Diodes Incorporated ZXMC3AM832TA

Overview

ZXMC3AM832TA from Diodes Incorporated (formerly Zetex Semiconductors) is a complementary dual-channel 30V enhancement-mode MOSFET in a 3mm × 2mm MLP package, integrating one N-channel (R_DS(on) = 0.12 Ω @ V_GS = 10 V, I_D = 3.7 A) and one P-channel (R_DS(on) = 0.21 Ω @ V_GS = −10 V, I_D = −2.7 A) die. It delivers fast switching (t_d(off) = 6.6 ns N-ch / 11.3 ns P-ch), low gate charge (Q_g = 3.9 nC / 5.15 nC), and operates in motor control and LCD backlight inverter circuits.

For engineers reviewing the ZXMC3AM832TA datasheet, ZXMC3AM832TA pinout, ZXMC3AM832TA application, or ZXMC3AM832TA equivalent, key selection criteria include dual-channel complementary conduction, thermal resistance under defined PCB copper area (R_θJA = 51 °C/W with 8 cm² 2 oz Cu), and validated body diode recovery (Q_rr = 13.0 nC / 14.8 nC).

Technical Context

This device implements two independent enhancement-mode MOSFETs on a single substrate-N-channel with V_GS(th) = 1 V and P-channel with V_GS(th) = −0.8 V-enabling synchronous half-bridge or H-bridge configurations without external level-shifting. Gate drive compatibility spans 2.5–10 V for N-ch and −2.5 to −10 V for P-ch.

Thermal design relies on exposed pad attachment: R_θJA varies from 41.7 °C/W (85 cm² 2 oz Cu) to 125 °C/W (minimal copper), and power dissipation ranges from 1.0 W to 2.45 W depending on layout. Dual-die operation is thermally de-rated per note (g), requiring separate copper islands per channel.

Key Specifications

Pinout & Package

Supplied in a 3 mm × 2 mm Micro Leaded Package (MLP832) with exposed thermal pad on underside. The 8-pin outline features dual-source/drain/gate terminals arranged for independent channel routing and thermal isolation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary dual-MOSFET applications.

Compared with ZXMC3AMCTA, this part offers lower performance and higher thermal resistance; compared with DMC3025LSD, it provides integrated complementarity but less conductance per channel-making ZXMC3AM832TA appropriate only for legacy redesigns where footprint and pinout compatibility are mandatory.

Availability

ZXMC3AM832TA is available at Aetrix Electronics and suitable for motor control, LCD backlight inverters, gate driver interfaces, and power management load switching requiring stable component supply across industrial and embedded production cycles.

Supply support for ZXMC3AM832TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Zetex Semiconductors in 2008 and maintains its portfolio of high-performance discrete semiconductors, emphasizing precision analog, power management, and signal integrity solutions for industrial and automotive markets.

This device belongs to Zetex's MPPS™ (Miniature Package Power Solutions) product line, engineered specifically for space-constrained, high-efficiency DC-DC conversion and low-voltage motor drive applications where thermal density and layout simplicity are critical.

FAQ

What is the maximum continuous drain current for each channel at 70°C ambient?

At T_A = 70°C, derating from 2.45 W (T_A = 25°C, 2 oz Cu) applies: ΔT = 45°C × 19.6 mW/°C = 0.882 W loss budget. For the N-channel, I_D = √(P_D/R_DS(on)) = √(0.882/0.12) ≈ 2.71 A. For the P-channel, I_D = √(0.882/0.21) ≈ 2.05 A. These values assume both channels operate simultaneously with shared thermal path.

Can ZXMC3AM832TA be used in a synchronous buck converter topography?

No-this device lacks the internal bootstrap diode or integrated high-side gate driver required for standard synchronous buck operation. Its complementary N+P structure suits half-bridge or H-bridge configurations where both switches control the same node, not buck regulators where the high-side switch requires floating gate drive relative to its source.

Is the exposed thermal pad electrically isolated or tied to a specific terminal?

The exposed pad is internally connected to the source terminals (S1 and S2) and must be soldered to a common ground plane. It is not electrically isolated; connecting it to system ground improves thermal performance and provides low-inductance return paths for both channels' source currents.

Why does the datasheet list multiple R_θJA values, and which one should be used for layout design?

Multiple R_θJA values reflect test conditions: 51 °C/W assumes 8 cm² 2 oz Cu split into two 4 cm² islands (one per die), matching real-world dual-channel thermal isolation. Use this value for initial layout sizing; verify with IR imaging or simulation using the exact copper area and thickness specified in note (b) for transient reliability.