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Diodes Incorporated ZXMN3A02X8TC

Part No.:
ZXMN3A02X8TC
Manufacturer:
Diodes Incorporated
Category:
FETs, MOSFETs
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixZXMN3A02X8TC.pdf
Description:
MOSFET N-CH 30V 5.3A 8MSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,204

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Product details

Overview

ZXMN3A02X8TC from Diodes Incorporated (formerly Zetex) is a 30V N-channel enhancement-mode Trench MOSFET in low-profile SOIC-8 package, with RDS(on) = 0.025 Ω @ VGS = 10 V, ID = 12 A, and fast switching (td(off) = 35 ns). It serves as a high-efficiency synchronous rectifier or load switch in DC–DC converters operating below 30 V.

For engineers reviewing the ZXMN3A02X8TC datasheet, ZXMN3A02X8TC pinout, ZXMN3A02X8TC application, or ZXMN3A02X8TC equivalent, key selection criteria include its 0.025 Ω on-resistance at 10 V gate drive, 6.7 A continuous drain current at 25°C ambient, body diode reverse recovery time of 17 ns, and SOIC-8 thermal resistance (RθJA = 70°C/W with FR4 PCB).

Technical Context

This MOSFET employs Zetex's proprietary Trench structure to simultaneously minimize conduction loss and switching loss-enabling high-frequency operation up to 1 MHz in buck converters. Its low 1 V gate threshold voltage supports 3.3 V logic-level drive, while the integrated body diode exhibits controlled Qrr = 8.3 nC and trr = 17 ns for reduced shoot-through risk.

The device is characterized for surface-mount use on single-sided 1 oz copper FR4 (25 mm × 25 mm), with two thermal ratings: RθJA = 70°C/W (measured at t = 10 s) and 113°C/W (steady-state). Its 0.035 Ω RDS(on) at VGS = 4.5 V confirms compatibility with 5 V microcontroller outputs.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30 V - Maximum blocking voltage for 24 V input rail applications with margin
RDS(on) @ VGS=10 V0.025 Ω - Enables ≤1.6 W conduction loss at 8 A DC load
ID (continuous, TA=25°C)6.7 A - Sustains typical output current of 12 V → 5 V/3 A buck converter with margin
td(off)35 ns - Supports ≥2 MHz switching frequency before turn-off delay dominates timing budget
Qg @ VGS=10 V26.8 nC - Requires ≤0.5 µs gate drive time with 50 Ω driver for full enhancement
VGS(th)1 V (min) - Fully enhances with standard 3.3 V GPIO without level-shifting
trr17 ns - Limits reverse recovery energy to <100 nJ in synchronous rectification

Pinout & Package

Package: SOIC-8 (3.9 mm × 4.9 mm × 1.5 mm), surface-mount, low-profile outline per Zetex drawing (Issue 1, Jan 2002). Pin 1 marked by notch or dot; leads are gull-wing, 0.65 mm pitch.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3, 4, 5, 6, 7, 8Drain (D), Source (S), Gate (G) - pins 1–3: S; pins 4–5: G; pins 6–8: D (internal paralleled)SOIC-8 layout uses multi-pin paralleling: 6× Drain (pins 6–8 + internal die connection), 3× Source (pins 1–3), 2× Gate (pins 4–5) - reduces package inductance and RDS(on) contribution

Key Features

FeatureDesign Value
Low RDS(on) at 4.5 V0.035 Ω - enables direct drive from 5 V microcontrollers without gate boosters
Fast tr/tf5.5 ns / 7.6 ns - minimizes overlap conduction loss in synchronous buck topologies
Controlled body diode Qrr8.3 nC - reduces EMI and cross-conduction during dead-time in half-bridge configurations
Low-profile SOIC-81.5 mm max height - fits under 2 mm board-to-board connectors in space-constrained power modules

Applications

DC–DC Buck ConverterHot-Swap Controller

Use Scenario: 24 V input to 5 V/3 A output in industrial PLC I/O module.

IC Role / Device Role: Synchronous rectifier (low-side switch) replacing Schottky diode.

Use Value: Reduces conduction loss by 65% vs. 40 V/3 A Schottky, improving efficiency from 87% to 92% at full load.

Use Scenario: 12 V backplane protection in telecom shelf with hot-plug insertion.

IC Role / Device Role: Inrush-limiting load switch with controlled turn-on via gate resistor.

Use Value: Limits peak inrush current to <1.5 A using 10 kΩ gate resistor, preventing bus droop and contact arcing.

