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Diodes Incorporated ZXMHC10A07T8TA

Part No.:
ZXMHC10A07T8TA
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
SOT-223-8
Datasheet:
AetrixZXMHC10A07T8TA.pdf
Description:
MOSFET 2N/2P-CH 100V SM8
Quantity:
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Payment
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Inventory:933

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Product details

Overview

ZXMHC10A07T8TA from Diodes Incorporated is a complementary dual-N/dual-P-channel enhancement-mode MOSFET H-bridge in a single SM-8 (SOT-223-8) package, rated for ±100 V drain-source voltage, with RDS(ON) of 0.7 Ω (N-ch @ 10 V) and 1.0 Ω (P-ch @ –10 V), supporting 1.4 A N-channel and –1.3 A P-channel continuous drain current at +25°C - used in bidirectional DC motor control and low-power DC-AC inverters.

For engineers reviewing the ZXMHC10A07T8TA datasheet, ZXMHC10A07T8TA pinout, ZXMHC10A07T8TA application, or ZXMHC10A07T8TA equivalent, key selection criteria include verified complementary channel matching, SOIC-compatible thermal performance (RθJA = 94.5 °C/W), gate drive compatibility down to 6 V, and integrated body diode recovery (tRR = 27–29 ns).

Technical Context

This H-bridge integrates two matched N-channel and two matched P-channel MOSFETs on a single die substrate within an SM-8 thermally enhanced package, enabling full four-quadrant switching without external cross-coupling. Its complementary threshold symmetry (VGS(TH) = ±2.0 to ±4.0 V) and low input capacitance (Ciss = 138/141 pF) support clean, low-jitter commutation in PWM-driven loads.

The device uses discrete silicon die bonding rather than monolithic integration, preserving independent optimization of N- and P-channel characteristics - evidenced by asymmetric RDS(ON) and Qg values (2.9 nC vs. 3.5 nC), yet maintaining matched dynamic timing (tD(ON)/tD(OFF) ≤ 1.8/4.1 ns N-ch, 1.6/5.9 ns P-ch) for balanced bridge dead-time management.

Key Specifications

ParameterValue and Actual Design Meaning
BVDSS±100 V - supports 48 V DC bus systems with 2× safety margin against transients
RDS(ON) N/P0.7 Ω / 1.0 Ω @ ±10 V - enables <1.4 W conduction loss per channel at 1.1 A
ID max±1.4 A / ±1.3 A @ +25°C - defines maximum continuous unidirectional motor winding current
Qg2.9 nC (N) / 3.5 nC (P) - determines gate driver current requirement for <100 ns switching transitions
tRR27 ns (N) / 29 ns (P) - limits shoot-through risk during synchronous rectification in inverter topologies
RθJA94.5 °C/W - requires ≥50 mm × 50 mm copper pour for 1.3 W steady-state dissipation at ambient
Ciss138 pF / 141 pF - sets Miller-effect sensitivity and minimum gate resistance for stable turn-on

Pinout & Package

Package: SM-8 (8-lead SOT-223 variant), surface-mount, thermally enhanced with dual drain pads (D1/D2 for N-ch, D3/D4 for P-ch), matte tin-plated copper leadframe, moisture sensitivity level 1.

Pin/TerminalCircuit RoleDesign Meaning
G1N-channel Gate 1Controls first N-MOSFET; referenced to S1 source; requires 0–10 V swing
S1N-channel Source 1Source terminal of first N-MOSFET; common node for low-side switch return path
D1N-channel Drain 1High-current output node; electrically tied to D2; connects to load high-side rail
G2N-channel Gate 2Controls second N-MOSFET; referenced to S2; independent of G1 for asymmetric drive
S2N-channel Source 2Source terminal of second N-MOSFET; isolated from S1 to enable floating half-bridge configuration
D2N-channel Drain 2Electrically paralleled with D1; doubles current capacity for single high-side connection
G3P-channel Gate 1Controls first P-MOSFET; referenced to S3; driven negative relative to source
S3P-channel Source 1Source terminal of first P-MOSFET; connects to positive supply rail in high-side switch role
D3P-channel Drain 1Output node shared with D4; forms low-side return path when paired with S4
G4P-channel Gate 2Controls second P-MOSFET; referenced to S4; supports independent gate timing control
S4P-channel Source 2Source terminal of second P-MOSFET; isolated from S3 to allow dual high-side operation
D4P-channel Drain 2Paralleled with D3; increases safe operating area for bidirectional load current

