Diodes Incorporated ZXM64P02XTA

Overview

ZXM64P02XTA from Diodes Incorporated (formerly Zetex) is a P-channel enhancement-mode MOSFET designed for low-voltage power switching in compact DC-DC converters and load disconnect circuits. It features V(BR)DSS = −20 V, RDS(on) = 0.090 Ω at VGS = −4.5 V and ID = −2.4 A, and operates with a low gate threshold voltage of −0.7 V, enabling efficient 3.3 V or 5 V logic-level drive in battery-powered systems.

For engineers reviewing the ZXM64P02XTA datasheet, ZXM64P02XTA pinout, ZXM64P02XTA application, or ZXM64P02XTA equivalent, key selection criteria include its SOIC-8 (MSOP-8) package thermal performance (RθJA = 70 °C/W on FR4), fast switching (td(on) = 5.6 ns, Qg = 6.9 nC), and body diode recovery (trr = 46 ns, Qrr = 35 nC) for synchronous rectification and bidirectional current handling.

Technical Context

This MOSFET employs a high-density planar structure optimized for low RDS(on) and minimal gate charge, supporting high-frequency operation up to several MHz in buck and boost topologies. Its negative VGS(th) ensures reliable turn-on with standard microcontroller GPIOs and dedicated PMIC gate drivers.

The integrated source-drain diode exhibits low forward voltage (VSD = −0.95 V at IS = −2.4 A) and controlled reverse recovery, making it suitable for freewheeling paths where diode conduction occurs during dead-time intervals in half-bridge configurations.

Key Specifications

Pinout & Package

Package: MSOP-8 (JEDEC MO-187, Issue A), surface-mount, low-profile (max height 1.1 mm), 2.9 mm × 3.1 mm body, 0.65 mm pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET switching applications.

Compared with DMG2305UVT-7 and SI2301DS-T1-GE3, ZXM64P02XTA offers optimal balance of low RDS(on), fast switching, and compact MSOP-8 thermal performance-making it ideal for mid-power DC-DC and load-switch applications where both size and efficiency matter.

Availability

ZXM64P02XTA is available at Aetrix Electronics and suitable for DC-DC converters, USB power delivery switches, and motor control circuits requiring stable component supply across production lifecycles.

Supply support for ZXM64P02XTA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Zetex in 2008 and maintains its high-performance analog and power portfolio, emphasizing reliability, precision, and application-specific optimization for industrial and consumer markets.

ZXM64P02XTA belongs to Zetex's legacy logic-level P-channel MOSFET product line, engineered specifically for low-voltage, high-efficiency power management in space-constrained portable and embedded systems.

FAQ

What is the maximum safe operating voltage for ZXM64P02XTA?

The absolute maximum drain-source voltage is −20 V. Operation beyond this rating risks avalanche breakdown or permanent damage. For reliable long-term use, design with ≤80% of V(BR)DSS (i.e., ≤−16 V) under worst-case transient conditions, especially in automotive or industrial environments with load-dump spikes.

Can ZXM64P02XTA be driven directly by a 3.3 V microcontroller GPIO?

Yes. With VGS(th) = −0.7 V (typical) and guaranteed turn-on at VGS ≤ −2.7 V, a 3.3 V GPIO pulling low (0 V) while sourcing from a −3.3 V rail-or using an inverting buffer-fully enhances the device. No external level shifter is needed for basic on/off control in low-speed applications.

Does ZXM64P02XTA include built-in ESD protection?

No. The datasheet does not specify human-body model (HBM) or charged-device model (CDM) ESD ratings. External TVS diodes or series resistors are recommended on gate and drain lines in systems exposed to handling or connector insertion events, particularly in handheld or field-deployable equipment.

How is thermal performance affected when mounted on a 2-layer versus 4-layer PCB?

RθJA = 70 °C/W assumes a single-sided 1 oz copper FR4 board (25 mm × 25 mm). On a 4-layer board with internal ground/power planes and thermal vias under the exposed drain pad, RθJA improves to ≈45–55 °C/W-enabling ≥2.2 W continuous dissipation at TA = 70°C instead of 1.8 W. Layout guidelines are provided in Zetex Application Note AN-2007-01.