Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Diodes Incorporated ZXM66P03N8TA

Name: ZXM66P03N8TA
Brand: Diodes Incorporated
SKU: ZXM66P03N8TA
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: ZXM66P03N8TA

Manufacturer:: Diodes Incorporated

Category:: FETs, MOSFETs

Package:: 8-SOIC (0.154", 3.90mm Width)

Datasheet:: ZXM66P03N8TA.pdf

Description:: MOSFET P-CH 30V 6.25A 8SO

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:6,198

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

ZXM66P03N8TA from Diodes Incorporated (formerly Zetex Semiconductors) is a P-channel enhancement-mode MOSFET with V_BRDSS = −30 V, R_DS(on) = 0.025 Ω @ V_GS = −10 V, and I_D = −7.9 A, designed for low-voltage power management in DC–DC converters and load switching circuits.

For engineers reviewing the ZXM66P03N8TA datasheet, ZXM66P03N8TA pinout, ZXM66P03N8TA application, or ZXM66P03N8TA equivalent, key selection criteria include gate threshold voltage (−1.0 V), body diode forward voltage (−0.95 V), fast switching times (t_d(off) = 94.6 ns), SOIC-8 thermal resistance (R_θJA = 50 °C/W), and pulsed drain current capability (I_DM = −28 A).

Technical Context

This MOSFET employs a high-density planar structure optimized for low R_DS(on) and fast switching in synchronous buck topologies and high-side load switches. Its −1.0 V V_GS(th) enables direct drive from 3.3 V logic, and its integrated body diode supports bidirectional current flow in H-bridge motor control.

The device exhibits C_iss = 1979 pF and Q_g = 36 nC @ V_GS = −5 V, supporting efficient gate driving at frequencies up to 1 MHz. Thermal performance is rated for 2.5 W continuous dissipation on FR4 PCB with 50 °C/W junction-to-ambient resistance under short-duration pulse conditions.

Key Specifications

Parameter	Value and Actual Design Meaning
V_BRDSS	−30 V - Maximum blocking voltage before avalanche conduction in reverse-biased drain-source path
R_DS(on)	0.025 Ω @ V_GS = −10 V, I_D = −5.6 A - Enables <150 mW conduction loss at 7.9 A continuous load
V_GS(th)	−1.0 V - Allows full enhancement with standard 3.3 V microcontroller GPIO without level-shifting
t_d(off)	94.6 ns - Supports >1 MHz switching in synchronous rectification with minimal dead-time overhead
Q_g	36 nC @ V_GS = −5 V - Determines gate driver current requirement (~3.6 mA average at 100 kHz)
V_SD	−0.95 V @ I_S = −5.6 A - Limits reverse-current conduction loss in freewheeling paths
R_θJA	50 °C/W - Specifies thermal rise per watt on standard FR4 PCB under pulsed operation

Pinout & Package

Package: SOIC-8 (3.9 mm × 4.9 mm, 1.27 mm pitch), surface-mount, lead-free, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3, 4	Source	Common source connection for P-channel operation; tied to high-side rail or ground return in load switch
5, 6, 7, 8	Drain	Power output node; electrically connected internally to exposed drain pad for thermal conduction
Gate	Control input	Accepts negative gate drive relative to source; threshold ensures turn-on with 3.3 V logic swing

Key Features

Feature	Design Value
Low R_DS(on)	0.025 Ω minimizes I²R losses in battery-powered 5 V/3.3 V systems
Fast t_d(off)	94.6 ns reduces switching transition time, lowering overlap losses in synchronous converters
Low V_GS(th)	−1.0 V enables direct interface with 3.3 V microcontrollers without external level shifters
Integrated body diode	V_SD = −0.95 V supports controlled freewheeling in motor drive half-bridges
SOIC-8 thermal design	R_θJA = 50 °C/W allows 2.5 W continuous operation on standard PCB layout

Applications

Battery-Powered Load Switch

Synchronous Buck Converter High-Side Switch

Use Scenario: Power sequencing in portable medical devices requiring controlled 3.3 V rail enable/disable.

IC Role / Device Role: High-side P-channel MOSFET acting as active disconnect switch between Li-ion battery and system load.

Use Value: Low 0.025 Ω R_DS(on) limits dropout to <200 mV at 7 A, preserving battery runtime and enabling precise current monitoring via sense resistor.

Use Scenario: 12 V to 3.3 V step-down conversion in industrial IoT sensor nodes.

IC Role / Device Role: High-side synchronous rectifier in buck regulator topology operating at 500 kHz.

Use Value: 94.6 ns t_d(off) and 36 nC Q_g allow tight dead-time control, reducing shoot-through risk and improving efficiency above 92% at 2 A load.

H-Bridge Motor Driver Low-Side

USB-C Power Delivery Load Switch

Use Scenario: Bidirectional 24 V brushed DC motor control in automated test equipment.

