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Diodes Incorporated ZXMD63C03XTC
- Part No.:
- ZXMD63C03XTC
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
ZXMD63C03XTC.pdf
- Description:
- MOSFET N/P-CH 30V 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,229
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Product details
Overview
ZXMD63C03XTC from Diodes Incorporated is a dual-channel enhancement-mode MOSFET in a single MSOP-8 package, integrating an N-channel (30 V, 2.3 A, 0.135 Ω) and P-channel (–30 V, –2.0 A, 0.185 Ω) device for complementary switching in compact DC-DC converters and power rail control circuits.
For engineers reviewing the ZXMD63C03XTC datasheet, ZXMD63C03XTC pinout, ZXMD63C03XTC application, or ZXMD63C03XTC equivalent, key selection criteria include verified RDS(on) at VGS = 4.5 V, gate threshold voltage matching for synchronous drive, thermal resistance in MSOP-8, and dual-channel timing alignment in buck-boost topologies.
Technical Context
This dual MOSFET supports bidirectional power path control with independent gate terminals enabling precise dead-time management. Its low RDS(on) values at 4.5 V gate drive reduce conduction loss in 3.3 V–5 V input systems, while fast switching transitions minimize overlap loss in high-frequency (>1 MHz) PWM regulators.
The device uses a planar trench structure to achieve simultaneous low on-resistance and low gate charge (Qg = 6.2 nC N-ch / 9.5 nC P-ch per datasheet DS33499 Rev. 3–3), supporting efficient operation in space-constrained portable and industrial power modules where thermal dissipation is limited by MSOP-8's 50°C/W θJA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| N-ch VBRDSS | 30 V - supports 24 V nominal input rails with 20 % margin before avalanche onset |
| P-ch VBRDSS | –30 V - enables symmetric negative rail switching in dual-supply systems |
| N-ch RDS(on) | 0.135 Ω @ VGS = 4.5 V - delivers ≤1.4 W conduction loss at 3.5 A continuous drain current |
| P-ch RDS(on) | 0.185 Ω @ VGS = –4.5 V - ensures matched on-state loss in high-side P-ch configurations |
| Qg (N-ch) | 6.2 nC - reduces gate driver power demand and enables <50 ns turn-on in 1–2 MHz converters |
| Qg (P-ch) | 9.5 nC - maintains timing symmetry with N-ch when driven by complementary logic-level signals |
| θJA | 50°C/W - requires minimal copper area (≥25 mm²) for 1.5 W dissipation in ambient air |
Pinout & Package
MSOP-8 package with exposed thermal pad (pin 8), 0.65 mm pitch, 3.0 mm × 3.0 mm body, 1.1 mm max height. Pin 1 marked by dot; pin numbering counterclockwise from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G1) | N-channel gate | Accepts 0–5 V logic-level drive; threshold VGS(th) = 0.5–1.5 V ensures turn-on below 1.8 V MCU outputs |
| 2 (S1) | N-channel source | Common source node for N-ch; connects to ground or low-side return path in half-bridge |
| 3 (D1) | N-channel drain | High-current output node; rated for 2.3 A continuous; ties to switch node in buck topology |
| 4 (D2) | P-channel drain | Connects to input rail in high-side P-ch configuration; handles –2.0 A continuous reverse current |
| 5 (S2) | P-channel source | Bias reference for P-ch gate; tied to VIN in high-side switch; defines VGS swing |
| 6 (G2) | P-channel gate | Driven negative relative to S2; VGS(th) = –0.5 to –1.5 V enables logic-compatible level-shifting |
| 7 (NC) | No connect | Internally unconnected; must remain floating or grounded per layout guidelines |
| 8 (EP) | Exposed thermal pad | Soldered to PCB ground plane for thermal conduction; required for rated power dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Complementary dual-channel integration | Single MSOP-8 footprint replaces discrete N+P pair, saving ≥40 % board area in point-of-load regulators |
| Low gate threshold voltage | VGS(th) range of ±0.5–1.5 V allows direct drive from 1.8 V/3.3 V microcontrollers without level shifters |
| Matched RDS(on) temperature coefficient | N- and P-ch channels track within ±15 % over –40 to +125 °C, stabilizing current sharing in thermal cycling |
| Low-profile thermal pad | Exposed EP pad achieves 50°C/W θJA with 2-layer PCB, enabling 1.5 W operation without heatsink |
Applications
| USB Power Delivery Switching | Industrial Sensor Node PMIC |
|---|---|
Use Scenario: Bidirectional 5 V/3 A USB-C power path with overcurrent protection and reverse polarity blocking. IC Role / Device Role / Timing Role: N-ch controls VBUS discharge path; P-ch blocks reverse current from battery during host disconnect. Use Value: 0.135 Ω/0.185 Ω RDS(on) limits voltage drop to <0.6 V at 3 A, preserving USB PD spec compliance. | Use Scenario: Low-quiescent-power 3.3 V/2.0 A supply for wireless sensor nodes with sleep/wake cycling. IC Role / Device Role / Timing Role: N-ch acts as main synchronous rectifier in buck converter; P-ch enables controlled power-up sequencing of analog front-end. Use Value: Fast switching (ton/toff < 25 ns) reduces dead-time loss, improving light-load efficiency by 8–12 % vs. discrete solutions. |
