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Diodes Incorporated ZXMN3A03E6TC
- Part No.:
- ZXMN3A03E6TC
- Manufacturer:
- Diodes Incorporated
- Category:
- FETs, MOSFETs
- Package:
- SOT-23-6
- Datasheet:
-
ZXMN3A03E6TC.pdf
- Description:
- MOSFET N-CH 30V 3.7A SOT23-6
- Quantity:
- Payment:
- Shipping:
Inventory:4,088
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Product details
Overview
ZXMN3A03E6TC from Diodes Incorporated is a 30V N-channel enhancement-mode Trench MOSFET in SOT26 package, delivering 4.6A continuous drain current at 25°C, 0.050Ω RDS(ON) @ VGS = 10V, and fast switching (tr = 6.4ns, tf = 11.2ns). It serves as a low-voltage power switch in DC-DC converters and motor control circuits.
For engineers reviewing the ZXMN3A03E6TC datasheet, ZXMN3A03E6TC pinout, ZXMN3A03E6TC application, or ZXMN3A03E6TC equivalent, key selection criteria include its low gate threshold (1V), low gate charge (12.6nC @ 10V), body diode forward voltage (0.85–0.95V), thermal resistance (73°C/W), and SOT26 surface-mount compatibility with high-density PCB layouts.
Technical Context
This MOSFET employs Diodes Incorporated's proprietary Trench process to achieve simultaneous low on-resistance and fast switching-enabled by optimized cell pitch and reduced gate-drain capacitance (Crss = 58.5pF). Its 1V gate threshold supports direct logic-level drive from 3.3V microcontrollers.
The device integrates a robust body diode with 14.1nC reverse recovery charge and 18.8ns trr, enabling efficient synchronous rectification and bidirectional current handling in buck converters and H-bridge motor drivers without external freewheeling diodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30V - maximum blocking voltage for 5V/12V rail applications |
| RDS(ON) | 0.050Ω @ VGS = 10V - enables <120mW conduction loss at 4.6A |
| ID (continuous) | 4.6A @ TA = 25°C - suitable for compact 5–12V power stages up to ~15W |
| Qg | 12.6nC @ VGS = 10V - reduces gate driver power and switching transition time |
| tr/tf | 6.4ns / 11.2ns - supports >1MHz PWM operation with minimal overlap loss |
| VGS(th) | 1V min - ensures turn-on with 3.3V GPIO without level-shifting |
| Ciss | 600pF - limits Miller-induced shoot-through risk in half-bridge configurations |
Pinout & Package
SOT26 (6-pin SC-74) package: compact 3.0 × 1.6 × 1.1 mm surface-mount outline with exposed drain pad for thermal relief; RoHS-compliant matte tin finish over copper leadframe.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control terminal; low 12.6nC total charge enables efficient 3.3V/5V drive |
| 2 (S) | Source | Reference node for gate drive; tied to power ground in low-side switch topology |
| 3 (D) | Drain | High-current output path; internally connected to exposed pad for thermal conduction |
| 4 (S) | Source (redundant) | Second source bond wire; lowers source inductance and improves current sharing |
| 5 (D) | Drain (redundant) | Second drain bond wire; enhances current capacity and thermal spreading |
| 6 (G) | Gate (redundant) | Second gate bond wire; reduces gate loop inductance for stable high-speed switching |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(ON) + fast switching | Enables >95% efficiency in 12V input buck converters at 1–2MHz |
| Logic-level gate threshold | Operates directly from 3.3V MCU I/O without external level shifter |
| Low Qgd/Qgs ratio | 2.0nC/2.0nC minimizes Miller plateau duration and dv/dt-induced false turn-on |
| Integrated body diode | 14.1nC Qrr, 18.8ns trr supports synchronous rectification in buck topologies |
| Green packaging | Halogen- and antimony-free, <900ppm Br+Cl, fully RoHS 2 compliant |
Applications
| DC-DC Buck Converter | USB Power Delivery Switch |
|---|---|
Use Scenario: Step-down regulation from 12V to 5V/3.3V in portable industrial controllers. IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET in fixed-frequency 500kHz buck stage. Use Value: 0.050Ω RDS(ON) cuts conduction loss by 40% vs. comparable 0.085Ω parts; 12.6nC Qg enables clean 500kHz transitions. | Use Scenario: Input power path control for USB-C PD ports with 20V max input. IC Role / Device Role / Timing Role: Hot-swap protection switch with fast turn-off (<20ns fall time) during overcurrent events. Use Value: 30V VDSS and 17A pulsed rating handle USB PD fault currents; 1V VGS(th) allows direct enable from PD controller GPIO. |
| H-Bridge Motor Driver | Load Disconnect Switch |
Use Scenario: 12V brushed DC motor control in battery-powered robotics. IC Role / Device Role / Timing Role: High-current quadrant switch in dual half-bridge configuration with PWM speed control. Use Value: Dual drain/source pins reduce bond-wire inductance, suppressing voltage spikes during 10A transient commutation. | Use Scenario: Controlled power sequencing for FPGA core rails in telecom baseband cards. IC Role / Device Role / Timing Role: Soft-start and inrush-limited load switch between PMIC output and downstream logic. Use Value: 4.6A continuous rating and 73°C/W θJA support 1.1W dissipation without heatsink in 25mm² copper area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3025LSD-13 | RDS(ON) = 0.025Ω @ 10V (lower), but SOT23-6 package has higher θJA (100°C/W) | Better conduction loss, but limited to ≤3A continuous due to thermal constraints | Select when peak efficiency at <3A matters more than thermal headroom |
| SI2302DS-T1-GE3 | VGS(th) = 0.6–1.2V (wider spread), RDS(ON) = 0.075Ω @ 4.5V (higher) | Looser threshold tolerance increases risk of partial turn-on in noise-prone environments | Prefer only if cost sensitivity outweighs gate drive margin and RDS(ON) consistency |
Compared with DMN3025LSD-13 and SI2302DS-T1-GE3, ZXMN3A03E6TC delivers balanced performance: tighter VGS(th) distribution, lower Ciss, and superior thermal derating (13.6mW/°C) make it optimal for sustained 4–5A operation in space-constrained 12V systems.
