Diodes Incorporated ZXMC3AMCTA
- Part No.:
- ZXMC3AMCTA
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
ZXMC3AMCTA.pdf
- Description:
- MOSFET N/P-CH 30V 2.9A/2.1A 8DFN
- Quantity:
- Payment:

- Shipping:

Inventory:24,700
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Product details
Overview
ZXMC3AMCTA from Diodes Incorporated is a 30V complementary pair enhancement-mode MOSFET in a DFN3020B-8 package, integrating an N-channel (Q1: 3.7A, 120mΩ @ 10V) and P-channel (Q2: –2.7A, 210mΩ @ –10V) device on a single die. It delivers low RDS(on), fast switching (tD(off) = 6.6ns Q1 / 11.3ns Q2), and thermally efficient operation (RθJA = 51.0°C/W with 8 cm² 2oz Cu), targeting compact DC-DC converter half-bridges and motor drive H-bridge legs.
For engineers reviewing the ZXMC3AMCTA datasheet, ZXMC3AMCTA pinout, ZXMC3AMCTA application, or ZXMC3AMCTA equivalent, key selection criteria include dual-channel complementary conduction capability, 0.8mm profile for space-constrained portable power stages, AEC-Q101 qualification for automotive-grade reliability, and verified gate charge values (Qg = 3.9nC Q1 / 6.4nC Q2) enabling precise PWM timing control.
Technical Context
This dual MOSFET implements independent N- and P-channel enhancement-mode transistors sharing a common DFN3020B-8 thermal pad and leadframe. The N-channel (Q1) features VGS(th) = 1.0–3.0V and gfs = 3.5S at 10V, while the P-channel (Q2) has VGS(th) = –1.0 to –3.0V and gfs = 2.48S at –10V - enabling matched gate drive design for synchronous buck or H-bridge topologies.
Thermal performance is defined across three PCB configurations: RθJA = 83.3°C/W (28mm × 28mm, 2oz Cu, one active die), 51.0°C/W (same board, short-duration pulse), and 73.5°C/W (31mm × 31mm, 1oz Cu, two active die). Safe operating area (SOA) curves confirm pulsed current capability up to IDM = 13A (Q1) and –9.2A (Q2) under 300µs pulses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30V (Q1) / –30V (Q2): Supports 24V rail switching with 20% margin against transients |
| RDS(on) | 120mΩ @ 10V (Q1), 210mΩ @ –10V (Q2): Enables <1.5W conduction loss at 3A continuous load |
| ID cont | 3.7A (Q1), –2.7A (Q2) at 25°C: Sufficient for 5W–10W point-of-load converters |
| Qg | 3.9nC (Q1 @ 10V), 6.4nC (Q2 @ –10V): Determines gate driver current requirement for 500kHz+ PWM |
| tD(off) | 6.6ns (Q1), 11.3ns (Q2): Limits minimum off-time in high-frequency synchronous rectification |
| RθJA | 51.0°C/W (Q1, pulsed): Allows 2.45W dissipation before exceeding 150°C junction limit on standard FR4 |
| VSD | 0.85–0.95V (Q1 body diode), –0.85 to –0.95V (Q2 body diode): Defines reverse recovery energy in freewheeling paths |
Pinout & Package
Package: DFN3020B-8, 3.0mm × 2.0mm × 0.8mm, thermally enhanced with exposed drain pads (D1/D2) and NiPdAu pre-plated terminals. UL 94V-0 rated, MSL Level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (D2) | P-channel drain | High-side switch output node; connects to VIN in high-side P-FET configuration |
| Pin 2 (D2) | P-channel drain (redundant) | Second drain terminal for parallel routing and thermal spreading of Q2 |
| Pin 3 (D1) | N-channel drain | Low-side switch output node; ties to ground return path in synchronous buck bottom switch |
| Pin 4 (D1) | N-channel drain (redundant) | Second drain terminal for parallel routing and thermal spreading of Q1 |
| Pin 5 (G2) | P-channel gate | Accepts negative gate drive relative to source; requires level-shifting for logic-compatible control |
| Pin 6 (S2) | P-channel source | Connects to output node in high-side switch; defines reference for Q2 gate drive |
| Pin 7 (G1) | N-channel gate | Standard positive logic input; compatible with 3.3V/5V microcontroller GPIO |
| Pin 8 (S1) | N-channel source | Common source connection tied to power ground; serves as return path for both body diodes |
Key Features
| Feature | Design Value |
|---|---|
| Complementary dual-die integration | Single-package N+P pairing eliminates layout mismatch and reduces PCB area by >50% vs discrete SOT23-6 solutions |
| Thermally optimized DFN3020B-8 | 0.8mm height and 6mm² footprint enable ultra-thin portable power modules (<1.2mm total stack height) |
| AEC-Q101 qualification | Validated for automotive ambient temperatures (–40°C to +125°C case) and mechanical shock/vibration stress |
| Low gate charge asymmetry | Qg(Q1)/Qg(Q2) = 3.9/6.4 ≈ 0.61 enables balanced dead-time tuning in half-bridge drivers |
| Body diode softness | Qrr = 13.0nC (Q1), 14.8nC (Q2) with trr < 18.6ns minimizes voltage overshoot during inductive turn-off |
Applications
| Motor Control H-Bridge | LCD Backlight Inverter |
|---|---|
|
Use Scenario: Bidirectional 12V brushed DC motor drive in automotive seat adjusters or HVAC actuators. IC Role / Device Role / Timing Role: Q1 (low-side N-FET) and Q2 (high-side P-FET) form one leg of full H-bridge; synchronized PWM controls direction and speed. Use Value: Complementary pairing ensures matched thermal response and eliminates external level shifters required for high-side N-FETs. |
Use Scenario: CCFL backlight in industrial panel displays requiring regulated AC output from 5V/12V supply. IC Role / Device Role / Timing Role: Q1/Q2 operate in push-pull topology driving resonant tank; fast tr/tf (2.3ns/2.9ns Q1) sustains >100kHz switching. Use Value: Low RDS(on) minimizes conduction loss in high-current half-cycle paths, improving inverter efficiency to >85%. |
