Diodes Incorporated ZXMC3A16DN8TC
- Part No.:
- ZXMC3A16DN8TC
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
ZXMC3A16DN8TC.pdf
- Description:
- MOSFET N/P-CH 30V 4.9A/4.1A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:20,377
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ZXMC3A16DN8TC from Zetex Semiconductors is a complementary dual-channel enhancement-mode MOSFET pair in SOIC-8 package, integrating an N-channel (30 V, 6.4 A, RDS(on) = 35 mΩ @ VGS = 10 V) and P-channel (−30 V, −5.4 A, RDS(on) = 48 mΩ @ VGS = −10 V) device optimized for synchronous buck converters and H-bridge motor drive stages.
For engineers reviewing the ZXMC3A16DN8TC datasheet, ZXMC3A16DN8TC pinout, ZXMC3A16DN8TC application, or ZXMC3A16DN8TC equivalent, key selection criteria include verified dual-die thermal coupling, gate charge asymmetry (Qg = 17.5 nC / 24.9 nC), body diode recovery (trr = 17.8 ns / 21.2 ns), and SOIC-8 footprint compatibility with standard PCB layout rules for low-inductance gate drive.
Technical Context
This dual MOSFET implements trench-gate silicon technology to simultaneously minimize conduction loss (RDS(on)) and switching loss (low Ciss, Crss, Qg). The N- and P-channel devices share a common source connection internally configured for half-bridge topology support.
Thermal design requires distinction between single-die (RθJA = 100 °C/W) and dual-die operation (RθJA = 60–70 °C/W), with linear derating factors ranging from 10 to 17 mW/°C depending on PCB copper area and active die count.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| N-Channel VDSS | 30 V - supports 24 V rail systems with 25 % margin against transients |
| P-Channel VDSS | −30 V - enables bidirectional blocking in full-bridge configurations |
| N-Channel RDS(on) | 35 mΩ @ VGS = 10 V - yields ≤225 mW conduction loss at 3 A continuous current |
| P-Channel RDS(on) | 48 mΩ @ VGS = −10 V - ensures matched channel resistance for balanced half-bridge duty cycles |
| Gate Charge (N/P) | 17.5 nC / 24.9 nC - determines required gate driver peak current for <100 ns switching transitions |
| Body Diode trr | 17.8 ns / 21.2 ns - limits reverse recovery energy loss during synchronous rectification |
| SOIC-8 Package | Standard 150 mil width, 1.27 mm pitch - compatible with automated SMT assembly and IPC-7351B land patterns |
Pinout & Package
SOIC-8 package with exposed pad not present; JEDEC MS-012AC compliant outline, 5.0 × 4.0 × 1.5 mm body, 1.27 mm lead pitch, gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G1) | N-Channel Gate | Drives N-MOSFET; requires ≥10 V for full enhancement; threshold 1 V |
| 2 (S1) | N-Channel Source | Common source node for both channels; connects to power ground or low-side switch node |
| 3 (D1) | N-Channel Drain | High-side output terminal; ties to input rail in buck topologies |
| 4 (D2) | P-Channel Drain | Low-side output terminal; connects to load or output node in buck/half-bridge |
| 5 (S2) | P-Channel Source | Internally tied to Pin 2 (S1); forms common-source configuration |
| 6 (G2) | P-Channel Gate | Drives P-MOSFET; requires ≤−10 V for full enhancement; threshold −1 V |
| 7, 8 | Drain Connect | Internally connected to Pin 3 (D1) and Pin 4 (D2) respectively - no external connection needed |
Key Features
| Feature | Design Value |
|---|---|
| Complementary trench MOSFET pair | Single SOIC-8 package integrates matched N/P devices with coordinated RDS(on) and Qg for reduced board space and layout complexity |
| Low gate threshold voltage | VGS(th) = 1 V (N) / −1 V (P) enables direct logic-level drive from 3.3 V microcontrollers without level-shifting |
| Fast switching with low Crss | Crss = 84 pF (N) / 116 pF (P) minimizes Miller-induced shoot-through risk in high-frequency PWM |
| Optimized body diode | trr = 17.8 ns (N) / 21.2 ns (P) reduces switching loss during dead-time conduction in synchronous rectifiers |
| Thermally rated dual-die layout | RθJA = 60 °C/W (dual-active) allows 1.8 W dissipation at 70 °C ambient with minimal heatsinking |
Applications
| Motor Drive | LCD Backlighting |
|---|---|
Use Scenario: Bidirectional DC motor control in portable power tools and robotics using H-bridge topology. IC Role / Device Role / Timing Role: Dual-channel half-bridge switch providing complementary gate drive to N- and P-channel paths with shared source node. Use Value: Enables compact, low-loss motor drive with <100 ns dead-time control and <250 mW per channel conduction loss at 3 A. | Use Scenario: Boost converter driving parallel LED strings in automotive instrument clusters. IC Role / Device Role / Timing Role: Synchronous rectifier in boost output stage, where P-channel handles high-side switching and N-channel serves as low-side switch. Use Value: Reduces forward voltage drop by 40 % vs. Schottky diodes, improving efficiency from 82 % to 89 % at 12 V input. |
| DC-DC Synchronous Buck | USB-C Power Delivery Sink |
