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Diodes Incorporated ZXM61P02FTC

Part No.:
ZXM61P02FTC
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
TO-236-3, SC-59, SOT-23-3
Datasheet:
AetrixZXM61P02FTC.pdf
Description:
MOSFET P-CH 20V 900MA SOT23-3
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,665

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Product details

Overview

ZXM61P02FTC from Diodes Incorporated is a 20V P-channel enhancement-mode MOSFET in SOT23 package, rated for -0.92A continuous drain current at VGS = -4.5V, with RDS(on) = 600mΩ and VGS(th) = -0.7 to -1.5V. It serves as a low-side load switch or power rail disconnect device in compact DC-DC converters and battery-powered systems.

For engineers reviewing the ZXM61P02FTC datasheet, ZXM61P02FTC pinout, ZXM61P02FTC application, or ZXM61P02FTC equivalent, key selection criteria include verified gate threshold voltage range, body diode forward voltage (-0.95V), reverse recovery time (14.9ns), thermal resistance (155°C/W), and AEC-Q101 qualification for automotive-grade reliability.

Technical Context

This MOSFET employs a trench-gate structure optimized for low RDS(on) and fast switching, enabling high-efficiency operation in space-constrained power management circuits. Its -20V VDSS, ±12V VGS rating, and low gate charge (Qg = 3.5nC) support robust control with standard logic-level drivers.

The integrated body diode exhibits VSD = -0.95V at IS = -0.61A and trr = 14.9ns, making it suitable for synchronous rectification and bidirectional current paths where controlled reverse recovery is required.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS-20V - Maximum blocking voltage before avalanche conduction in power rail disconnect applications
RDS(on)600mΩ @ VGS = -4.5V - Enables <1.5W conduction loss at 0.92A in thermally limited SOT23 layouts
ID (cont)-0.92A @ TA = +25°C - Continuous current capability defined under JEDEC-standard PCB mounting conditions
VGS(th)-0.7 to -1.5V - Ensures reliable turn-on with 2.7V–3.3V logic-level gate drive without external level shifting
Qg3.5nC - Reduces gate drive power and switching transition time in high-frequency DC-DC controllers
trr14.9ns - Limits reverse recovery energy loss during hard-switched commutation in buck topologies
RθJA155°C/W - Defines junction-to-ambient thermal rise under typical FR4 PCB layout per Note 6

Pinout & Package

Package: SOT23 - Surface-mount plastic case, 0.008g weight, UL 94V-0 rated, moisture sensitivity Level 1, matte tin terminals solderable per MIL-STD-202.

Pin/TerminalCircuit RoleDesign Meaning
Drain (D)High-side or low-side current path terminalConnected to power rail or load return; handles full switched current and must be routed with adequate copper area for thermal dissipation
Source (S)Reference node for gate control and body diode anodeBonded to PCB ground plane in low-side switch configurations; defines VGS reference and conducts body diode current
Gate (G)Control electrode for channel modulationRequires <3.5nC charge for full enhancement; sensitive to ESD-must be protected with series resistor and/or TVS in production designs

Key Features

FeatureDesign Value
Low gate threshold voltageVGS(th) down to -0.7V enables direct interface with 2.7V microcontroller GPIOs without level shifters
Fast switching performanceTurn-off fall time of 10.1ns and Qgd/Qgs ratio of 3.0 minimize Miller-induced shoot-through risk in half-bridge drivers
Integrated body diodeVSD = -0.95V at -0.61A supports freewheeling in buck regulators and reverse-polarity protection circuits
AEC-Q101 qualifiedValidated for automotive temperature range (-55°C to +150°C) and mechanical stress requirements per JESD22

Applications

DC-DC ConvertersPower Management Functions

Use Scenario: Used as synchronous rectifier in 3.3V/5V buck converter output stage operating at 500kHz–1MHz.

IC Role / Device Role / Timing Role: Low-side power switch replacing Schottky diode to reduce conduction loss and improve efficiency by >3%.

Use Value: 600mΩ RDS(on) and 14.9ns trr minimize both static and dynamic losses under light-to-moderate load conditions.

Use Scenario: Load switch controlling power to USB peripheral circuitry in portable medical devices.

IC Role / Device Role / Timing Role: Controlled on/off path between battery and subsystem, with fast turn-off to prevent fault propagation.

Use Value: -1.5V max VGS(th) ensures clean turn-on at 3.0V supply; 0.92A rating covers peak USB enumeration currents.

Disconnect SwitchesMotor Control

Use Scenario: Reverse polarity protection switch placed between Li-ion battery pack and main system board.

IC Role / Device Role / Timing Role: P-channel high-side switch configured with gate driven by dedicated charge pump or regulator.

Use Value: -20V VDSS withstands battery overvoltage transients; body diode blocks reverse current when off.

Use Scenario: H-bridge half-bridge leg driver for 12V brushed DC motor in automotive HVAC actuators.