Motor Driver H-BridgeUSB-C Power Delivery Switch

Use Scenario: 24 V brushed DC motor control in battery-powered robotic arm.

IC Role / Device Role: Low-side switch in dual H-bridge half-bridge leg.

Use Value: 17 ns body diode trr prevents shoot-through during PWM commutation at 20 kHz.

Use Scenario: 20 V/3 A USB-C PD port power path in portable monitor dock.

IC Role / Device Role: Reverse-polarity and overcurrent protected main power switch.

Use Value: 30 V VDSS withstands 20 V PD transient surges; 6.7 A ID supports 60 W delivery with derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN3025LSD-13RDS(on) = 0.023 Ω @ 10 V, but SO-8 package has higher RθJA = 75°C/WSlightly lower conduction loss, but less thermal headroom in compact layoutsPrefer when gate drive is robust and board area allows extra copper pour
SI2302DS-T1-GE3RDS(on) = 0.055 Ω @ 4.5 V, SOT-23 package, ID = 2.6 ALower cost and smaller footprint, but insufficient current for >2 A loadsSelect only for space-limited, sub-2 A auxiliary rails

Compared with DMN3025LSD-13 and SI2302DS-T1-GE3, ZXMN3A02X8TC delivers optimal balance of low RDS(on), proven SOIC-8 thermal performance, and 6.7 A capability-making it preferred for mid-power DC–DC and load-switch designs where reliability and thermal margin are critical.

Availability

ZXMN3A02X8TC is available at Aetrix Electronics and suitable for DC–DC converters, hot-swap controllers, motor drivers, and USB-C power delivery systems requiring stable component supply across production lifecycles.

Supply support for ZXMN3A02X8TC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Zetex Semiconductors in 2008 and maintains its high-performance analog and power portfolio, emphasizing precision, efficiency, and reliability in discrete semiconductors.

ZXMN3A02X8TC belongs to Zetex's TrenchMOS® power MOSFET family, engineered specifically for high-efficiency, low-voltage power conversion in space-constrained industrial and computing applications.

FAQ

What is the maximum continuous drain current at 70°C ambient temperature?

The ZXMN3A02X8TC supports 5.4 A continuous drain current at TA = 70°C with VGS = 10 V, based on its 1.8 W power dissipation rating and 70°C/W junction-to-ambient thermal resistance. This reflects real-world derating on standard FR4 PCBs without heatsinks.

Does this MOSFET require a gate resistor for stability in switching applications?

Yes-a 10 Ω to 47 Ω series gate resistor is recommended to dampen ringing caused by gate-drain capacitance (Crss = 120 pF) and PCB trace inductance. Without it, overshoot exceeding VGS(max) = 20 V may occur during fast edge transitions.

Can ZXMN3A02X8TC be used in linear regulator applications?

No-it is not characterized or rated for linear (ohmic) operation. Its Safe Operating Area (SOA) is not specified beyond pulsed conditions, and sustained operation in the linear region risks thermal runaway due to positive temperature coefficient of RDS(on).

Is the body diode suitable for reverse polarity protection?

Yes-the integrated body diode has VSD = 0.95 V at 9 A and trr = 17 ns, making it effective for low-loss reverse polarity protection in 12–24 V systems when placed anode-to-input. However, external Schottky is preferred if forward drop must be <0.4 V.

ZXMN3A02X8TC Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
5.3A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
25mOhm @ 12A, 10V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
26.8 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1400 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
1.1W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-MSOP

ZXMN3A02X8TC FAQ

1.How can I place an order for ZXMN3A02X8TC through Aetrix?

Please submit a Request for Quotation (RFQ) for ZXMN3A02X8TC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZXMN3A02X8TC reliable?

The price and inventory of ZXMN3A02X8TC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMN3A02X8TC is usually 5 days.

3.What payment methods are accepted for ZXMN3A02X8TC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMN3A02X8TC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ZXMN3A02X8TC?

ZXMN3A02X8TC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZXMN3A02X8TC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZXMN3A02X8TC?

For technical support, including ZXMN3A02X8TC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMN3A02X8TC requirements.

6.How does Aetrix verify that ZXMN3A02X8TC is sourced from the original manufacturer or authorized distributors?

All ZXMN3A02X8TC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMN3A02X8TC meets industry standards.

7.What is the process for return or replacement of ZXMN3A02X8TC?

All ZXMN3A02X8TC units undergo pre-shipment inspection (PSI). If there is an issue with ZXMN3A02X8TC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZXMN3A02X8TC part is unused and in its original packaging.

Return procedure for ZXMN3A02X8TC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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