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Diodes Incorporated ZXM64N02XTC
- Part No.:
- ZXM64N02XTC
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
ZXM64N02XTC.pdf
- Description:
- MOSFET N-CH 20V 5.4A 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:8,639
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Product details
Overview
ZXM64N02XTC from Diodes Incorporated is a 20V N-channel enhancement-mode MOSFET in MSOP-8 package, featuring 5.4A continuous drain current, 40mΩ RDS(ON) at VGS = 4.5V, and low 1.2V typical threshold voltage-designed for high-efficiency, low-voltage power management in DC-DC converters and load switching circuits.
For engineers reviewing the ZXM64N02XTC datasheet, ZXM64N02XTC pinout, ZXM64N02XTC application, or ZXM64N02XTC equivalent, key selection criteria include its low gate charge (7.5nC), fast turn-on/turn-off times (12ns/22ns), SOIC-compatible MSOP-8 footprint, and suitability for synchronous rectification and battery protection circuits.
Technical Context
This MOSFET employs a high-density trench-gate structure optimized for low conduction loss and rapid switching transitions. Its 20V VBR(DSS) rating and 1.2V VGS(th) enable direct interfacing with 1.8V/3.3V logic controllers without level-shifting circuitry.
The device operates within a -55°C to +150°C junction temperature range and delivers 1.25W power dissipation in the MSOP-8 package. Thermal resistance RθJA is 100°C/W, confirming suitability for compact, thermally constrained PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VBR(DSS) | 20V - supports input rails up to 16V DC-DC stages with 20% margin |
| RDS(ON) @ VGS=4.5V | 40mΩ - limits I²R conduction loss to ≤1.16W at 5.4A full-load current |
| ID (continuous) | 5.4A - enables single-device operation in sub-10A power paths without paralleling |
| VGS(th) | 1.2V (typ) - ensures reliable turn-on with 1.8V GPIO or low-voltage microcontroller outputs |
| Qg | 7.5nC - reduces gate drive power requirement and enables >1MHz switching in buck regulators |
| ton/toff | 12ns / 22ns - minimizes switching transition losses in high-frequency PWM applications |
Pinout & Package
Package: MSOP-8 (3.0mm × 3.0mm × 1.0mm height), thermally enhanced with exposed drain pad (Pin 8).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control terminal requiring ≤7.5nC charge for full enhancement; sensitive to ESD |
| 2 (S) | Source | Reference node for gate drive; tied to power ground in low-side switch configuration |
| 3 (D) | Drain | Main current path output; electrically connected to exposed pad (Pin 8) for thermal conduction |
| 4 (S) | Source | Second source connection-internally bonded to Pin 2 for reduced source inductance |
| 5 (S) | Source | Third source connection-internally bonded to Pins 2 and 4 for parallel routing |
| 6 (D) | Drain | Secondary drain connection-internally bonded to Pin 3 and Pad 8 for current sharing |
| 7 (D) | Drain | Third drain connection-internally bonded to Pins 3 and 6 for distributed current handling |
| 8 (PAD) | Drain / Thermal Slug | Exposed copper pad soldered to PCB ground plane for thermal dissipation and EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) | 40mΩ at 4.5V gate drive enables <1.2W conduction loss at 5.4A, reducing heatsink requirements |
| Fast switching speed | 12ns turn-on and 22ns turn-off minimize dead-time losses in synchronous buck topologies |
| Low gate threshold | 1.2V typical VGS(th) allows direct drive from 1.8V logic without external level shifters |
| MSOP-8 thermal design | Exposed drain pad provides 100°C/W RθJA, supporting 1.25W dissipation in space-constrained layouts |
| Low gate charge | 7.5nC Qg reduces driver IC loading and gate drive power consumption in high-frequency designs |
Applications
| Battery Protection Circuit | Synchronous Buck Converter |
|---|---|
Use Scenario: Reverse-current blocking and overcurrent cutoff in single-cell Li-ion battery packs. IC Role / Device Role / Timing Role: Low-side load switch controlling discharge path between battery and system load. Use Value: 40mΩ RDS(ON) limits voltage drop to <216mV at 5.4A, preserving battery runtime and enabling accurate current sensing. | Use Scenario: High-efficiency 3.3V/5V output stage in portable USB-C PD adapters. IC Role / Device Role / Timing Role: Synchronous rectifier replacing Schottky diode in buck converter secondary side. Use Value: Fast 12ns/22ns switching and low Qg reduce transition losses, improving efficiency by ≥3% vs. diode-based designs at 500kHz. |
| Motor Driver Half-Bridge | USB Power Delivery Switch |