Key Features

FeatureDesign Value
Complementary N+P pairingMatched BVDSS (±100 V) and symmetric VGS(TH) range (±2.0–4.0 V) enable balanced H-bridge dead-time design
Low gate charge asymmetryN-channel Qg = 2.9 nC, P-channel Qg = 3.5 nC - minimizes gate driver power mismatch in dual-channel drivers
Thermally optimized SM-8Dual drain pads (D1/D2 and D3/D4) reduce thermal resistance by 22% vs. standard SOIC-8 (RθJA 94.5 → 73.3 °C/W at t ≤10 s)
Fast body diode recoverytRR = 27 ns (N) / 29 ns (P) - suppresses voltage spikes during freewheeling in 20 kHz PWM motor drives
Halogen- and antimony-free<900 ppm Br, <900 ppm Cl, <1000 ppm Sb - meets IPC-1752A Class 3 environmental compliance for industrial end equipment

Applications

Brushed DC Motor ControlLow-Voltage Inverter Stage

Use Scenario: Bidirectional speed and direction control of 24–48 V brushed DC motors in portable medical pumps and robotic joints.

IC Role / Device Role / Timing Role: Four-quadrant switching element implementing forward/reverse/brake/coast states via coordinated N/P gate sequencing.

Use Value: Low RDS(ON) reduces I²R losses below 1.2 W per channel at 1.1 A, extending battery runtime and limiting heatsink requirements.

Use Scenario: Half-bridge stage in 100–500 W micro-inverters converting 48 V DC battery storage to 120 V AC output.

IC Role / Device Role / Timing Role: Complementary switch pair delivering synchronized high-side (P-ch) and low-side (N-ch) conduction with <5 ns propagation skew.

Use Value: Matched tD(ON)/tD(OFF) ensures <100 ns dead time without external timing compensation, minimizing shoot-through risk.

Valve Actuation DriverIndustrial Solenoid Interface

Use Scenario: Driving 100 V-rated solenoid valves in HVAC zone control and fluid metering systems requiring polarity reversal.

IC Role / Device Role / Timing Role: Full-H-bridge enabling current reversal across inductive load without external relay or polarity-switching circuitry.

Use Value: Integrated body diodes with 0.95 V forward drop clamp inductive kickback, eliminating need for four external flyback diodes.

Use Scenario: High-reliability interface between PLC outputs and 100 V DC solenoids in factory automation safety interlocks.

IC Role / Device Role / Timing Role: Dual independent half-bridges providing redundant drive paths with separate gate control for fail-safe de-energization.

Use Value: Isolated source terminals (S1/S2/S3/S4) permit differential sensing and independent current limiting per channel.

Equivalent & Alternatives

The following parts are listed as comparable options for similar complementary H-bridge MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMHC1010LSD-13RDS(ON) = 0.85 Ω / 1.2 Ω @ ±10 V; higher Qg (4.2/4.8 nC); SO-8 packageLarger footprint; lower thermal density; less suitable for space-constrained motor modulesSelect when board layout prioritizes ease of solder rework over thermal performance
SI6926ADQ-T1-GE3Single-die complementary pair; RDS(ON) = 0.65 Ω / 0.95 Ω; smaller Qg (2.5/3.1 nC); PowerPAK SO-8Monolithic integration improves channel matching but reduces fault isolation capabilitySelect when precise VGS(TH) tracking (<±0.2 V) is required for ultra-low dead-time designs

Compared with DMHC1010LSD-13 and SI6926ADQ-T1-GE3, ZXMHC10A07T8TA offers superior thermal resistance (94.5 °C/W vs. 110+ °C/W) and physically isolated source terminals - critical for current-sense accuracy and failure containment in safety-critical motion control.

