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Diodes Incorporated ZXMC3A17DN8TC
- Part No.:
- ZXMC3A17DN8TC
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
ZXMC3A17DN8TC.pdf
- Description:
- MOSFET N/P-CH 30V 4.1A/3.4A 8SO
- Quantity:
- Payment:
- Shipping:
Inventory:6,004
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Product details
Overview
ZXMC3A17DN8TC from Zetex Semiconductors is a dual-channel complementary enhancement-mode MOSFET in SOIC-8 package, integrating an N-channel (30 V, 5.4 A, RDS(on) = 50 mΩ @ VGS = 10 V) and P-channel (–30 V, –4.4 A, RDS(on) = 70 mΩ @ VGS = –10 V) device for half-bridge or level-shifting power stages in DC-DC converters and motor drivers.
For engineers reviewing the ZXMC3A17DN8TC datasheet, ZXMC3A17DN8TC pinout, ZXMC3A17DN8TC application, or ZXMC3A17DN8TC equivalent, key selection criteria include verified dual-die thermal coupling, gate charge asymmetry (Qg = 12.2 nC N-ch / 15.8 nC P-ch), body diode recovery (trr = 18.8 ns / 19.5 ns), and SO8 footprint compatibility with industry-standard layout rules.
Technical Context
This dual MOSFET implements trench-gate silicon technology to simultaneously minimize conduction loss and switching transition time. Its complementary pairing enables synchronous rectification and bidirectional current control without external level shifters.
The device operates across –55°C to +150°C junction temperature, supports ±20 V gate drive, and features low-threshold VGS(th) (1.0 V / –1.0 V) for 3.3 V logic-compatible gate control. Thermal resistance varies by mounting condition: RJA = 60°C/W (dual-die FR4, t = 10 s) and 70°C/W (dual-die, high-copper PCB).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| N-ch VDS | 30 V - supports 24 V rail systems with 25% safety margin |
| P-ch VDS | –30 V - enables symmetric negative-rail switching in H-bridge topologies |
| N-ch RDS(on) | 50 mΩ @ 10 V - delivers ≤1.4 W conduction loss at 5.4 A continuous |
| P-ch RDS(on) | 70 mΩ @ –10 V - ensures matched on-resistance ratio (1.4×) for balanced half-bridge duty cycles |
| Qg (N/P) | 12.2 nC / 15.8 nC - defines gate driver current requirement for <30 ns total switching transitions |
| trr (N/P) | 18.8 ns / 19.5 ns - limits reverse recovery energy loss during hard-switched commutation |
| TJ range | –55°C to +150°C - qualified for under-hood automotive and industrial ambient environments |
Pinout & Package
SOIC-8 package per JEDEC MS-012AA, 1.27 mm pitch, 4.9 mm × 3.9 mm body, 1.75 mm max height. Dual-die construction with electrically isolated N- and P-channel dies sharing common source terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | N-ch Gate | Controls N-channel MOSFET; requires 10 V for full enhancement |
| 2 | N-ch Source | Common source node for both channels; connects to power ground reference |
| 3 | P-ch Drain | High-side output terminal; ties to positive supply rail in high-side switch configuration |
| 4 | P-ch Gate | Controls P-channel MOSFET; driven low relative to source for turn-on |
| 5 | P-ch Source | Shared source with Pin 2; forms common node for complementary pair |
| 6 | N-ch Drain | Low-side output terminal; connects to load return path in buck or motor phase leg |
| 7 | N-ch Drain | Redundant drain connection for parallel current handling (same die as Pin 6) |
| 8 | P-ch Drain | Redundant drain connection for parallel current handling (same die as Pin 3) |
Key Features
| Feature | Design Value |
|---|---|
| Complementary dual-die integration | Eliminates inter-device timing skew and layout mismatch in half-bridge gate drive paths |
| Low RDS(on) asymmetry (1.4×) | Enables matched conduction loss scaling between high- and low-side legs without external balancing |
| Fast body diode recovery (trr < 20 ns) | Reduces shoot-through risk and EMI during dead-time transitions in synchronous rectifiers |
| SOIC-8 thermal performance | RJA = 60°C/W (dual-die, short-duration pulse) supports 2.1 W continuous dissipation on standard FR4 |
Applications
| Brushless DC Motor Control | USB-C Power Delivery Switching |
|---|---|
Use Scenario: Three-phase inverter stage driving 12–24 V BLDC motors in drones and power tools. IC Role / Device Role / Timing Role: Half-bridge power stage with N-ch low-side and P-ch high-side switches per phase leg. Use Value: Low Qg and fast tr/tf enable >200 kHz PWM operation while maintaining <5% switching loss at 5 A load current. | Use Scenario: Bidirectional 20 V/3 A power path switching in USB-C PD sink/source negotiation circuits. IC Role / Device Role / Timing Role: Reverse-polarity protection and load switch with integrated back-to-back MOSFETs. Use Value: Matched VGS(th) (±1.0 V) ensures reliable turn-on with 3.3 V microcontroller GPIO without external level shifting. |
| LED Backlight Dimming | Industrial PLC Output Stage |
