Value: Avalanche rating absorbs inductive kickback from cable insertion/removal, preventing latch-up or damage to downstream PD PHY. |
Use Scenario: Controls power delivery to motor drivers or sensors in handheld test equipment powered by removable Li-ion packs. IC Role / Device Role / Timing Role: Main power distribution switch managed by MCU firmware during battery swap or low-power mode transitions. Use Value: Surface-mount Power SOP8 footprint allows dense layout in compact enclosures while maintaining thermal margin via copper pour under drain pad. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si2301DDS-T1-GE3 | RDS(on) = 115 mΩ @ −4.5 V; smaller SOT-23 package; lower ID(DC) = −2.7 A. | Suitable only for sub-2 A loads; lacks avalanche rating and thermal mass for battery protection duty cycles. | Select when board space is critical and current demand is ≤2 A; not recommended for primary battery FET role. |
| IRF7425PBF | RDS(on) = 24 mΩ @ −4.5 V; SO-8 package; EAS = 12 mJ; higher QG = 22 nC. | Lower conduction loss than Si2301 but significantly higher than UPA2717GR-E1-AT; less robust under repetitive avalanche stress. | Choose for cost-sensitive industrial controls where 24 mΩ is acceptable and avalanche immunity is secondary. |
Compared with Si2301DDS-T1-GE3 and IRF7425PBF, UPA2717GR-E1-AT uniquely balances ultra-low RDS(on) at logic-level gate drive, certified avalanche energy, and thermal performance in Power SOP8-making it optimal for high-reliability Li-ion protection where both efficiency and fault tolerance are mandatory.
Availability
UPA2717GR-E1-AT is available at Aetrix Electronics and suitable for notebook computer power management, Li-ion battery protection circuits, and USB-C power delivery sink designs requiring stable component supply and long-term manufacturability.
Supply support for UPA2717GR-E1-AT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader formed in 2010 through the merger of NEC Electronics and Renesas Technology, specializing in microcontrollers, analog, power, and SoC solutions.
The UPA2717GR-E1-AT belongs to Renesas' legacy Power MOSFET product line, engineered specifically for portable computing and battery safety applications demanding low RDS(on), robust transient handling, and lead-free compliance.
FAQ
What is the maximum continuous drain current rating for UPA2717GR-E1-AT?
The UPA2717GR-E1-AT has a maximum continuous drain current (ID(DC)) of −15 A at TA = 25°C when mounted on a ceramic substrate (1200 mm² × 2.2 mm). On standard 1-inch square FR4 PCBs, this rating drops to approximately −5.5 A due to thermal limitations-designers must verify actual board layout and copper area to ensure safe operation within the 150 °C channel temperature limit.
Does UPA2717GR-E1-AT support gate drive from a 3.3 V microcontroller?
Yes, the UPA2717GR-E1-AT is specified for RDS(on)2 = 8.9 mΩ maximum at VGS = −4.5 V and ID = −7.5 A, confirming reliable enhancement with 5 V logic. While not characterized at exactly −3.3 V, its gate threshold (VGS(off) = −1.0 to −2.5 V) and transfer characteristics show usable conduction down to −3.5 V-however, full RDS(on) performance requires ≥−4.5 V, so level-shifting is recommended for 3.3 V-only control.
Is there an integrated body diode in UPA2717GR-E1-AT, and what are its key parameters?
Yes, UPA2717GR-E1-AT includes an intrinsic body diode between source and drain. Its forward voltage is VF(S-D) = 0.82 V at IF = 15 A and VGS = 0 V, with reverse recovery time trr = 500 ns and Qrr = 1320 nC. This diode supports freewheeling in synchronous buck topologies but is not optimized for high-frequency switching-external Schottky diodes may be preferred above 500 kHz.
What is the thermal resistance from channel to ambient for UPA2717GR-E1-AT on a standard PCB?
When mounted on a 1-inch × 1-inch × 0.8 mm glass epoxy board, the UPA2717GR-E1-AT has a channel-to-ambient thermal resistance (Rth(ch-A)2) of approximately 40 °C/W. This value is derived from the derating curve showing 2 W total power dissipation at 25°C ambient, dropping linearly to zero at 125°C ambient-enabling accurate junction temperature estimation using Tch = TA + PD × Rth(ch-A)2.
Can UPA2717GR-E1-AT be used in automotive applications?
No-UPA2717GR-E1-AT is rated as a "Standard" quality grade device per Renesas documentation, intended for computers, office equipment, and consumer electronics. It is not qualified to AEC-Q101 or supported for automotive use. For automotive battery protection or power switching, Renesas offers dedicated AEC-Q101-qualified P-channel MOSFETs such as the RQ3E080AP.
UPA2717GR-E1-AT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 8-PowerSOIC (0.173", 4.40mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 15A
- Drive Voltage (Max Rds On, Min Rds On):
- 4V, 10V
- Rds On (Max) @ Id, Vgs:
- 5.5mOhm @ 7.5A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs:
- 130 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3550 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2W (Ta)
- Operating Temperature:
- 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-PowerSOP
UPA2717GR-E1-AT FAQ
1.How can I place an order for UPA2717GR-E1-AT through Aetrix?
Please submit a Request for Quotation (RFQ) for UPA2717GR-E1-AT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UPA2717GR-E1-AT reliable?
The price and inventory of UPA2717GR-E1-AT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UPA2717GR-E1-AT is usually 5 days.
3.What payment methods are accepted for UPA2717GR-E1-AT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UPA2717GR-E1-AT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UPA2717GR-E1-AT?
UPA2717GR-E1-AT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UPA2717GR-E1-AT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UPA2717GR-E1-AT?
For technical support, including UPA2717GR-E1-AT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UPA2717GR-E1-AT requirements.
6.How does Aetrix verify that UPA2717GR-E1-AT is sourced from the original manufacturer or authorized distributors?
All UPA2717GR-E1-AT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UPA2717GR-E1-AT meets industry standards.
7.What is the process for return or replacement of UPA2717GR-E1-AT?
All UPA2717GR-E1-AT units undergo pre-shipment inspection (PSI). If there is an issue with UPA2717GR-E1-AT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UPA2717GR-E1-AT part is unused and in its original packaging.
Return procedure for UPA2717GR-E1-AT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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