| Portable Power Management | Synchronous Buck Converter |
|
Use Scenario: Dual-rail (3.3V/5V) power delivery in handheld medical monitors with battery backup. IC Role / Device Role / Timing Role: Q1 acts as main synchronous rectifier; Q2 provides reverse polarity protection on input rail. Use Value: 0.8mm profile allows placement beneath display module; AEC-Q101 rating ensures field reliability in mobile environments. |
Use Scenario: 24V-to-5V step-down regulator in industrial IoT gateway with 2A load. IC Role / Device Role / Timing Role: Q1 (low-side) and Q2 (high-side) replace external discrete FETs; gate charge values enable 1MHz operation with minimal driver loss. Use Value: Integrated thermal pad reduces θJA by 32% vs TSOP6, allowing full 2A load without heatsink at 50°C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar complementary MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMC3025LSD-13 | 30V/–30V, RDS(on) = 25mΩ/42mΩ @ 10V, SO-8 package, higher current (6.5A/–5.3A) | Larger footprint (5mm × 6mm), higher thermal mass - suited for >10W applications with heatsinking | Select when higher current headroom and SO-8 assembly compatibility outweigh size constraints |
| SI6926ADQ-T1-GE3 | 30V/–30V, RDS(on) = 32mΩ/52mΩ @ 10V, PowerPAK® 1212-8, 1.2mm height | Higher RDS(on) but superior RθJA (40°C/W); not AEC-Q101 qualified | Prefer for non-automotive high-efficiency DC-DC where thermal budget is tighter than space budget |
Compared with DMC3025LSD-13 and SI6926ADQ-T1-GE3, ZXMC3AMCTA offers the smallest footprint (3.0×2.0mm) and automotive qualification at the expense of higher RDS(on), making it optimal for space-limited AEC-Q101 designs below 5W per channel.
Availability
ZXMC3AMCTA is available at Aetrix Electronics and suitable for LCD backlight inverters, portable motor control systems, and synchronous buck converters requiring stable component supply and long-term industrial lifecycle support.
Supply support for ZXMC3AMCTA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the Americas.
ZXMC3AMC belongs to Diodes' PowerMOS™ complementary FET product line, engineered specifically for high-density, thermally constrained power conversion in automotive, industrial, and portable electronics.
FAQ
What is the maximum continuous drain current for each channel at 70°C ambient?
At TA = 70°C, the N-channel (Q1) supports 3.0A continuous drain current and the P-channel (Q2) supports –2.2A, as specified in the Absolute Maximum Ratings table under "Continuous Drain Current TA = 70°C". These values assume operation on a 28mm × 28mm FR4 PCB with 2oz copper and one active die.
Does ZXMC3AMCTA require external gate resistors for stable switching?
Yes - gate resistors are recommended to dampen ringing and control dV/dt. With Qg = 3.9nC (Q1) and 6.4nC (Q2), a 6Ω resistor (per datasheet test condition) limits peak gate current to ~2A and yields tr/tf of 2.3ns/2.8ns, preventing shoot-through in half-bridge configurations.
Can ZXMC3AMCTA be used in linear regulator applications?
No - this device is optimized for switching operation only. Its Safe Operating Area (SOA) curve shows limited DC capability (≤1.13W with two active dies), and RDS(on) variation over temperature (±20% from –55°C to +150°C) makes it unsuitable for precision linear regulation.
How is thermal performance affected when both channels operate simultaneously?
When both Q1 and Q2 conduct at equal power, RθJA degrades from 51.0°C/W (one active die) to 73.5°C/W (two active die on 31mm × 31mm, 1oz Cu board), reducing maximum allowable power dissipation from 2.45W to 1.70W before reaching 150°C junction temperature.
ZXMC3AMCTA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N and P-Channel
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 2.9A, 2.1A
- Rds On (Max) @ Id, Vgs:
- 120mOhm @ 2.5A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 3.9nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 190pF @ 25V
- Power - Max:
- 1.7W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN3020B-8
ZXMC3AMCTA FAQ
1.How can I place an order for ZXMC3AMCTA through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXMC3AMCTA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXMC3AMCTA reliable?
The price and inventory of ZXMC3AMCTA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMC3AMCTA is usually 5 days.
3.What payment methods are accepted for ZXMC3AMCTA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMC3AMCTA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXMC3AMCTA?
ZXMC3AMCTA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXMC3AMCTA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXMC3AMCTA?
For technical support, including ZXMC3AMCTA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMC3AMCTA requirements.
6.How does Aetrix verify that ZXMC3AMCTA is sourced from the original manufacturer or authorized distributors?
All ZXMC3AMCTA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMC3AMCTA meets industry standards.
7.What is the process for return or replacement of ZXMC3AMCTA?
All ZXMC3AMCTA units undergo pre-shipment inspection (PSI). If there is an issue with ZXMC3AMCTA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXMC3AMCTA part is unused and in its original packaging.
Return procedure for ZXMC3AMCTA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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