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Diodes Incorporated ZXMHC3F381N8TC

Part No.:
ZXMHC3F381N8TC
Manufacturer:
Diodes Incorporated
Category:
FET, MOSFET Arrays
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixZXMHC3F381N8TC.pdf
Description:
MOSFET 2N/2P-CH 30V 3.98A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:95,914

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Product details

Overview

ZXMHC3F381N8TC from Diodes Incorporated is a complementary enhancement-mode MOSFET H-bridge IC in SOIC-8 package, integrating two N-channel (30V, 33mΩ @ 10V) and two P-channel (−30V, 55mΩ @ −10V) devices for bidirectional DC motor control. It supports low-voltage gate drive (4.5V), delivers 5.0A/−4.1A continuous drain current at 25°C, and features integrated body diodes with 12ns/16.5ns reverse recovery.

For engineers reviewing the ZXMHC3F381N8TC datasheet, ZXMHC3F381N8TC pinout, ZXMHC3F381N8TC application, or ZXMHC3F381N8TC equivalent, key selection criteria include verified RDS(on) at 4.5V, dual-channel thermal derating (92–144°C/W RθJA), SOIC-8 layout compatibility, and H-bridge switching timing (td(on)/td(off) ≤ 11.5ns).

Technical Context

This device implements a monolithic H-bridge topology with independent N- and P-channel pairs sharing common source terminals, enabling full four-quadrant motor control without external bootstrap circuitry. Its gate threshold voltages (1.0–3.0V for N-ch, −1.0 to −3.0V for P-ch) support TTL/CMOS-compatible logic-level drive.

The SOIC-8 package integrates thermally optimized drain leads (RθJL = 128–131°C/W) and supports pulsed operation up to 22.9A/−19.6A with D = 0.02 duty cycle. Dynamic parameters-including Qg = 9.0nC (N-ch) and 12.7nC (P-ch), Ciss = 430/670pF-enable high-frequency PWM switching with minimal gate drive loss.

Key Specifications

ParameterValue and Actual Design Meaning
VDSSN-ch: 30V; P-ch: −30V - defines maximum bridge supply voltage before avalanche conduction
RDS(on) @ VGS = 10VN-ch: 33mΩ; P-ch: 55mΩ - determines I²R conduction loss at full gate drive
RDS(on) @ VGS = 4.5VN-ch: 60mΩ; P-ch: 80mΩ - enables direct microcontroller GPIO drive without level-shifting
ID (continuous, 25°C)N-ch: 5.0A; P-ch: −4.1A - sets maximum steady-state motor current per half-bridge leg
QgN-ch: 9.0nC; P-ch: 12.7nC - dictates minimum gate driver current for <100ns switching transitions
tr/tfN-ch: 3.3ns/6.3ns; P-ch: 3.0ns/21ns - constrains minimum PWM period and EMI filtering requirements
Tj range−55°C to +150°C - supports automotive under-hood and industrial ambient environments

Pinout & Package

SOIC-8 package (4.80–5.00 mm width, 3.80–4.00 mm length, 1.35–1.75 mm height) with exposed drain pads for thermal management. Pin 1 marked via notch or dot; standard JEDEC MS-012AC footprint.

Pin/TerminalCircuit RoleDesign Meaning
P1S / P2SP-channel sourceCommon source node for both P-MOSFETs; connects to bridge high-side rail
N1S / N2SN-channel sourceCommon source node for both N-MOSFETs; connects to bridge low-side rail/ground
P1G / P2GP-channel gateIndependent gate inputs for high-side P-MOSFETs; require negative VGS for turn-on
N1G / N2GN-channel gateIndependent gate inputs for low-side N-MOSFETs; driven positive relative to source
P1D/N1DDrain (shared)Output terminal A of H-bridge; connects to one motor terminal
P2D/N2DDrain (shared)Output terminal B of H-bridge; connects to other motor terminal

Key Features

FeatureDesign Value
Complementary N+P pair integrationReduces PCB area by 50% vs discrete half-bridge solutions while matching thermal coupling between channel types
Low 4.5V gate drive capabilityEliminates need for dedicated high-side gate drivers or charge pumps in 5V/3.3V control systems
Matched RDS(on) temperature coefficientEnsures balanced current sharing across N/P legs during thermal transients in motor stall conditions
Body diode with fast trr12ns (N-ch) / 16.5ns (P-ch) reverse recovery enables efficient freewheeling in PWM-driven inductive loads
Thermally enhanced SOIC-8RθJL = 128–131°C/W allows >1W dissipation per die without external heatsinking at 70°C ambient

Applications

Brushed DC Motor ControlDC-AC Inverter Stage

Use Scenario: Bidirectional speed and direction control of 12V/24V brushed DC motors in robotics actuators and power tools.

IC Role / Device Role / Timing Role: Full H-bridge switch delivering PWM-controlled current reversal with <100ns dead-time margin.

Use Value: 33mΩ/55mΩ RDS(on) at 10V reduces conduction loss to <1.7W at 5A, enabling compact thermal design.

Use Scenario: Low-power single-phase inverter driving resistive or lightly inductive AC loads up to 100W.

IC Role / Device Role / Timing Role: Synchronous rectification and polarity reversal stage converting DC bus to square-wave AC output.

Use Value: Matched N/P channel timing (td(on) ≤ 11.5ns) minimizes shoot-through risk during 20kHz switching.

