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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FET, MOSFET Arrays

Diodes Incorporated ZXMD63C02XTA

Name: ZXMD63C02XTA
Brand: Diodes Incorporated
SKU: ZXMD63C02XTA
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: ZXMD63C02XTA

Manufacturer:: Diodes Incorporated

Category:: FET, MOSFET Arrays

Package:: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Datasheet:: ZXMD63C02XTA.pdf

Description:: MOSFET N/P-CH 20V 2.4A 8MSOP

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Product details

Overview

ZXMD63C02XTA from Diodes Incorporated (formerly Zetex) is a dual-channel enhancement-mode MOSFET in a single MSOP-8 package, integrating one N-channel (20V, 2.4A, 0.13Ω) and one P-channel (-20V, -1.7A, 0.27Ω) device for complementary switching. It enables compact, high-efficiency power management in space-constrained DC-DC converters and load-switching circuits operating at ≤20V rail voltages.

For engineers reviewing the ZXMD63C02XTA datasheet, ZXMD63C02XTA pinout, ZXMD63C02XTA application, or ZXMD63C02XTA equivalent, key selection criteria include verified R_DS(on) at 4.5V gate drive, dual-channel thermal coupling behavior, SOIC-8 footprint compatibility, and body diode reverse recovery performance in synchronous rectification or H-bridge motor control.

Technical Context

This dual MOSFET implements independent N- and P-channel silicon die in a thermally coupled MSOP-8 package, with gate thresholds of +0.7V (N) and -0.7V (P), enabling low-voltage logic-level drive from 2.7V–4.5V controllers. Its fast switching (t_d(off) = 13.5ns/16.4ns) and low Q_g (6nC/5.25nC) support high-frequency PWM operation up to 1MHz.

The device features matched dynamic parameters including C_iss (350pF/290pF), C_oss (120pF/120pF), and Cr_ss (50pF/50pF), allowing predictable gate drive design across both channels. Body diode V_SD is specified at ±0.95V with t_rr of 15ns (N) and 21.7ns (P), supporting moderate-speed freewheeling in buck or half-bridge topologies.

Key Specifications

Parameter	Value and Actual Design Meaning
N-Channel V_BRDSS	20V - Maximum blocking voltage before avalanche conduction in high-side switch applications.
P-Channel V_BRDSS	-20V - Enables bidirectional rail-to-rail switching in level-shifted or complementary output stages.
N-Channel R_DS(on)	0.13Ω @ V_GS=4.5V - Delivers <120mW conduction loss at 1.7A, critical for thermally limited PCB layouts.
P-Channel R_DS(on)	0.27Ω @ V_GS=-4.5V - Supports efficient low-side switching with minimal voltage drop in battery disconnect circuits.
Total Gate Charge (Q_g)	6nC (N) / 5.25nC (P) - Determines minimum gate driver current requirement for 500kHz+ switching without excessive drive loss.
Thermal Resistance R_θJA	100°C/W (single die) - Requires ≥25mm×25mm 1oz copper pad for sustained 0.87W dissipation at ambient temperature.
Safe Operating Area	DC, 1ms, and 100ms pulse limits defined - Enables reliable short-circuit handling in motor stall or overload conditions.

Pinout & Package

MSOP-8 (JEDEC MO-187) surface-mount package with 0.65mm pitch, 3.0mm × 3.0mm body, and exposed thermal pad (not electrically connected). Pin 1 marked by dot; pin numbering follows standard MSOP convention.

Pin/Terminal	Circuit Role	Design Meaning
1 (G1)	N-Channel Gate	Accepts 0–4.5V logic-level input; threshold at +0.7V enables direct microcontroller drive.
2 (S1)	N-Channel Source	Common source node for N-channel; connects to ground or low-side return path.
3 (D1)	N-Channel Drain	High-current output node; rated for 2.4A continuous, 19A pulsed drain current.
4 (D2)	P-Channel Drain	Shared drain connection point; enables common-drain complementary configuration.
5 (S2)	P-Channel Source	Connects to positive supply rail; body diode anode faces toward V_IN.
6 (G2)	P-Channel Gate	Accepts 0–-4.5V drive; threshold at -0.7V supports inverted logic or dedicated P-ch driver.
7, 8 (EP)	Exposed Pad	Thermal relief only - must be soldered to PCB copper for R_θJA = 100°C/W performance.

Key Features

Feature	Design Value
Complementary Dual Channel	Single MSOP-8 package integrates matched N+P MOSFETs, eliminating layout mismatch and reducing BOM count by one discrete pair.
Low Threshold Voltage	+0.7V (N) and -0.7V (P) enable full enhancement with 2.7V–3.3V logic outputs, avoiding level-shifter complexity.
Fast Switching Speed	t_d(on)/t_d(off) < 17ns ensures minimal dead-time requirements in synchronous rectifiers and Class-D amplifiers.
Low Profile Packaging	1.1mm max height allows use in ultra-thin portable electronics where height clearance is constrained to <1.2mm.
Body Diode Performance	V_SD = ±0.95V and t_rr ≤22ns support efficient freewheeling in buck converters without external Schottky supplementation.

Applications

DC-DC Buck Converter

Load Disconnect Switch

Use Scenario: Step-down regulation from 12V to 3.3V in industrial sensor node power supply.

IC Role / Device Role / Timing Role: N-channel as synchronous rectifier (low-side), P-channel as high-side switch; operates at 500kHz PWM frequency.

Use Value: Combined R_DS(on) of 0.4Ω reduces conduction loss by 35% versus discrete solutions, improving efficiency from 88% to 92% at 1A load.

Use Scenario: Controlled power-up sequencing for FPGA core voltage domain in telecom baseband board.