Use Scenario: High-frequency PWM dimming of 24 V LED strings in medical displays and signage. IC Role / Device Role / Timing Role: Synchronous buck controller output stage with low-side N-ch and high-side P-ch switching. Use Value: 50 mΩ/70 mΩ RDS(on) minimizes I²R loss at 4 A peak current, sustaining >92% efficiency at 100 kHz. | Use Scenario: Solid-state relay replacement in 24 V DC digital output modules for factory automation. IC Role / Device Role / Timing Role: Load switch with integrated freewheeling diode and overtemperature shutdown via thermal coupling. Use Value: Shared source node and SOIC-8 footprint allow direct drop-in replacement of discrete MOSFET+driver solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar complementary dual-MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMC2038LSD-13 | RDS(on) = 42 mΩ/60 mΩ; higher Qg (15.5 nC/18.2 nC); SO-8 package | Optimized for lower conduction loss but slower switching (td(off) = 22 ns vs 16 ns N-ch) | Select when thermal budget dominates over switching frequency requirements |
| SI6926DQ-T1-GE3 | RDS(on) = 55 mΩ/80 mΩ; lower VGS(th) (0.7 V/–0.7 V); same SO-8 footprint | Better 1.8 V logic compatibility but higher on-resistance increases conduction loss by ~18% | Select for ultra-low-voltage MCU interfaces where gate drive voltage is limited to 3.3 V or less |
Compared with DMC2038LSD-13 and SI6926DQ-T1-GE3, ZXMC3A17DN8TC offers the best balance of switching speed (16 ns td(off) N-ch), thermal coupling (shared RJA derating), and gate threshold symmetry for 3.3 V–5 V logic-driven half-bridge designs.
Availability
ZXMC3A17DN8TC is available at Aetrix Electronics and suitable for motor drive, LCD backlighting, and USB-C power path applications requiring stable component supply and long-term industrial lifecycle support.
Supply support for ZXMC3A17DN8TC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Zetex Semiconductors plc was a UK-based designer of high-performance analog and power semiconductors, acquired by Diodes Incorporated in 2008; legacy Zetex products maintain industrial-grade qualification and long-term availability.
ZXMC3A17DN8TC belongs to Zetex's trench-MOSFET power management portfolio, engineered specifically for space-constrained, high-efficiency DC-DC conversion and motor control where dual-channel integration reduces PCB area and parasitic inductance.
FAQ
What is the maximum continuous drain current for each channel at 70°C ambient?
The N-channel supports 4.3 A and the P-channel supports –3.6 A at TA = 70°C with VGS = 10 V (N-ch) or –10 V (P-ch), measured on a 25 mm × 25 mm FR4 PCB with single-sided 1 oz copper. Derating follows 10 mW/°C (N-ch) and 14 mW/°C (P-ch) linear factors above 25°C.
Can ZXMC3A17DN8TC be used in a synchronous buck converter without external bootstrap circuitry?
Yes - the integrated P-channel high-side switch eliminates the need for bootstrap capacitors or floating gate drivers. It operates with referenced gate drive, enabling simple 3.3 V or 5 V logic control of both channels without level-shifting circuitry or timing-critical dead-time management.
Is the SOIC-8 package lead-free and RoHS-compliant?
Yes - ZXMC3A17DN8TC conforms to RoHS Directive 2011/65/EU and uses lead-free matte tin plating on leads. The device meets JEDEC J-STD-020D moisture sensitivity level 1 (MSL-1), allowing unlimited floor life at ≤30°C/60% RH without dry-pack requirements.
How is thermal coupling managed between the N-channel and P-channel dies?
The two dies share a common leadframe substrate within the SOIC-8 package, resulting in direct thermal coupling. This enables joint thermal derating (RJA = 70°C/W for dual-die operation) and synchronized thermal shutdown behavior, critical for reliability in high-power density applications like motor drivers.
ZXMC3A17DN8TC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N and P-Channel
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 4.1A, 3.4A
- Rds On (Max) @ Id, Vgs:
- 50mOhm @ 7.8A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA (Min)
- Gate Charge (Qg) (Max) @ Vgs:
- 12.2nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 600pF @ 25V
- Power - Max:
- 1.25W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
ZXMC3A17DN8TC FAQ
1.How can I place an order for ZXMC3A17DN8TC through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXMC3A17DN8TC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXMC3A17DN8TC reliable?
The price and inventory of ZXMC3A17DN8TC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMC3A17DN8TC is usually 5 days.
3.What payment methods are accepted for ZXMC3A17DN8TC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMC3A17DN8TC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXMC3A17DN8TC?
ZXMC3A17DN8TC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXMC3A17DN8TC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXMC3A17DN8TC?
For technical support, including ZXMC3A17DN8TC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMC3A17DN8TC requirements.
6.How does Aetrix verify that ZXMC3A17DN8TC is sourced from the original manufacturer or authorized distributors?
All ZXMC3A17DN8TC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMC3A17DN8TC meets industry standards.
7.What is the process for return or replacement of ZXMC3A17DN8TC?
All ZXMC3A17DN8TC units undergo pre-shipment inspection (PSI). If there is an issue with ZXMC3A17DN8TC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXMC3A17DN8TC part is unused and in its original packaging.
Return procedure for ZXMC3A17DN8TC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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