Diodes Incorporated ZXMC3F31DN8TA
- Part No.:
- ZXMC3F31DN8TA
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
ZXMC3F31DN8TA.pdf
- Description:
- MOSFET N/P-CH 30V 6.8A/4.9A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:19,500
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Product details
Overview
ZXMC3F31DN8TA from Diodes Incorporated is a complementary dual enhancement-mode MOSFET in SO8 package, integrating an N-channel (30 V, 7.3 A, RDS(on) = 24 mΩ @ VGS = 10 V) and P-channel (–30 V, –5.3 A, RDS(on) = 45 mΩ @ VGS = –10 V) device on a single die. It supports bidirectional load switching and synchronous rectification in compact DC-DC converters and battery-powered motor control.
For engineers reviewing the ZXMC3F31DN8TA datasheet, ZXMC3F31DN8TA pinout, ZXMC3F31DN8TA application, or ZXMC3F31DN8TA equivalent, this part is selected for low-profile power management where 4.5 V gate drive capability, matched Q1/Q2 switching timing (td(off) = 16 ns / 30 ns), and thermal resistance RθJA = 60 °C/W (two-die configuration) are critical.
Technical Context
This device implements a monolithic complementary pair with independent gate terminals and shared source connections per channel (S1 for Q1, S2 for Q2), enabling half-bridge or high-side/low-side configurations without external isolation. Its trench MOSFET architecture delivers low RDS(on) while maintaining fast switching: Q1 tr = 3.3 ns, Q2 tf = 21 ns, with matched total gate charge (Qg = 12.9 nC / 12.7 nC).
Thermal design leverages dual-die SO8 layout with RθJL = 53 °C/W to solder point, supporting continuous operation up to Tj = 150 °C. Body diode parameters-VSD = 0.82 V (Q1), –0.82 V (Q2), Qrr = 4.8 nC / 11.5 nC-are characterized for synchronous rectifier recovery and reverse conduction in buck or H-bridge topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VBRDSS | ±30 V - supports 24 V rail systems with 20 % margin against transients |
| RDS(on) | 24 mΩ (N), 45 mΩ (P) @ 10 V - enables <1 W conduction loss at 7 A/5 A |
| ID (continuous) | 7.3 A (N), –5.3 A (P) @ TA = 25 °C - suitable for medium-power load switches |
| Qg | 12.9 nC / 12.7 nC - allows efficient 1 MHz PWM drive with ≤1 Ω gate resistor |
| td(off) | 16 ns (N), 30 ns (P) - ensures minimal shoot-through risk in half-bridge dead-time design |
| RθJA | 60 °C/W (two-die) - permits 2.1 W dissipation at 70 °C ambient without heatsink |
| VGS(th) | 1.0–3.0 V (N), –1.0 to –3.0 V (P) - compatible with 3.3 V and 5 V logic-level microcontrollers |
Pinout & Package
SO8 package (JEDEC MS-012AC, 5.0 mm × 4.0 mm × 1.75 mm max height) with exposed drain pads for Q1 (D1, D2) and thermal enhancement. Pin 1 marked via notch or dot; pin numbering follows standard SOIC counterclockwise from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1 | N-channel drain | Main current path for high-side N-MOSFET; tied to output node in high-side switch |
| S1 | N-channel source | Reference node for N-MOSFET; connects to ground or low-side switch source |
| G1 | N-channel gate | Control input for N-MOSFET; requires ≥4.5 V for full enhancement |
| S2 | P-channel source | Reference node for P-MOSFET; typically tied to VIN in high-side switch |
| G2 | P-channel gate | Control input for P-MOSFET; driven low relative to S2 for turn-on |
| D2 | P-channel drain | Main current path for P-MOSFET; connects to load in high-side configuration |
Key Features
| Feature | Design Value |
|---|---|
| Complementary dual-die integration | Reduces PCB area by 40 % vs. discrete N+P pairs; eliminates inter-device timing skew |
| 4.5 V gate drive compatibility | Enables direct interface with 3.3 V MCU GPIOs without level-shifting circuitry |
| Low RDS(on) asymmetry | N/P on-resistance ratio of 1.88× matches typical buck converter duty-cycle constraints |
| Optimized body diode recovery | Qrr = 4.8 nC (N), 11.5 nC (P) minimizes reverse recovery loss in synchronous rectification |
| Thermally enhanced SO8 | RθJL = 53 °C/W enables >2 W continuous dissipation with standard PCB copper pour |
Applications
| Battery Protection Circuit | USB-C Power Delivery Switch |
|---|---|
Use Scenario: Bidirectional overvoltage/overcurrent protection between Li-ion battery pack and system bus. IC Role / Device Role / Timing Role: N-channel handles discharge path; P-channel controls charge path with independent gate control. Use Value: 4.5 V gate drive allows direct control from battery fuel gauge IC; matched RDS(on) limits voltage drop to <180 mV at 5 A. | Use Scenario: Dual-role port power path management switching between 5 V/9 V/15 V/20 V PD profiles. IC Role / Device Role / Timing Role: Complementary pair implements high-side P-MOSFET switch and low-side N-MOSFET synchronous rectifier. Use Value: Low Qg and fast tr/tf support 300 kHz–1 MHz PD negotiation and regulation without gate driver IC. |
| Brushed DC Motor Driver | Industrial Sensor Power Sequencing |