IC Role / Device Role / Timing Role: Low-side switch in dual-MOSFET configuration, synchronized with complementary high-side driver.

Use Value: 3.5nC Qg allows <100ns switching transitions at 20kHz PWM frequency; AEC-Q101 qualification ensures field reliability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN2011UFD-7RDS(on) = 450mΩ @ VGS = -4.5V; higher ID (1.2A); same SOT23-3 packageLower conduction loss at same current; requires tighter gate drive timing due to higher Qg (4.8nC)Select when efficiency >0.5% improvement justifies marginal cost increase and layout revision for thermal margin
SI2301DDS-T1-BE3RDS(on) = 850mΩ @ VGS = -4.5V; lower VDSS (-20V same); AEC-Q101 not claimedHigher conduction loss but broader distributor availability; no automotive qualification documentationSelect for non-automotive industrial use where qualification traceability is not required and cost is primary constraint

Compared with DMN2011UFD-7 and SI2301DDS-T1-BE3, ZXM61P02FTC delivers balanced trade-offs: verified AEC-Q101 compliance, 600mΩ RDS(on), and 3.5nC Qg-making it optimal for cost-sensitive automotive and medical power switches where reliability and moderate efficiency are jointly prioritized.

Availability

ZXM61P02FTC is available at Aetrix Electronics and suitable for DC-DC converters, power management functions, and disconnect switches requiring stable component supply across automotive, medical, and industrial design cycles.

Supply support for ZXM61P02FTC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.

The ZXM61P02FTC belongs to Diodes' ZXM series of logic-level P-channel MOSFETs, engineered specifically for space-constrained, high-reliability power switching in automotive body electronics and portable equipment.

FAQ

What is the maximum continuous drain current for ZXM61P02FTC at 70°C ambient?

The maximum continuous drain current is -0.7A at TA = +70°C, as specified in the Absolute Maximum Ratings table under Note 6. This derating reflects thermal limitations of the SOT23 package on standard FR4 PCBs, where junction temperature must remain below 150°C. Power dissipation is capped at 806mW with linear derating of 6.4mW/°C above 70°C.

Does ZXM61P02FTC have an integrated body diode, and what are its key parameters?

Yes, ZXM61P02FTC includes an intrinsic body diode with forward voltage VSD = -0.95V at IS = -0.61A and reverse recovery time trr = 14.9ns at TJ = +25°C. These values are measured with VGS = 0V and di/dt = 100A/μs, confirming suitability for freewheeling in buck converters and reverse-current blocking in battery protection circuits.

Is ZXM61P02FTC suitable for use with 3.3V microcontroller GPIOs?

Yes-its gate threshold voltage range of -0.7V to -1.5V ensures full enhancement with 3.3V logic-level drive, as confirmed by RDS(on) = 600mΩ at VGS = -4.5V and functional operation down to VGS = -2.7V (RDS(on) = 900mΩ). No level shifter is required for direct interface with 3.3V MCU outputs.

What is the moisture sensitivity level (MSL) and reflow profile compatibility for ZXM61P02FTC?

ZXM61P02FTC has MSL Level 1 per J-STD-020, meaning it is not moisture-sensitive and may be stored indefinitely at ≤30°C/60% RH without dry-pack requirements. It is compatible with standard lead-free reflow profiles (peak 260°C), with terminals rated for solderability per MIL-STD-202, Method 208.

ZXM61P02FTC Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
TO-236-3, SC-59, SOT-23-3
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
20 V
Current - Continuous Drain (Id) @ 25°C:
900mA (Ta)
Drive Voltage (Max Rds On, Min Rds On):
2.7V, 4.5V
Rds On (Max) @ Id, Vgs:
600mOhm @ 610mA, 4.5V
Vgs(th) (Max) @ Id:
1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
3.5 nC @ 4.5 V
Vgs (Max):
±12V
Input Capacitance (Ciss) (Max) @ Vds:
150 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
625mW (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-23-3

ZXM61P02FTC FAQ

1.How can I place an order for ZXM61P02FTC through Aetrix?

Please submit a Request for Quotation (RFQ) for ZXM61P02FTC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZXM61P02FTC reliable?

The price and inventory of ZXM61P02FTC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXM61P02FTC is usually 5 days.

3.What payment methods are accepted for ZXM61P02FTC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXM61P02FTC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ZXM61P02FTC?

ZXM61P02FTC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZXM61P02FTC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZXM61P02FTC?

For technical support, including ZXM61P02FTC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXM61P02FTC requirements.

6.How does Aetrix verify that ZXM61P02FTC is sourced from the original manufacturer or authorized distributors?

All ZXM61P02FTC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXM61P02FTC meets industry standards.

7.What is the process for return or replacement of ZXM61P02FTC?

All ZXM61P02FTC units undergo pre-shipment inspection (PSI). If there is an issue with ZXM61P02FTC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZXM61P02FTC part is unused and in its original packaging.

Return procedure for ZXM61P02FTC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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