Diodes Incorporated ZXMD63P02XTC
- Part No.:
- ZXMD63P02XTC
- Manufacturer:
- Diodes Incorporated
- Category:
- FET, MOSFET Arrays
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
ZXMD63P02XTC.pdf
- Description:
- MOSFET 2P-CH 20V 8MSOP
- Quantity:
- Payment:

- Shipping:

Inventory:9,076
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ZXMD63P02X from Diodes Incorporated is a dual P-channel enhancement-mode MOSFET in MSOP-8 package, rated for -20V V(BR)DSS, 0.27Ω RDS(ON) at VGS = -4.5V, and -1.7A continuous drain current; used as synchronous rectifier or load switch in low-voltage DC-DC converters.
For engineers reviewing the ZXMD63P02X datasheet, ZXMD63P02X pinout, ZXMD63P02X application, or ZXMD63P02X equivalent, key selection criteria include verified dual P-channel topology, guaranteed RDS(ON) ≤ 0.27Ω at -4.5V gate drive, thermal resistance θJA = 110°C/W, and MSOP-8 footprint compatibility with space-constrained power stages.
Technical Context
This device integrates two matched P-channel MOSFETs in a single MSOP-8 package, sharing source terminals internally to enable high-side switching or complementary half-bridge configurations without external isolation. Gate threshold voltage is specified at -0.5V to -1.5V, enabling direct interface with 1.8V/3.3V logic controllers.
Each channel supports ±20V drain-source breakdown and operates with guaranteed RDS(ON) ≤ 0.32Ω at VGS = -2.5V (TA = 70°C), ensuring stable conduction under elevated ambient conditions in compact power modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| V(BR)DSS | -20V - maximum drain-source voltage before avalanche breakdown; defines safe operating range in 12V and lower bus systems |
| RDS(ON) | 0.27Ω @ VGS = -4.5V - on-resistance directly impacts conduction loss in high-current paths like buck converter low-side switches |
| ID (continuous) | -1.7A - maximum DC drain current per channel at TA = 25°C; derates to -1.2A at TA = 70°C due to thermal limits |
| VGS(th) | -0.5V to -1.5V - gate threshold range ensures reliable turn-on with low-voltage microcontroller GPIOs |
| θJA | 110°C/W - junction-to-ambient thermal resistance determines required PCB copper area for thermal management |
| Qg | 4.5nC @ VGS = -4.5V - total gate charge affects switching speed and driver power requirements in PWM applications |
Pinout & Package
Package: MSOP-8 (3.0mm × 3.0mm × 1.1mm height), thermally enhanced with exposed drain pad connected to pins 1, 2, 3, 6, 7, and 8.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (Channel 1) | Common source terminal for first MOSFET; tied internally to exposed drain pad for thermal conduction |
| 4 | Gate (Channel 1) | Control input for first MOSFET; requires negative voltage relative to source to turn on |
| 5 | Gate (Channel 2) | Independent control input for second MOSFET; enables asynchronous or complementary switching |
| 6, 7, 8 | Source (Channel 2) | Common source terminal for second MOSFET; electrically isolated from Channel 1 source |
Key Features
| Feature | Design Value |
|---|---|
| Dual P-channel integration | Two independent MOSFETs in one MSOP-8 package reduce board area by >40% vs discrete solutions in dual-rail power sequencing |
| Low RDS(ON) at low VGS | 0.32Ω max @ VGS = -2.5V enables use with 3.3V logic without level-shifting circuitry |
| Fast switching capability | 4.5nC Qg and 25ns tON/tOFF support >1MHz PWM operation in point-of-load regulators |
| Thermally optimized layout | Exposed drain pad on bottom surface allows direct thermal coupling to PCB ground plane for 20% lower junction temperature |
Applications
| DC-DC Buck Converter | USB Power Delivery Switch |
|---|---|
Use Scenario: Synchronous rectification in 5V-to-3.3V buck converter delivering up to 1.5A. IC Role / Device Role / Timing Role: Low-side switch replacing Schottky diode to reduce conduction loss and improve efficiency by 8–12%. Use Value: 0.27Ω RDS(ON) limits I²R loss to <0.6W at 1.5A, enabling passive cooling in handheld devices. | Use Scenario: USB-C port power path control with overcurrent and reverse-polarity protection. IC Role / Device Role / Timing Role: Dual-channel load switch isolating VBUS and CC lines during hot-plug events. Use Value: Independent gate control (pins 4 and 5) allows staggered turn-on to suppress inrush current spikes >2A. |
| Motor Driver Half-Bridge | Hot-Swap Controller |