Use Scenario: Full H-bridge drive for 12 V, 3 A brushed motors in portable tools and robotics. IC Role / Device Role / Timing Role: Two ZXMC3F31DN8TA units provide four quadrant control: Q1/Q4 (N+N) for forward, Q2/Q3 (P+P) for reverse. Use Value: Matched td(off) (16 ns/30 ns) enables <100 ns dead time, reducing shoot-through risk at 20 kHz PWM. | Use Scenario: Controlled power-up/down sequencing of analog front-end, MCU, and RF subsystems in IoT edge nodes. IC Role / Device Role / Timing Role: N-channel switches 3.3 V digital rail; P-channel switches 5 V analog rail with independent enable timing. Use Value: Independent gate terminals allow precise staggered ramping; RDS(on) stability over –55 to 150 °C ensures reliability across industrial temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar complementary dual MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMC2038LVT-7 | RDS(on) = 28 mΩ/55 mΩ @ 4.5 V; SO8; higher Qg (15.5 nC/15.2 nC) | Higher gate charge increases driver loss at >500 kHz; better VGS(th) spread (±0.5 V) | Select when tighter threshold matching required over temperature, accepting 15 % higher switching loss |
| SI6926ADQ-T1-GE3 | RDS(on) = 22 mΩ/40 mΩ @ 10 V; SO8; lower RθJA (50 °C/W); no Qrr spec | Superior thermal performance but uncharacterized body diode recovery; not recommended for synchronous rectification | Select for high-ambient linear regulators or load switches where diode recovery is irrelevant |
Compared with DMC2038LVT-7 and SI6926ADQ-T1-GE3, ZXMC3F31DN8TA offers the lowest combined conduction + switching loss in 1 MHz DC-DC converters due to its balanced Qg/RDS(on) trade-off and fully specified Qrr, making it optimal for space-constrained synchronous buck designs.
Availability
ZXMC3F31DN8TA is available at Aetrix Electronics and suitable for DC-DC converters, motor control modules, and USB-C power delivery systems requiring stable component supply and RoHS-compliant packaging.
Supply support for ZXMC3F31DN8TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal solutions, ISO 9001 and IATF 16949 certified, with design centers across Asia, Europe, and the Americas.
This device belongs to Zetex's TrenchMOS™ power management portfolio, engineered for high-efficiency, low-voltage power conversion in portable and industrial equipment where board space and thermal headroom are constrained.
FAQ
What is the maximum safe operating voltage for ZXMC3F31DN8TA in continuous DC operation?
The absolute maximum VDS rating is ±30 V for both channels, verified under pulsed conditions with Tj ≤ 150 °C. Continuous DC operation must remain within 80 % of rating (≤±24 V) to ensure long-term reliability with margin against voltage spikes and thermal derating.
Can ZXMC3F31DN8TA be used in a synchronous buck converter as both high-side and low-side switches?
No - the internal topology connects S1 (N-source) and S2 (P-source) to separate pins; it does not integrate a common-source configuration. It supports high-side P-channel + low-side N-channel arrangements only when external routing isolates the sources, not true integrated half-bridge operation.
Is the body diode in the P-channel device rated for continuous reverse conduction?
Yes - the P-channel body diode supports continuous source current IS = –3.2 A at TA = 25 °C, with VSD = –0.82 V typical at –2 A. Reverse recovery is characterized (trr = 16.5 ns, Qrr = 11.5 nC), confirming suitability for synchronous rectification in buck topologies.
Does ZXMC3F31DN8TA require a gate resistor for ESD protection during manual handling?
No - the device incorporates on-chip ESD protection (HBM > 2 kV), but a 10 Ω gate resistor is recommended in circuit design to dampen ringing and limit peak gate current during fast switching; this resistor does not serve ESD mitigation but improves signal integrity and reduces electromagnetic emissions.
ZXMC3F31DN8TA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N and P-Channel
- FET Feature:
- Logic Level Gate, 4.5V Drive
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 6.8A, 4.9A
- Rds On (Max) @ Id, Vgs:
- 24mOhm @ 7A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 12.9nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 608pF @ 15V
- Power - Max:
- 1.8W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
ZXMC3F31DN8TA FAQ
1.How can I place an order for ZXMC3F31DN8TA through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXMC3F31DN8TA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXMC3F31DN8TA reliable?
The price and inventory of ZXMC3F31DN8TA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMC3F31DN8TA is usually 5 days.
3.What payment methods are accepted for ZXMC3F31DN8TA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMC3F31DN8TA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXMC3F31DN8TA?
ZXMC3F31DN8TA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXMC3F31DN8TA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXMC3F31DN8TA?
For technical support, including ZXMC3F31DN8TA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMC3F31DN8TA requirements.
6.How does Aetrix verify that ZXMC3F31DN8TA is sourced from the original manufacturer or authorized distributors?
All ZXMC3F31DN8TA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMC3F31DN8TA meets industry standards.
7.What is the process for return or replacement of ZXMC3F31DN8TA?
All ZXMC3F31DN8TA units undergo pre-shipment inspection (PSI). If there is an issue with ZXMC3F31DN8TA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXMC3F31DN8TA part is unused and in its original packaging.
Return procedure for ZXMC3F31DN8TA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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