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Diodes Incorporated ZXM62N03E6TA

Part No.:
ZXM62N03E6TA
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
SOT-23-6
Datasheet:
AetrixZXM62N03E6TA.pdf
Description:
MOSFET N-CH 30V 3.2A SOT-23-6
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,934

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Product details

Overview

ZXM62N03E6TA from Zetex (now Diodes Incorporated) is a 30V N-channel enhancement-mode MOSFET in SOT23-6 package, with RDS(on) = 0.11 Ω @ VGS = 10V, ID = 2.2A, and fast switching (td(on) = 2.9 ns, Qg = 9.6 nC). It serves as a low-voltage power switch in compact DC-DC converters and load disconnect circuits.

For engineers reviewing the ZXM62N03E6TA datasheet, ZXM62N03E6TA pinout, ZXM62N03E6TA application, or ZXM62N03E6TA equivalent, key selection criteria include its 0.11 Ω on-resistance at 10V gate drive, 3.2A continuous drain rating at 25°C, body diode forward voltage of 0.95V, and SOT23-6 thermal performance (RθJA = 73 °C/W under optimized PCB conditions).

Technical Context

This MOSFET employs a high-density planar structure optimized for low RDS(on) and fast switching-achieving tr = 5.6 ns and tf = 6.4 ns with 6.0 Ω gate resistance. Its VGS(th) = 1.0 V (min) enables compatibility with 3.3V logic-level drive.

The integrated source-drain body diode supports synchronous rectification and reverse-current handling, with trr = 18.8 ns and Qrr = 11.4 nC at IF = 2.2A and di/dt = 100 A/µs-critical for high-frequency flyback and buck converter operation.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30 V - Maximum blocking voltage in off-state; suitable for 24V rail and 12V automotive auxiliary systems.
RDS(on)0.11 Ω @ VGS = 10V, ID = 2.2A - Enables <120 mW conduction loss at 1.1A, critical for thermally constrained SOT23-6 layouts.
ID (cont)3.2 A @ TA = 25°C - Continuous current capability limited by package thermal resistance (73 °C/W) and PCB copper area.
Qg9.6 nC - Total gate charge determines driver strength requirement; compatible with low-power gate drivers like TC4420.
VGS(th)1.0 V (min) - Ensures turn-on with 1.8V–3.3V microcontroller GPIO, supporting logic-level control without level-shifting.
tr/tf5.6 ns / 6.4 ns - Fast edge rates reduce switching losses in >500 kHz DC-DC topologies.
VSD0.95 V @ IS = 2.2A - Low body diode forward drop improves efficiency in bidirectional or freewheeling paths.

Pinout & Package

SOT23-6 surface-mount package with exposed drain pad (pin 6) for enhanced thermal dissipation. Dimensions per JEDEC MO-178: D = 2.9 mm, E = 2.8 mm, L = 0.35 mm lead length, 0.65 mm pitch.

Pin/TerminalCircuit RoleDesign Meaning
1 (G)GateControl terminal; requires ≤±20V drive; low Ciss = 380 pF minimizes driver loading.
2 (S)SourceReference node for gate drive; tied to ground or low-side return path in high-side configurations.
3 (D)DrainPower output node; electrically connected to pin 6 (exposed pad) for thermal and current conduction.
4 (S)SourceSecond source connection; paralleled with pin 2 to reduce source inductance in high-di/dt switching.
5 (G)GateRedundant gate connection; used with pin 1 to lower gate loop inductance and suppress ringing.
6 (D)Drain (exposed pad)Primary thermal path to PCB; must be soldered to ≥25 mm² 1 oz copper for rated 1.7 W power dissipation.

Key Features

FeatureDesign Value
Low RDS(on) at 4.5V0.15 Ω - Enables efficient operation from 5V logic rails without gate boosting.
Fast switching with low Qgd2.8 nC - Reduces Miller plateau time, improving hard-switching robustness in synchronous buck stages.
Low threshold voltage1.0 V min - Guarantees turn-on with standard 1.8V/3.3V I/O, eliminating external level shifters.
Optimized body diodetrr = 18.8 ns, Qrr = 11.4 nC - Minimizes reverse recovery loss in discontinuous conduction mode (DCM) converters.
SOT23-6 thermal designRθJA = 73 °C/W - Achievable with minimal PCB copper; supports 1.7 W dissipation in space-constrained designs.

Applications

DC-DC Buck ConvertersLoad Disconnect Switches

Use Scenario: Step-down regulation from 12V to 3.3V/5V in portable instrumentation and IoT sensor nodes.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier with 500 kHz–1 MHz switching frequency and 2.2A peak load current.

Use Value: 0.11 Ω RDS(on) limits conduction loss to <270 mW at full load, enabling >92% efficiency in 3W output designs.

Use Scenario: Controlled power sequencing for FPGA core voltage rails during system boot-up and shutdown.

IC Role / Device Role / Timing Role: High-side load switch enabling soft-start via gate slew-rate control and inrush current limiting.

Use Value: Low VGS(th) ensures reliable turn-on from 3.3V PMIC outputs; body diode blocks reverse current during hot-swap events.