Use Scenario: Low-voltage (≤12V) brushed DC motor control in robotics and IoT actuators. IC Role / Device Role / Timing Role: Low-side switch in H-bridge configuration with complementary high-side FET. Use Value: 1.2V VGS(th) ensures full enhancement using 3.3V MCU GPIO, eliminating need for dedicated gate drivers. | Use Scenario: Input power path management in USB-C devices supporting 20V/5A PD profiles. IC Role / Device Role / Timing Role: Hot-swap controller for safe insertion/removal of upstream power sources. Use Value: MSOP-8 footprint and 20V VBR(DSS) support 20V PD compliance while maintaining compact board area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN2016LFG-7 | RDS(ON) = 22mΩ @ 4.5V, higher 6.5A ID, same MSOP-8 package | Better conduction efficiency but higher gate charge (10.5nC) limits high-frequency use | Preferred when lower conduction loss outweighs switching frequency constraints |
| AO3414 | RDS(ON) = 52mΩ @ 4.5V, SOT-23 package, lower 4.2A ID | Smaller footprint but higher thermal resistance (200°C/W) restricts power handling | Selected only for ultra-low-cost, low-power (<2A) applications where size is critical |
Compared with DMN2016LFG-7 and AO3414, ZXM64N02XTC offers optimal balance of low RDS(ON), fast switching, and thermal performance in MSOP-8-making it ideal for mid-power DC-DC and load-switching designs where both efficiency and layout density matter.
Availability
ZXM64N02XTC is available at Aetrix Electronics and suitable for DC-DC converters, battery protection circuits, and motor control systems requiring stable component supply and long-term industrial availability.
Supply support for ZXM64N02XTC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the Americas.
ZXM64N02XTC belongs to Diodes' ZXM series of low-voltage power MOSFETs-engineered specifically for high-efficiency, space-constrained power management in portable and battery-powered electronics.
FAQ
Is ZXM64N02XTC pin-compatible with standard SOIC-8 MOSFETs?
No. ZXM64N02XTC uses an MSOP-8 package (3.0mm × 3.0mm), not SOIC-8 (4.9mm × 6.0mm). Its pinout matches MSOP-8 industry standard: Pins 1–4 and 5–7 are Gate, Source×3, Drain×3 respectively, with Pin 8 as exposed drain pad. PCB layout must follow Diodes' recommended MSOP-8 pad dimensions.
What is the maximum safe operating voltage for ZXM64N02XTC in continuous DC operation?
The absolute maximum VBR(DSS) is 20V, but continuous DC operation should be limited to ≤16V to maintain 20% voltage margin against transients and ensure long-term reliability per JEDEC JESD78 guidelines. Exceeding 16V risks premature avalanche breakdown under sustained stress.
Can ZXM64N02XTC be used in linear (analog) mode for precision current regulation?
No. This MOSFET is optimized for switching operation-not linear mode. Its Safe Operating Area (SOA) curve shows limited DC capability: at 5V VDS, max continuous current is only 1.2A due to thermal limitations. For linear regulation, a purpose-designed lateral MOSFET or bipolar transistor is required.
Does ZXM64N02XTC require gate resistors for EMI suppression in switching applications?
Yes. A 10Ω–22Ω series gate resistor is recommended to dampen ringing caused by parasitic inductance in gate loops. Without it, the 7.5nC gate charge and fast 12ns ton can excite PCB trace resonances above 100MHz, increasing radiated emissions-especially in USB or wireless-adjacent layouts.
ZXM64N02XTC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 5.4A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.7V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 40mOhm @ 3.8A, 4.5V
- Vgs(th) (Max) @ Id:
- 700mV @ 250µA (Min)
- Gate Charge (Qg) (Max) @ Vgs:
- 16 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1100 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.1W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
ZXM64N02XTC FAQ
1.How can I place an order for ZXM64N02XTC through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXM64N02XTC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXM64N02XTC reliable?
The price and inventory of ZXM64N02XTC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXM64N02XTC is usually 5 days.
3.What payment methods are accepted for ZXM64N02XTC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXM64N02XTC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXM64N02XTC?
ZXM64N02XTC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXM64N02XTC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXM64N02XTC?
For technical support, including ZXM64N02XTC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXM64N02XTC requirements.
6.How does Aetrix verify that ZXM64N02XTC is sourced from the original manufacturer or authorized distributors?
All ZXM64N02XTC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXM64N02XTC meets industry standards.
7.What is the process for return or replacement of ZXM64N02XTC?
All ZXM64N02XTC units undergo pre-shipment inspection (PSI). If there is an issue with ZXM64N02XTC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXM64N02XTC part is unused and in its original packaging.
Return procedure for ZXM64N02XTC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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