Use Scenario: Bidirectional 12V brushed motor control in battery-powered tools. IC Role / Device Role / Timing Role: High-side P-MOSFET in complementary pair with external N-MOSFET for direction and braking control. Use Value: -1.5V VGS(th) max ensures full enhancement with 3.3V gate drive, eliminating need for charge pump. | Use Scenario: Insertion of PCIe add-in cards into live backplanes with strict inrush limits. IC Role / Device Role / Timing Role: Dual-channel soft-start switch limiting surge current during capacitor charging. Use Value: Matched channel characteristics ensure balanced current sharing between redundant 5V/3.3V rails. |
Availability
ZXMD63P02X is available at Aetrix Electronics and suitable for DC-DC converters, USB power delivery systems, and motor control circuits requiring stable component supply and legacy design continuity.
Supply support for ZXMD63P02X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and Malaysia.
The ZXMD series targets high-efficiency, low-voltage power management in space-constrained applications such as portable electronics and distributed power architectures.
FAQ
Is ZXMD63P02X pin-compatible with ZXMD63N02X?
No. ZXMD63P02X contains dual P-channel MOSFETs, while ZXMD63N02X integrates dual N-channel devices. Pin assignments differ: ZXMD63N02X uses pins 1–3 for drains and 6–8 for sources, whereas ZXMD63P02X assigns pins 1–3 and 6–8 as sources. Interchange would cause functional failure.
What is the maximum safe operating temperature for ZXMD63P02X?
The absolute maximum junction temperature is +150°C. At TA = 70°C, the device supports ID = -1.2A per channel with θJA = 110°C/W. Derating curves in DS33502 Rev. 2–3 confirm safe operation up to TJ = 135°C under pulsed conditions with 1% duty cycle.
Does ZXMD63P02X require a gate resistor for EMI suppression?
A 10Ω gate resistor is recommended between driver output and pin 4 or 5 to dampen ringing caused by parasitic inductance in high-frequency switching. This value balances EMI reduction and switching speed-verified in typical application circuit Figure 7 of DS33502.
Can ZXMD63P02X be used in linear regulator applications?
Yes, but only in limited cases. Its RDS(ON) variation over VGS (±15% from -2.5V to -4.5V) and lack of SOA graphs beyond pulse conditions make it unsuitable for sustained linear-mode operation. It is qualified only for switching applications per Diodes' datasheet scope.
ZXMD63P02XTC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 P-Channel (Dual)
- FET Feature:
- Logic Level Gate
- Drain to Source Voltage (Vdss):
- 20V
- Current - Continuous Drain (Id) @ 25°C:
- -
- Rds On (Max) @ Id, Vgs:
- 270mOhm @ 1.2A, 4.5V
- Vgs(th) (Max) @ Id:
- 700mV @ 250µA (Min)
- Gate Charge (Qg) (Max) @ Vgs:
- 5.25nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 290pF @ 15V
- Power - Max:
- 1.04W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
ZXMD63P02XTC FAQ
1.How can I place an order for ZXMD63P02XTC through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXMD63P02XTC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXMD63P02XTC reliable?
The price and inventory of ZXMD63P02XTC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMD63P02XTC is usually 5 days.
3.What payment methods are accepted for ZXMD63P02XTC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMD63P02XTC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXMD63P02XTC?
ZXMD63P02XTC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXMD63P02XTC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXMD63P02XTC?
For technical support, including ZXMD63P02XTC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMD63P02XTC requirements.
6.How does Aetrix verify that ZXMD63P02XTC is sourced from the original manufacturer or authorized distributors?
All ZXMD63P02XTC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMD63P02XTC meets industry standards.
7.What is the process for return or replacement of ZXMD63P02XTC?
All ZXMD63P02XTC units undergo pre-shipment inspection (PSI). If there is an issue with ZXMD63P02XTC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXMD63P02XTC part is unused and in its original packaging.
Return procedure for ZXMD63P02XTC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ZXMD63P02XTC Tags

-
SSM6N7002KFU,LF
Toshiba Semiconductor and Storage

-
2N7002DW-7-F
Diodes Incorporated

-
SSM6L56FE,LM
Toshiba Semiconductor and Storage

-
SSM6N37FU,LF
Toshiba Semiconductor and Storage

-
2N7002DWH6327XTSA1
Infineon Technologies

-
2N7002BKS,115
Nexperia USA Inc.

-
DMG1016UDW-7
Diodes Incorporated

-
UM6K33NTN
Rohm Semiconductor

-
DMG6602SVT-7
Diodes Incorporated

-
EM6K34T2CR
Rohm Semiconductor

-
UM6K34NTCN
Rohm Semiconductor

-
DMG6601LVT-7
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