Automotive HVAC BlowerIndustrial Valve Actuation

Use Scenario: Closed-loop fan speed control in vehicle climate systems using PWM feedback from tachometer signal.

IC Role / Device Role / Timing Role: High-side P-ch + low-side N-ch switching pair managing 30V battery-supplied blower motor.

Use Value: −30V VDSS and 150°C Tj rating ensure reliability across automotive load-dump and cold-crank conditions.

Use Scenario: Precision on/off control of solenoid valves in programmable logic controller (PLC) I/O modules.

IC Role / Device Role / Timing Role: Solid-state replacement for electromechanical relays, providing zero-crossing-free switching with <1µs jitter.

Use Value: Integrated body diodes eliminate need for external flyback protection, reducing BOM count by 4 components per channel.

Equivalent & Alternatives

The following parts are listed as comparable options for similar H-bridge MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Si7850DP-T1-GE3Single-package dual-N-channel only; no integrated P-ch; requires external high-side driverLimited to low-side switching or half-bridge with external level shift; no true bidirectional controlSelect when only N-ch drive is needed and board space allows separate high-side solution
DMHC3025LSD-13Complementary pair in PowerDI3333 package; higher RDS(on) (40mΩ/65mΩ @ 10V); different pinoutThermal performance inferior (RθJA = 160°C/W); unsuitable for sustained >3A operationSelect only for cost-sensitive, lower-current (<3A) applications where SOIC-8 footprint is not required

Compared with Si7850DP-T1-GE3 and DMHC3025LSD-13, ZXMHC3F381N8TC uniquely delivers fully integrated complementary H-bridge functionality in SOIC-8 with verified 4.5V drive and matched thermal resistance-enabling compact, self-contained motor control without auxiliary circuitry.

Availability

ZXMHC3F381N8TC is available at Aetrix Electronics and suitable for brushed DC motor control, DC-AC inverter stages, and automotive HVAC blower systems requiring stable component supply and long-term industrial lifecycle support.

Supply support for ZXMHC3F381N8TC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management and signal integrity solutions for industrial and automotive markets.

The ZXMHC3F381N8TC belongs to Diodes' complementary MOSFET H-bridge product line, designed specifically for space-constrained, low-voltage motor control applications requiring integrated N+P channel switching without external gate drive complexity.

FAQ

What is the maximum safe operating voltage for ZXMHC3F381N8TC in an H-bridge configuration?

The absolute maximum drain-source voltage is ±30V for both N- and P-channel devices. In H-bridge use, the total supply voltage must not exceed 30V to prevent avalanche breakdown in either channel during switching transients or shoot-through events. Derating to 24V is recommended for robust 125°C junction operation.

Can ZXMHC3F381N8TC be driven directly by a 3.3V microcontroller GPIO?

Yes-both N- and P-channel gates are specified for full enhancement at VGS = 4.5V, and VGS(th) ranges (1.0–3.0V for N-ch, −1.0 to −3.0V for P-ch) ensure reliable turn-on with 3.3V logic. However, RDS(on) increases to 60mΩ/80mΩ, limiting continuous current to 3.9A/−3.3A at 25°C.

How is thermal management handled given the SOIC-8 package?

The SOIC-8 uses thermally enhanced drain leads with RθJL = 128–131°C/W. For 1W per die, a 25mm × 25mm 1oz copper pad reduces RθJA to 92°C/W. Layout must connect all four drain pins (P1D/N1D, P2D/N2D) to a common internal copper pour, avoiding isolation gaps.

Does ZXMHC3F381N8TC include internal gate resistors or ESD protection?

No-this device contains no integrated gate series resistors or input ESD clamps. External 10Ω gate resistors are required to damp ringing and limit peak gate current. Input pins must be protected with TVS diodes rated for ±20V if exposed to system-level ESD per IEC 61000-4-2 Level 4.

ZXMHC3F381N8TC Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 N and 2 P-Channel (Full Bridge)
FET Feature:
Logic Level Gate
Drain to Source Voltage (Vdss):
30V
Current - Continuous Drain (Id) @ 25°C:
3.98A, 3.36A
Rds On (Max) @ Id, Vgs:
33mOhm @ 5A, 10V
Vgs(th) (Max) @ Id:
3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
9nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds:
430pF @ 15V, 670pF @ 15V
Power - Max:
870mW
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

ZXMHC3F381N8TC FAQ

1.How can I place an order for ZXMHC3F381N8TC through Aetrix?

Please submit a Request for Quotation (RFQ) for ZXMHC3F381N8TC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZXMHC3F381N8TC reliable?

The price and inventory of ZXMHC3F381N8TC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMHC3F381N8TC is usually 5 days.

3.What payment methods are accepted for ZXMHC3F381N8TC?

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4.How is shipping managed for ZXMHC3F381N8TC?

ZXMHC3F381N8TC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZXMHC3F381N8TC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZXMHC3F381N8TC?

For technical support, including ZXMHC3F381N8TC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMHC3F381N8TC requirements.

6.How does Aetrix verify that ZXMHC3F381N8TC is sourced from the original manufacturer or authorized distributors?

All ZXMHC3F381N8TC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMHC3F381N8TC meets industry standards.

7.What is the process for return or replacement of ZXMHC3F381N8TC?

All ZXMHC3F381N8TC units undergo pre-shipment inspection (PSI). If there is an issue with ZXMHC3F381N8TC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZXMHC3F381N8TC part is unused and in its original packaging.

Return procedure for ZXMHC3F381N8TC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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