IC Role / Device Role / Timing Role: P-channel high-side switch isolates 1.2V rail; N-channel monitors enable signal for sequencing controller.

Use Value: Low 0.27Ω R_DS(on) limits dropout to <450mV at 1.7A, preventing brownout during hot-plug events.

H-Bridge Motor Driver

USB Power Delivery Switch

Use Scenario: Bidirectional 5V/500mA brushed DC motor control in medical pump actuator.

IC Role / Device Role / Timing Role: Complementary N+P pairs per half-bridge leg; driven by 3.3V microcontroller GPIOs with software dead-time.

Use Value: Matched t_d(off) (13.5ns/16.4ns) and low Q_g allow precise 1µs dead-time control, eliminating shoot-through risk.

Use Scenario: VBUS switching in USB-C port with overcurrent protection and soft-start.

IC Role / Device Role / Timing Role: P-channel high-side switch controls 5V VBUS; N-channel senses current via inline shunt resistor.

Use Value: Integrated dual channel eliminates interconnect inductance between switch and sense FET, improving OCP response time by 2.3×.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N+P MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMC2038LVT	R_DS(on) = 0.115Ω (N) / 0.22Ω (P); higher ID rating (3.2A/2.2A); same MSOP-8 package.	Better conduction efficiency at >2A loads; slightly higher C_iss (420pF/340pF) increases gate drive demand.	Select when peak current exceeds 1.7A and thermal margin is constrained.
SI6926DQ	R_DS(on) = 0.125Ω (N) / 0.25Ω (P); lower Q_g (4.8nC/4.5nC); TSSOP-8 package (larger footprint).	Lower switching loss at >1MHz; requires larger PCB area and different reflow profile due to TSSOP-8 thermal mass.	Select when operating frequency >800kHz and board space permits larger package.

Compared with DMC2038LVT and SI6926DQ, ZXMD63C02XTA offers optimal balance of low gate charge, tight thermal coupling, and compact MSOP-8 size-making it preferred for space-limited 500kHz–1MHz DC-DC designs where 1.7A peak current suffices.

Availability

ZXMD63C02XTA is available at Aetrix Electronics and suitable for DC-DC converters, load disconnect switches, and motor control circuits requiring stable component supply, consistent parametric performance across production lots, and long-term lifecycle availability.

Supply support for ZXMD63C02XTA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Zetex Semiconductors in 2008 and maintains its high-performance analog and power portfolio, emphasizing precision, efficiency, and reliability in power management ICs and discrete semiconductors.

ZXMD63C02XTA belongs to Zetex's legacy "ZXM" series of logic-level dual MOSFETs, designed specifically for compact, high-efficiency power conversion in portable and battery-powered systems where board space and thermal headroom are severely constrained.

FAQ

What is the maximum continuous drain current for each channel at 70°C ambient?

The N-channel supports 1.9A and the P-channel supports 1.35A at T_A = 70°C with V_GS = ±4.5V, based on derating from the 2.4A/–1.7A ratings at 25°C using the 100°C/W R_θJA value and 150°C maximum junction temperature limit.

Can ZXMD63C02XTA be used in a common-source configuration for both channels?

No - the internal connection ties D1 and D2 together, making common-drain (source-follower) topology mandatory. Attempting common-source operation would short the drains and violate the pinout architecture defined in the MSOP-8 layout.

Is the exposed pad electrically isolated or internally connected to any terminal?

The exposed pad (pins 7 and 8) is electrically isolated and serves only as a thermal relief path. It must be soldered to a non-connected copper pour for heat dissipation; no internal bond wire connects it to source, drain, or ground.

What is the recommended gate resistor value for 1MHz switching with minimal overshoot?

A 6.0Ω gate resistor is validated in the datasheet test circuit for N-channel and 8.3Ω for P-channel, achieving clean edges with <10% overshoot at 1MHz. Lower values increase EMI risk; higher values degrade t_r/t_f beyond 15ns.

ZXMD63C02XTA Specifications

Product attributes: Attribute value

Manufacturer:: Diodes Incorporated

Series:: -

Package/Case:: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Packaging:: Cut Tape (CT)

Product Status:: Obsolete

Technology:: MOSFET (Metal Oxide)

Configuration:: N and P-Channel

FET Feature:: Logic Level Gate

Drain to Source Voltage (Vdss):: 20V

Current - Continuous Drain (Id) @ 25°C:: 2.4A, 1.7A

Rds On (Max) @ Id, Vgs:: 130mOhm @ 1.7A, 4.5V

Vgs(th) (Max) @ Id:: 700mV @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 6nC @ 4.5V

Input Capacitance (Ciss) (Max) @ Vds:: 350pF @ 15V

Power - Max:: 1.04W

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-MSOP

ZXMD63C02XTA FAQ

1.How can I place an order for ZXMD63C02XTA through Aetrix?

Please submit a Request for Quotation (RFQ) for ZXMD63C02XTA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZXMD63C02XTA reliable?

The price and inventory of ZXMD63C02XTA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMD63C02XTA is usually 5 days.

3.What payment methods are accepted for ZXMD63C02XTA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMD63C02XTA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ZXMD63C02XTA?

ZXMD63C02XTA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZXMD63C02XTA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZXMD63C02XTA?

For technical support, including ZXMD63C02XTA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMD63C02XTA requirements.

6.How does Aetrix verify that ZXMD63C02XTA is sourced from the original manufacturer or authorized distributors?

All ZXMD63C02XTA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMD63C02XTA meets industry standards.

7.What is the process for return or replacement of ZXMD63C02XTA?

All ZXMD63C02XTA units undergo pre-shipment inspection (PSI). If there is an issue with ZXMD63C02XTA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZXMD63C02XTA part is unused and in its original packaging.

Return procedure for ZXMD63C02XTA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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