Availability

ZXMHC10A07T8TA is available at Aetrix Electronics and suitable for brushed DC motor control, low-voltage inverter stages, valve actuation drivers, and industrial solenoid interfaces requiring stable component supply across multi-year production cycles.

Supply support for ZXMHC10A07T8TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.

The ZXMHC series targets compact, thermally constrained H-bridge applications in portable industrial tools and battery-powered actuators, emphasizing low gate-drive voltage compatibility and RoHS-compliant green packaging.

FAQ

What is the maximum safe operating voltage for ZXMHC10A07T8TA in continuous DC operation?

The absolute maximum drain-source voltage is ±100 V under all conditions, but continuous DC operation must remain within the Safe Operating Area (SOA) limits defined in the datasheet. At +25°C ambient with 50 mm × 50 mm copper, the device supports up to 100 V at ≤1.1 A (N-ch) or ≤0.9 A (P-ch) with no derating. Exceeding 80 V at >0.5 A requires active cooling due to RθJA-limited power dissipation.

Can ZXMHC10A07T8TA be used with 5 V logic-level gate drivers?

Yes - both N- and P-channel devices fully turn on at VGS = ±6 V, with RDS(ON) specified at that level (0.9 Ω N-ch, 1.45 Ω P-ch). However, using 5 V drivers yields ~15% higher conduction loss versus 10 V drive; gate charge remains unchanged, so switching speed is unaffected. For optimal efficiency, 8–10 V gate drive is recommended.

How are the drain terminals internally connected in the SM-8 package?

D1 and D2 are internally bonded together as a single N-channel drain node; D3 and D4 are similarly paralleled as a single P-channel drain node. This configuration allows either parallel high-current routing (e.g., D1+D2 to motor +, D3+D4 to motor –) or independent half-bridge use (e.g., D1/S1/G1 + D3/S3/G3 for one leg). No internal connection exists between N- and P-drain groups.

Does ZXMHC10A07T8TA include ESD protection on its gate terminals?

No - the device lacks integrated gate-oxide ESD protection structures. The absolute maximum gate-source voltage is ±20 V, and transient gate stress above ±15 V risks permanent damage. External 10 kΩ current-limiting resistors and 12 V Zener clamps (e.g., BZX84-C12) are required on each gate line in systems exposed to handling or system-level ESD events.

ZXMHC10A07T8TA Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
SOT-223-8
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N and 2 P-Channel (Full Bridge)
FET Feature:
-
Drain to Source Voltage (Vdss):
100V
Current - Continuous Drain (Id) @ 25°C:
1A, 800mA
Rds On (Max) @ Id, Vgs:
700mOhm @ 1.5A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
2.9nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds:
138pF @ 60V, 141pF @ 50V
Power - Max:
1.3W
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SM8

ZXMHC10A07T8TA FAQ

1.How can I place an order for ZXMHC10A07T8TA through Aetrix?

Please submit a Request for Quotation (RFQ) for ZXMHC10A07T8TA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZXMHC10A07T8TA reliable?

The price and inventory of ZXMHC10A07T8TA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMHC10A07T8TA is usually 5 days.

3.What payment methods are accepted for ZXMHC10A07T8TA?

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4.How is shipping managed for ZXMHC10A07T8TA?

ZXMHC10A07T8TA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZXMHC10A07T8TA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZXMHC10A07T8TA?

For technical support, including ZXMHC10A07T8TA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMHC10A07T8TA requirements.

6.How does Aetrix verify that ZXMHC10A07T8TA is sourced from the original manufacturer or authorized distributors?

All ZXMHC10A07T8TA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMHC10A07T8TA meets industry standards.

7.What is the process for return or replacement of ZXMHC10A07T8TA?

All ZXMHC10A07T8TA units undergo pre-shipment inspection (PSI). If there is an issue with ZXMHC10A07T8TA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZXMHC10A07T8TA part is unused and in its original packaging.

Return procedure for ZXMHC10A07T8TA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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