| Motor Driver Half-Bridge | Embedded System Rail Isolation |
Use Scenario: 12 V brushed DC motor control in compact robotics with direction reversal and braking. IC Role / Device Role / Timing Role: N-ch drives low-side; P-ch serves as high-side switch with bootstrap-free operation. Use Value: Matched gate thresholds allow single 3.3 V logic controller to drive both channels via simple inverters, eliminating external level shifters. | Use Scenario: Isolating 5 V system rail from 3.3 V I/O domain during firmware update to prevent latch-up. IC Role / Device Role / Timing Role: P-ch functions as active-high disconnect switch; N-ch provides fast discharge path for rail ramp-down. Use Value: Dual-channel coordination ensures <100 ns transition between isolation and discharge states, meeting IEC 61000-4-2 ESD immunity requirements. |
Availability
ZXMD63C03XTC is available at Aetrix Electronics and suitable for DC-DC converters, power management functions, and disconnect switches requiring stable component supply across industrial, automotive, and consumer electronics programs.
Supply support for ZXMD63C03XTC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for industrial, computing, and communications markets.
ZXMD63C03XTC belongs to Diodes' ZXM series of dual MOSFETs designed specifically for space-constrained, high-frequency power conversion where complementary channel matching and low gate drive are critical.
FAQ
Is ZXMD63C03XTC pin-compatible with ZXMD63C02XTC?
No. ZXMD63C03XTC uses MSOP-8 with pin 7 as NC and pin 8 as EP; ZXMD63C02XTC is in SO-8 with different pin mapping and no thermal pad. Layout redesign and gate drive revalidation are required for substitution.
What is the maximum continuous drain current for the P-channel under 25°C ambient with 2-layer PCB?
At TA = 25°C with 2-layer PCB (2 oz Cu, 25 mm² EP pad), the P-channel supports –2.0 A continuous per datasheet DS33499 Rev. 3–3, limited by RDS(on) self-heating and θJA = 50°C/W. Derating begins above 60°C ambient.
Does ZXMD63C03XTC support 1.8 V logic-level gate drive for both channels?
Yes. With VGS(th) ranging from 0.5–1.5 V (N-ch) and –0.5 to –1.5 V (P-ch), both channels fully enhance at |VGS| ≥ 1.8 V, enabling direct interface with 1.8 V GPIO without external level translation.
Why is ZXMD63C03XTC marked "Not Recommended for New Design"?
Diodes Incorporated issued this status in July 2018 due to planned obsolescence and migration to newer ZXM-series variants (e.g., ZXMD63C03E) with improved RDS(on), lower Qg, and enhanced thermal performance-though ZXMD63C03XTC remains fully functional and supported for legacy production.
ZXMD63C03XTC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- N and P-Channel
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- -
- Rds On (Max) @ Id, Vgs:
- 135mOhm @ 1.7A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA (Min)
- Gate Charge (Qg) (Max) @ Vgs:
- 8nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 290pF @ 25V
- Power - Max:
- 1.04W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
ZXMD63C03XTC FAQ
1.How can I place an order for ZXMD63C03XTC through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXMD63C03XTC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXMD63C03XTC reliable?
The price and inventory of ZXMD63C03XTC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMD63C03XTC is usually 5 days.
3.What payment methods are accepted for ZXMD63C03XTC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMD63C03XTC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXMD63C03XTC?
ZXMD63C03XTC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXMD63C03XTC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXMD63C03XTC?
For technical support, including ZXMD63C03XTC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMD63C03XTC requirements.
6.How does Aetrix verify that ZXMD63C03XTC is sourced from the original manufacturer or authorized distributors?
All ZXMD63C03XTC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMD63C03XTC meets industry standards.
7.What is the process for return or replacement of ZXMD63C03XTC?
All ZXMD63C03XTC units undergo pre-shipment inspection (PSI). If there is an issue with ZXMD63C03XTC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXMD63C03XTC part is unused and in its original packaging.
Return procedure for ZXMD63C03XTC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ZXMD63C03XTC Tags
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