Availability
ZXMN3A03E6TC is available at Aetrix Electronics and suitable for DC-DC converters, USB power delivery switches, H-bridge motor drivers, and load disconnect circuits requiring stable component supply across production lifecycles.
Supply support for ZXMN3A03E6TC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the Americas.
ZXMN3A03E6TC belongs to Diodes' Zetex Trench MOSFET product line, engineered specifically for high-efficiency, low-voltage power management in space-constrained consumer, industrial, and computing applications.
FAQ
What is the maximum continuous drain current for ZXMN3A03E6TC at 70°C ambient?
The maximum continuous drain current is 3.7A at TA = +70°C under the test condition specified in Note 6 of the datasheet (surface mount on FR-4 PCB, t ≤ 10 seconds). This reflects thermal derating from the 4.6A rating at 25°C, based on a linear derating factor of 13.6 mW/°C and 1.7W power dissipation limit.
Does ZXMN3A03E6TC have an integrated body diode, and what are its key parameters?
Yes, ZXMN3A03E6TC includes an intrinsic body diode with forward voltage VSD = 0.85–0.95V at IS = 3.2A and TJ = 25°C. Its reverse recovery characteristics are trr = 18.8ns and Qrr = 14.1nC under IF = 3.5A, di/dt = 100A/μs conditions-enabling use in synchronous rectification without external diodes.
Can ZXMN3A03E6TC be driven directly by a 3.3V microcontroller GPIO?
Yes. With a minimum gate threshold voltage of 1V and typical RDS(ON) = 0.065Ω at VGS = 4.5V, the device achieves full enhancement using standard 3.3V logic outputs. Gate charge is only 12.6nC at 10V, so even at 3.3V drive, turn-on delay remains sub-10ns with appropriate gate resistor selection.
What is the moisture sensitivity level (MSL) and reflow profile compliance for ZXMN3A03E6TC?
ZXMN3A03E6TC has Moisture Sensitivity Level 1 per J-STD-020, meaning it is not moisture-sensitive and may be stored indefinitely at ≤30°C/60% RH without dry-pack requirements. It is compatible with standard Pb-free reflow profiles (peak temperature ≤260°C, 20–40 sec above 217°C), per its matte tin annealed leadframe and green molding compound.
ZXMN3A03E6TC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- SOT-23-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 3.7A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 50mOhm @ 7.8A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 12.6 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 600 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.1W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-6
ZXMN3A03E6TC FAQ
1.How can I place an order for ZXMN3A03E6TC through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXMN3A03E6TC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXMN3A03E6TC reliable?
The price and inventory of ZXMN3A03E6TC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMN3A03E6TC is usually 5 days.
3.What payment methods are accepted for ZXMN3A03E6TC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMN3A03E6TC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXMN3A03E6TC?
ZXMN3A03E6TC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXMN3A03E6TC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXMN3A03E6TC?
For technical support, including ZXMN3A03E6TC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMN3A03E6TC requirements.
6.How does Aetrix verify that ZXMN3A03E6TC is sourced from the original manufacturer or authorized distributors?
All ZXMN3A03E6TC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMN3A03E6TC meets industry standards.
7.What is the process for return or replacement of ZXMN3A03E6TC?
All ZXMN3A03E6TC units undergo pre-shipment inspection (PSI). If there is an issue with ZXMN3A03E6TC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXMN3A03E6TC part is unused and in its original packaging.
Return procedure for ZXMN3A03E6TC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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