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Diodes Incorporated ZXMC3A16DN8TC

Part No.:
ZXMC3A16DN8TC
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixZXMC3A16DN8TC.pdf
Description:
MOSFET N/P-CH 30V 4.9A/4.1A 8SO
Quantity:
Payment:
Payment
Shipping:
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Inventory:20,377

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Product details

Overview

ZXMC3A16DN8TC from Zetex Semiconductors is a complementary dual-channel enhancement-mode MOSFET pair in SOIC-8 package, integrating an N-channel (30 V, 6.4 A, RDS(on) = 35 mΩ @ VGS = 10 V) and P-channel (−30 V, −5.4 A, RDS(on) = 48 mΩ @ VGS = −10 V) device optimized for synchronous buck converters and H-bridge motor drive stages.

For engineers reviewing the ZXMC3A16DN8TC datasheet, ZXMC3A16DN8TC pinout, ZXMC3A16DN8TC application, or ZXMC3A16DN8TC equivalent, key selection criteria include verified dual-die thermal coupling, gate charge asymmetry (Qg = 17.5 nC / 24.9 nC), body diode recovery (trr = 17.8 ns / 21.2 ns), and SOIC-8 footprint compatibility with standard PCB layout rules for low-inductance gate drive.

Technical Context

This dual MOSFET implements trench-gate silicon technology to simultaneously minimize conduction loss (RDS(on)) and switching loss (low Ciss, Crss, Qg). The N- and P-channel devices share a common source connection internally configured for half-bridge topology support.

Thermal design requires distinction between single-die (RθJA = 100 °C/W) and dual-die operation (RθJA = 60–70 °C/W), with linear derating factors ranging from 10 to 17 mW/°C depending on PCB copper area and active die count.

Key Specifications

ParameterValue and Actual Design Meaning
N-Channel VDSS30 V - supports 24 V rail systems with 25 % margin against transients
P-Channel VDSS−30 V - enables bidirectional blocking in full-bridge configurations
N-Channel RDS(on)35 mΩ @ VGS = 10 V - yields ≤225 mW conduction loss at 3 A continuous current
P-Channel RDS(on)48 mΩ @ VGS = −10 V - ensures matched channel resistance for balanced half-bridge duty cycles
Gate Charge (N/P)17.5 nC / 24.9 nC - determines required gate driver peak current for <100 ns switching transitions
Body Diode trr17.8 ns / 21.2 ns - limits reverse recovery energy loss during synchronous rectification
SOIC-8 PackageStandard 150 mil width, 1.27 mm pitch - compatible with automated SMT assembly and IPC-7351B land patterns

Pinout & Package

SOIC-8 package with exposed pad not present; JEDEC MS-012AC compliant outline, 5.0 × 4.0 × 1.5 mm body, 1.27 mm lead pitch, gull-wing leads.

Pin/TerminalCircuit RoleDesign Meaning
1 (G1)N-Channel GateDrives N-MOSFET; requires ≥10 V for full enhancement; threshold 1 V
2 (S1)N-Channel SourceCommon source node for both channels; connects to power ground or low-side switch node
3 (D1)N-Channel DrainHigh-side output terminal; ties to input rail in buck topologies
4 (D2)P-Channel DrainLow-side output terminal; connects to load or output node in buck/half-bridge
5 (S2)P-Channel SourceInternally tied to Pin 2 (S1); forms common-source configuration
6 (G2)P-Channel GateDrives P-MOSFET; requires ≤−10 V for full enhancement; threshold −1 V
7, 8Drain ConnectInternally connected to Pin 3 (D1) and Pin 4 (D2) respectively - no external connection needed

Key Features

FeatureDesign Value
Complementary trench MOSFET pairSingle SOIC-8 package integrates matched N/P devices with coordinated RDS(on) and Qg for reduced board space and layout complexity
Low gate threshold voltageVGS(th) = 1 V (N) / −1 V (P) enables direct logic-level drive from 3.3 V microcontrollers without level-shifting
Fast switching with low CrssCrss = 84 pF (N) / 116 pF (P) minimizes Miller-induced shoot-through risk in high-frequency PWM
Optimized body diodetrr = 17.8 ns (N) / 21.2 ns (P) reduces switching loss during dead-time conduction in synchronous rectifiers
Thermally rated dual-die layoutRθJA = 60 °C/W (dual-active) allows 1.8 W dissipation at 70 °C ambient with minimal heatsinking

Applications

Motor DriveLCD Backlighting

Use Scenario: Bidirectional DC motor control in portable power tools and robotics using H-bridge topology.

IC Role / Device Role / Timing Role: Dual-channel half-bridge switch providing complementary gate drive to N- and P-channel paths with shared source node.

Use Value: Enables compact, low-loss motor drive with <100 ns dead-time control and <250 mW per channel conduction loss at 3 A.

Use Scenario: Boost converter driving parallel LED strings in automotive instrument clusters.

IC Role / Device Role / Timing Role: Synchronous rectifier in boost output stage, where P-channel handles high-side switching and N-channel serves as low-side switch.

Use Value: Reduces forward voltage drop by 40 % vs. Schottky diodes, improving efficiency from 82 % to 89 % at 12 V input.

DC-DC Synchronous BuckUSB-C Power Delivery Sink

Use Scenario: 5 V → 3.3 V point-of-load regulator for FPGA I/O banks requiring <10 mV ripple.