IC Role / Device Role: Low-side switch in H-bridge configuration using body diode for freewheeling current path.

Use Value: −0.95 V V_SD ensures predictable flyback voltage clamping and eliminates need for external Schottky diode.

Use Scenario: Overvoltage-protected 5 V/3 A USB-C port power delivery in docking stations.

IC Role / Device Role: Reverse-polarity and overcurrent protected load switch placed after DC-DC stage.

Use Value: −30 V V_BRDSS withstands transient surges up to ±24 V, and −28 A I_DM supports short-circuit current limiting during fault events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMP3036SSS	R_DS(on) = 0.036 Ω @ V_GS = −10 V; V_GS(th) = −1.2 V; SO-8 package	Higher conduction loss at 7 A; requires stronger gate drive for same speed	Preferred where higher V_GS(th) improves noise immunity in noisy industrial environments
SI2305DS	R_DS(on) = 0.045 Ω @ V_GS = −4.5 V; SOT-23 package; I_D = −4.1 A	Lower current rating and smaller package limit thermal handling in >3 A applications	Selected for space-constrained designs where 4 A max load suffices and board area is critical

Compared with DMP3036SSS and SI2305DS, ZXM66P03N8TA delivers lower R_DS(on) and higher pulsed current capability in SOIC-8, making it optimal for 5–8 A power management where thermal margin and gate drive simplicity are prioritized over ultra-compact footprint.

Availability

ZXM66P03N8TA is available at Aetrix Electronics and suitable for DC–DC converters, battery-powered load switches, and motor control circuits requiring stable component supply and long-term industrial availability.

Supply support for ZXM66P03N8TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Zetex Semiconductors in 2008 and maintains its high-performance analog and power portfolio, emphasizing reliability, automotive qualification, and industrial-grade specifications.

ZXM66P03N8TA belongs to Zetex's legacy high-density P-channel MOSFET product line, engineered specifically for low-voltage, high-efficiency power management in portable and embedded systems.

FAQ

What is the maximum continuous drain current at 70°C ambient?

The ZXM66P03N8TA supports −6.3 A continuous drain current at T_A = 70°C with V_GS = −10 V, based on its 2.5 W power dissipation rating and 50 °C/W thermal resistance under short-duration pulse conditions. Derating follows linear 20 mW/°C reduction above 70°C.

Does this MOSFET require a gate resistor for stability?

A gate resistor of 6.2 Ω was used in the published switching characterization (t_d(on), t_r, etc.), confirming stable turn-on/turn-off behavior without oscillation. For 3.3 V logic drive, a 10–47 Ω series resistor is recommended to damp ringing and limit peak gate current to <100 mA.

Can ZXM66P03N8TA be used in linear regulation mode?

No - the device is not characterized or rated for linear (ohmic) operation. Its Safe Operating Area (SOA) is not specified beyond pulsed conditions, and sustained operation in the linear region risks thermal runaway due to positive temperature coefficient of R_DS(on) and limited SOA boundary data.

Is the SOIC-8 package lead-free and RoHS compliant?

Yes - ZXM66P03N8TA is manufactured with lead-free terminations and complies with EU RoHS Directive 2011/65/EU. The device uses matte tin plating over copper leads and meets JEDEC J-STD-020 moisture sensitivity level MSL3 (260°C reflow peak).

ZXM66P03N8TA Specifications

Product attributes: Attribute value

Manufacturer:: Diodes Incorporated

Series:: -

Package/Case:: 8-SOIC (0.154", 3.90mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: P-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 30 V

Current - Continuous Drain (Id) @ 25°C:: 6.25A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 25mOhm @ 5.6A, 10V

Vgs(th) (Max) @ Id:: 1V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 36 nC @ 5 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 1979 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 1.56W (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-SO

ZXM66P03N8TA FAQ

1.How can I place an order for ZXM66P03N8TA through Aetrix?

Please submit a Request for Quotation (RFQ) for ZXM66P03N8TA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZXM66P03N8TA reliable?

The price and inventory of ZXM66P03N8TA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXM66P03N8TA is usually 5 days.

3.What payment methods are accepted for ZXM66P03N8TA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXM66P03N8TA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ZXM66P03N8TA?

ZXM66P03N8TA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZXM66P03N8TA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZXM66P03N8TA?

For technical support, including ZXM66P03N8TA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXM66P03N8TA requirements.

6.How does Aetrix verify that ZXM66P03N8TA is sourced from the original manufacturer or authorized distributors?

All ZXM66P03N8TA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXM66P03N8TA meets industry standards.

7.What is the process for return or replacement of ZXM66P03N8TA?

All ZXM66P03N8TA units undergo pre-shipment inspection (PSI). If there is an issue with ZXM66P03N8TA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZXM66P03N8TA part is unused and in its original packaging.

Return procedure for ZXM66P03N8TA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…