Motor Driver Half-BridgesUSB Power Delivery Switches

Use Scenario: 5V–24V brushed DC motor control in battery-powered robotics and actuator modules.

IC Role / Device Role / Timing Role: Low-side switch in H-bridge topology, commutated at ≤20 kHz with PWM duty cycle modulation.

Use Value: Fast tf = 6.4 ns reduces shoot-through risk; 18A pulsed rating handles motor stall currents without derating.

Use Scenario: Overvoltage/overcurrent protection in USB-C PD 3.0 power switches for host devices and accessories.

IC Role / Device Role / Timing Role: Reverse-polarity and fault-isolation switch placed between Type-C connector and PD controller.

Use Value: 30V VDSS withstands ±20V VGS transients; 0.95V VSD minimizes forward drop in 5V/9V/15V PD profiles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN3026LSD-13RDS(on) = 0.095 Ω @ 10V but higher Qg = 12.5 nC; SOT23-6 with same pinout.Better conduction loss at high current, but slower switching increases driver demand.Prefer for low-frequency, high-current loads where thermal margin > switching loss.
AO3400RDS(on) = 0.028 Ω @ 10V, but VDSS = 30V and Qg = 17 nC; SOT23-3 (3-pin), no dual-source pins.Higher current density but lacks redundant source/gate pins and thermal pad; lower layout flexibility.Prefer only when board space is extreme and thermal constraints allow SOT23-3 mounting.

Compared with DMN3026LSD-13 and AO3400, ZXM62N03E6TA offers balanced RDS(on), Qg, and thermal design in SOT23-6-making it optimal for space-limited, medium-frequency (<1 MHz) power switches requiring both efficiency and layout robustness.

Availability

ZXM62N03E6TA is available at Aetrix Electronics and suitable for DC-DC converters, load disconnect switches, motor control circuits, and USB power delivery systems requiring stable component supply and long-term industrial availability.

Supply support for ZXM62N03E6TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Zetex Semiconductors was a UK-based analog and power semiconductor specialist acquired by Diodes Incorporated in 2008; known for high-performance discrete devices targeting efficiency-critical applications.

ZXM62N03E6TA belongs to Zetex's "ZXM" logic-level MOSFET family, designed specifically for low-voltage, high-efficiency power management in portable and space-constrained electronics.

FAQ

What is the maximum continuous drain current at 70°C ambient?

The ZXM62N03E6TA supports 2.6 A continuous drain current at TA = 70°C, based on its 1.7 W power dissipation rating and 73 °C/W junction-to-ambient thermal resistance. This assumes mounting on FR4 PCB with adequate copper area and still-air conditions per datasheet Note (b).

Can this MOSFET be driven directly from a 3.3V microcontroller GPIO?

Yes. With VGS(th) = 1.0 V (min) and RDS(on) = 0.15 Ω at VGS = 4.5V, the device fully enhances at 3.3V-delivering ~2.0 A continuous current with acceptable on-resistance. Gate capacitance (Ciss = 380 pF) is manageable for typical MCU GPIO slew rates.

Is the SOT23-6 package thermally enhanced compared to standard SOT23-3?

Yes. The SOT23-6 variant includes an exposed drain pad (pin 6) and dual-source/gate terminals, reducing thermal resistance to 73 °C/W (vs. >150 °C/W for SOT23-3). This allows 1.7 W dissipation-more than double typical SOT23-3 limits-when soldered to ≥25 mm² copper.

Does the body diode support reverse recovery in synchronous rectification?

Yes. The integrated body diode has trr = 18.8 ns and Qrr = 11.4 nC at IF = 2.2A, making it suitable for synchronous rectification in buck converters operating up to 1 MHz. Its low VSD = 0.95 V further reduces conduction loss during freewheeling.

ZXM62N03E6TA Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
SOT-23-6
Packaging:
Digi-Reel®
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
3.2A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
-
Rds On (Max) @ Id, Vgs:
110mOhm @ 2.2A, 10V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
9.6 nC @ 10 V
Vgs (Max):
-
Input Capacitance (Ciss) (Max) @ Vds:
380 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SOT-23-6

ZXM62N03E6TA FAQ

1.How can I place an order for ZXM62N03E6TA through Aetrix?

Please submit a Request for Quotation (RFQ) for ZXM62N03E6TA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZXM62N03E6TA reliable?

The price and inventory of ZXM62N03E6TA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXM62N03E6TA is usually 5 days.

3.What payment methods are accepted for ZXM62N03E6TA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXM62N03E6TA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ZXM62N03E6TA?

ZXM62N03E6TA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZXM62N03E6TA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZXM62N03E6TA?

For technical support, including ZXM62N03E6TA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXM62N03E6TA requirements.

6.How does Aetrix verify that ZXM62N03E6TA is sourced from the original manufacturer or authorized distributors?

All ZXM62N03E6TA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXM62N03E6TA meets industry standards.

7.What is the process for return or replacement of ZXM62N03E6TA?

All ZXM62N03E6TA units undergo pre-shipment inspection (PSI). If there is an issue with ZXM62N03E6TA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZXM62N03E6TA part is unused and in its original packaging.

Return procedure for ZXM62N03E6TA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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