IC Role / Device Role / Timing Role: Integrated high-side (N) and low-side (P) switch enabling 500 kHz fixed-frequency operation with adaptive dead-time control.

Use Value: Achieves 94 % peak efficiency at 2 A load with <5 mV output ripple due to low RDS(on) and fast tr/tf.

Use Scenario: Input protection and VBUS switching in USB-C PD sink designs supporting 20 V / 3 A profiles.

IC Role / Device Role / Timing Role: Reverse-polarity and overvoltage protection switch, where P-channel blocks reverse current and N-channel controls VBUS enable timing.

Use Value: Supports <5 µs fault response time and withstands ±30 V transients without latch-up or degradation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Si7851DP-T1-GE3N/P RDS(on) = 28 mΩ / 42 mΩ; higher Qg (22 nC / 32 nC); SO-8 packageBetter conduction loss but slower switching; requires stronger gate driverSelect when thermal budget is tighter than switching frequency constraint
DMC2038LSD-13N/P RDS(on) = 40 mΩ / 55 mΩ; lower VDSS (±20 V); same SO-8 footprintLower voltage rating limits use to 12 V systems onlySelect only for cost-sensitive 12 V applications where 30 V margin is unnecessary

Compared with Si7851DP-T1-GE3 and DMC2038LSD-13, ZXMC3A16DN8TC delivers optimal balance of 30 V robustness, 35/48 mΩ RDS(on), and 17.5/24.9 nC gate charge-making it preferred for 24 V industrial buck converters requiring <1 MHz operation and <100 °C junction temperature.

Availability

ZXMC3A16DN8TC is available at Aetrix Electronics and suitable for motor drive, LCD backlighting, and DC-DC synchronous buck applications requiring stable component supply, consistent parametric performance across production lots, and long-term availability beyond typical consumer-grade MOSFET lifecycles.

Supply support for ZXMC3A16DN8TC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Zetex Semiconductors plc was a UK-based fabless semiconductor company specializing in high-performance analog and power discrete components before its acquisition by Diodes Incorporated in 2008.

ZXMC series complementary MOSFETs were engineered for space-constrained, high-efficiency power conversion in portable and industrial equipment-emphasizing trench process optimization for simultaneous low RDS(on) and fast switching.

FAQ

What is the maximum continuous drain current for each channel at 70°C ambient?

The N-channel supports 5.1 A and the P-channel supports −4.3 A at TA = 70°C with VGS = ±10 V, measured under SOIC-8 mounting conditions on FR4 with single-sided 1 oz copper. These values reflect thermal derating from the 25°C ratings of 6.4 A and −5.4 A, and assume one active die unless otherwise specified in layout.

Can ZXMC3A16DN8TC be used in a synchronous boost converter?

Yes - the complementary N/P structure supports synchronous boost topologies where the P-channel operates as the high-side switch and the N-channel serves as the low-side synchronous rectifier. Its 30 V rating, low RDS(on), and fast trr make it suitable for 12 V input → 19 V output designs up to 500 kHz, provided gate drive sequencing avoids shoot-through.

Is the SOIC-8 package thermally enhanced with an exposed pad?

No - ZXMC3A16DN8TC uses a standard SOIC-8 package without an exposed thermal pad. Thermal performance relies entirely on PCB copper area and trace routing; the datasheet specifies RθJA = 60–100 °C/W depending on whether one or both dies are active and the copper coverage beneath the package.

What is the recommended gate resistor value for 1 MHz switching?

A 6.0 Ω gate resistor is validated in the datasheet for 15 V drive at 3.5 A load, yielding tr = 6.4 ns and tf = 9.4 ns. For 1 MHz operation, this value balances switching speed against ringing and EMI; reducing below 4.7 Ω increases dV/dt stress and may require ferrite beads or RC snubbers on gate traces.

ZXMC3A16DN8TC Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
N and P-Channel
FET Feature:
Logic Level Gate
Drain to Source Voltage (Vdss):
30V
Current - Continuous Drain (Id) @ 25°C:
4.9A, 4.1A
Rds On (Max) @ Id, Vgs:
35mOhm @ 9A, 10V
Vgs(th) (Max) @ Id:
1V @ 250µA (Min)
Gate Charge (Qg) (Max) @ Vgs:
17.5nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds:
796pF @ 25V
Power - Max:
1.25W
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

ZXMC3A16DN8TC FAQ

1.How can I place an order for ZXMC3A16DN8TC through Aetrix?

Please submit a Request for Quotation (RFQ) for ZXMC3A16DN8TC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of ZXMC3A16DN8TC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMC3A16DN8TC is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZXMC3A16DN8TC?

For technical support, including ZXMC3A16DN8TC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMC3A16DN8TC requirements.

6.How does Aetrix verify that ZXMC3A16DN8TC is sourced from the original manufacturer or authorized distributors?

All ZXMC3A16DN8TC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMC3A16DN8TC meets industry standards.

7.What is the process for return or replacement of ZXMC3A16DN8TC?

All ZXMC3A16DN8TC units undergo pre-shipment inspection (PSI). If there is an issue with ZXMC3A16DN8TC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZXMC3A16DN8TC part is unused and in its original packaging.

Return procedure for ZXMC3A16DN8TC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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