Use Scenario: 5 V → 3.3 V point-of-load regulator for FPGA I/O banks requiring <10 mV ripple. IC Role / Device Role / Timing Role: Integrated high-side (N) and low-side (P) switch enabling 500 kHz fixed-frequency operation with adaptive dead-time control. Use Value: Achieves 94 % peak efficiency at 2 A load with <5 mV output ripple due to low RDS(on) and fast tr/tf. | Use Scenario: Input protection and VBUS switching in USB-C PD sink designs supporting 20 V / 3 A profiles. IC Role / Device Role / Timing Role: Reverse-polarity and overvoltage protection switch, where P-channel blocks reverse current and N-channel controls VBUS enable timing. Use Value: Supports <5 µs fault response time and withstands ±30 V transients without latch-up or degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar complementary MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si7851DP-T1-GE3 | N/P RDS(on) = 28 mΩ / 42 mΩ; higher Qg (22 nC / 32 nC); SO-8 package | Better conduction loss but slower switching; requires stronger gate driver | Select when thermal budget is tighter than switching frequency constraint |
| DMC2038LSD-13 | N/P RDS(on) = 40 mΩ / 55 mΩ; lower VDSS (±20 V); same SO-8 footprint | Lower voltage rating limits use to 12 V systems only | Select only for cost-sensitive 12 V applications where 30 V margin is unnecessary |
Compared with Si7851DP-T1-GE3 and DMC2038LSD-13, ZXMC3A16DN8TC delivers optimal balance of 30 V robustness, 35/48 mΩ RDS(on), and 17.5/24.9 nC gate charge-making it preferred for 24 V industrial buck converters requiring <1 MHz operation and <100 °C junction temperature.
Availability
ZXMC3A16DN8TC is available at Aetrix Electronics and suitable for motor drive, LCD backlighting, and DC-DC synchronous buck applications requiring stable component supply, consistent parametric performance across production lots, and long-term availability beyond typical consumer-grade MOSFET lifecycles.
Supply support for ZXMC3A16DN8TC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Zetex Semiconductors plc was a UK-based fabless semiconductor company specializing in high-performance analog and power discrete components before its acquisition by Diodes Incorporated in 2008.
ZXMC series complementary MOSFETs were engineered for space-constrained, high-efficiency power conversion in portable and industrial equipment-emphasizing trench process optimization for simultaneous low RDS(on) and fast switching.
FAQ
What is the maximum continuous drain current for each channel at 70°C ambient?
The N-channel supports 5.1 A and the P-channel supports −4.3 A at TA = 70°C with VGS = ±10 V, measured under SOIC-8 mounting conditions on FR4 with single-sided 1 oz copper. These values reflect thermal derating from the 25°C ratings of 6.4 A and −5.4 A, and assume one active die unless otherwise specified in layout.
Can ZXMC3A16DN8TC be used in a synchronous boost converter?
Yes - the complementary N/P structure supports synchronous boost topologies where the P-channel operates as the high-side switch and the N-channel serves as the low-side synchronous rectifier. Its 30 V rating, low RDS(on), and fast trr make it suitable for 12 V input → 19 V output designs up to 500 kHz, provided gate drive sequencing avoids shoot-through.
Is the SOIC-8 package thermally enhanced with an exposed pad?
No - ZXMC3A16DN8TC uses a standard SOIC-8 package without an exposed thermal pad. Thermal performance relies entirely on PCB copper area and trace routing; the datasheet specifies RθJA = 60–100 °C/W depending on whether one or both dies are active and the copper coverage beneath the package.
What is the recommended gate resistor value for 1 MHz switching?
A 6.0 Ω gate resistor is validated in the datasheet for 15 V drive at 3.5 A load, yielding tr = 6.4 ns and tf = 9.4 ns. For 1 MHz operation, this value balances switching speed against ringing and EMI; reducing below 4.7 Ω increases dV/dt stress and may require ferrite beads or RC snubbers on gate traces.
ZXMC3A16DN8TC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N and P-Channel
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 4.9A, 4.1A
- Rds On (Max) @ Id, Vgs:
- 35mOhm @ 9A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA (Min)
- Gate Charge (Qg) (Max) @ Vgs:
- 17.5nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 796pF @ 25V
- Power - Max:
- 1.25W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
ZXMC3A16DN8TC FAQ
1.How can I place an order for ZXMC3A16DN8TC through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXMC3A16DN8TC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXMC3A16DN8TC reliable?
The price and inventory of ZXMC3A16DN8TC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMC3A16DN8TC is usually 5 days.
3.What payment methods are accepted for ZXMC3A16DN8TC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMC3A16DN8TC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXMC3A16DN8TC?
ZXMC3A16DN8TC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXMC3A16DN8TC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXMC3A16DN8TC?
For technical support, including ZXMC3A16DN8TC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMC3A16DN8TC requirements.
6.How does Aetrix verify that ZXMC3A16DN8TC is sourced from the original manufacturer or authorized distributors?
All ZXMC3A16DN8TC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMC3A16DN8TC meets industry standards.
7.What is the process for return or replacement of ZXMC3A16DN8TC?
All ZXMC3A16DN8TC units undergo pre-shipment inspection (PSI). If there is an issue with ZXMC3A16DN8TC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXMC3A16DN8TC part is unused and in its original packaging.
Return procedure for ZXMC3A16DN8TC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ZXMC3A16DN8TC Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

