Diodes Incorporated ZXMN2A02N8TA

Overview

ZXMN2A02N8TA from Diodes Incorporated (formerly Zetex Semiconductors) is a 20V N-channel enhancement-mode Trench MOSFET in SOIC-8 package, optimized for low-voltage power switching with R_DS(on) = 20 mΩ at V_GS = 4.5 V and I_D = 11 A. It delivers fast switching (t_r = 10 ns, Q_g = 18.9 nC), low gate threshold (V_GS(th) = 0.7 V), and integrated body diode (V_SD = 0.85 V), enabling high-efficiency motor control and load disconnect circuits.

For engineers reviewing the ZXMN2A02N8TA datasheet, ZXMN2A02N8TA pinout, ZXMN2A02N8TA application, or ZXMN2A02N8TA equivalent, key selection criteria include its 20 mΩ on-resistance at 4.5 V gate drive, SOIC-8 thermal performance (R_θJA = 50 °C/W with PCB copper), 50 A pulsed drain rating, and suitability for 3.3 V/5 V logic-level gate interfacing in compact DC-DC and battery-powered systems.

Technical Context

This MOSFET employs Zetex's proprietary Trench structure to simultaneously minimize conduction loss and switching loss-achieving R_DS(on) = 20 mΩ and C_iss = 1900 pF at V_DS = 10 V. Its low V_GS(th) (0.7 V typ.) ensures reliable turn-on with 3.3 V microcontroller outputs.

The device integrates a robust body diode with t_rr = 16.3 ns and Q_rr = 7.8 nC, supporting synchronous rectification and bidirectional current handling in H-bridge motor drivers without external diodes.

Key Specifications

Pinout & Package

Package: SOIC-8 (standard 1.27 mm pitch, 5.0 mm × 4.0 mm footprint, 1.75 mm max height). Pin 1 marked by notch or dot; pins numbered counterclockwise from top-left corner when viewed top-down.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.

Compared with DMN2020LSD-13 and SI2302DS-T1-GE3, ZXMN2A02N8TA offers the best balance of low R_DS(on), high current capability (8.2 A), and SOIC-8 thermal performance-making it optimal for medium-power motor and load-switch designs requiring reliability and manufacturability.

Availability

ZXMN2A02N8TA is available at Aetrix Electronics and suitable for brushed DC motor control, battery-powered load switching, USB-C power delivery sink stages, and industrial PLC output modules requiring stable component supply and long-term production continuity.

Supply support for ZXMN2A02N8TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Zetex Semiconductors in 2008 and maintains its legacy of high-performance analog and discrete semiconductors, certified to ISO 9001 and IATF 16949 standards.

ZXMN2A02N8TA belongs to Zetex's TrenchMOS® logic-level power MOSFET product line, engineered specifically for high-efficiency, low-voltage DC-DC conversion, motor drive, and load management in portable, industrial, and automotive-qualified systems.

FAQ

Is ZXMN2A02N8TA suitable for 3.3 V microcontroller gate drive?

Yes. With a typical gate threshold voltage of 0.7 V and guaranteed turn-on at V_GS ≥ 2.5 V, ZXMN2A02N8TA fully enhances using standard 3.3 V GPIO outputs. Its 18.9 nC total gate charge ensures fast switching without requiring external gate drivers in most low-to-medium frequency applications.

What is the maximum continuous drain current at 85 °C ambient?

At T_A = 85 °C, the device supports approximately 6.5 A continuous drain current. This is derived from the 50 °C/W thermal resistance and 150 °C maximum junction temperature: P_D = (150 − 85) / 50 = 1.3 W; I_D = √(P_D / R_DS(on)) = √(1.3 / 0.02) ≈ 6.5 A, assuming worst-case R_DS(on) = 20 mΩ.

Does ZXMN2A02N8TA have avalanche rating?

No. The datasheet does not specify unclamped inductive switching (UIS) or single-pulse avalanche energy rating. Designers must implement external clamping (e.g., TVS or RC snubber) when switching inductive loads to prevent voltage overshoot beyond the 20 V V_DSS limit.

Can the SOIC-8 package be hand-soldered reliably?

Yes. The SOIC-8 footprint is compatible with standard reflow profiles and manual soldering using fine-tip irons and flux. Key considerations include preheating the board to avoid thermal shock, limiting iron dwell time per pad to <3 seconds, and verifying solder joint integrity with magnification due to the four-source/four-drain internal paralleling structure.