Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Diodes Incorporated ZXMN3B01FTC

Name: ZXMN3B01FTC
Brand: Diodes Incorporated
SKU: ZXMN3B01FTC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: ZXMN3B01FTC

Manufacturer:: Diodes Incorporated

Category:: FETs, MOSFETs

Package:: TO-236-3, SC-59, SOT-23-3

Datasheet:: ZXMN3B01FTC.pdf

Description:: MOSFET N-CH 30V 1.7A SOT23

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,249

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

ZXMN3B01FTC from Diodes Incorporated (formerly Zetex Semiconductors) is a 30V N-channel enhancement-mode Trench MOSFET in SOT-23 package, rated for 2.0A continuous drain current at V_GS=4.5V, with R_DS(on) = 0.150Ω (typ), V_GS(th) = 0.7V, and fast switching (t_d(on) = 2.69ns, Q_g = 2.93nC), used in low-voltage DC-DC converter power stages.

For engineers reviewing the ZXMN3B01FTC datasheet, ZXMN3B01FTC pinout, ZXMN3B01FTC application, or ZXMN3B01FTC equivalent, key selection criteria include gate threshold voltage compatibility with 2.5V–4.5V logic-level drivers, thermal performance on FR4 PCBs (R_JA = 155°C/W), body diode recovery (t_rr = 10.85ns), and SOT-23 footprint constraints in space-constrained power management designs.

Technical Context

This MOSFET employs a trench-gate structure optimized for low R_DS(on) and high transconductance (g_fs = 4S at V_DS = 15V, I_D = 1.7A), enabling efficient operation in synchronous buck converters and load switches where conduction loss and gate drive energy are critical.

Its 2.5V gate drive capability supports direct interfacing with low-voltage microcontrollers and PMIC outputs; dynamic parameters-including C_iss = 258pF, C_oss = 50pF, and Q_gd/Q_gs ratio of ~1.6-indicate strong immunity to Miller-induced shoot-through in high-frequency switching topologies.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DSS	30V - Maximum blocking voltage compatible with 24V rail and 12V automotive systems.
R_DS(on)	0.150Ω @ V_GS=4.5V, I_D=1.7A - Enables <150mW conduction loss at 1.7A, critical for thermally constrained SOT-23 layouts.
I_D (cont)	2.0A @ T_A=25°C, V_GS=4.5V - Supports medium-current load switching without external heatsinking on standard PCBs.
V_GS(th)	0.7V (min), 1.0V (typ) - Ensures reliable turn-on with 1.8V/2.5V logic families and low-power controllers.
Q_g	2.93nC @ V_DS=15V, V_GS=4.5V - Low gate charge reduces driver power loss and enables >1MHz PWM operation with minimal gate drive strength.
t_rr	10.85ns @ I_F=1.3A, di/dt=100A/μs - Fast body diode recovery minimizes reverse recovery loss in non-synchronous flyback or buck-boost converters.
P_D	806mW @ T_A=25°C (R_JA=155°C/W) - Defines maximum steady-state power dissipation before junction exceeds 150°C on typical FR4 layout.

Pinout & Package

SOT-23 package: surface-mount, 3-pin plastic case with gull-wing leads; standardized footprint per JEDEC TO-236AB; thermal pad not present; mounting requires solder reflow profile compatible with 260°C peak.

Pin/Terminal	Circuit Role	Design Meaning
1 (Source)	Current return path for channel conduction and body diode anode	Connected to ground or low-side reference; must handle full load current and body diode reverse recovery stress.
2 (Gate)	Control electrode for channel inversion	High-impedance input requiring low-capacitance routing; sensitive to noise coupling due to C_iss=258pF and low V_GS(th).
3 (Drain)	Main current output terminal and body diode cathode	Connected to switched node (e.g., buck converter inductor); exposed copper area improves thermal transfer but adds parasitic capacitance.

Key Features

Feature	Design Value
Trench-gate architecture	Delivers 0.150Ω R_DS(on) in SOT-23, enabling higher efficiency than planar MOSFETs of same size at 1–2A loads.
2.5V logic-compatible gate drive	Guaranteed turn-on with 2.5V CMOS outputs, eliminating need for level-shifting in battery-powered microcontroller interfaces.
Low Q_gd/Q_g ratio (0.31)	Reduces risk of false turn-on during high dv/dt events, improving reliability in hard-switching applications like motor gate drivers.
Fast body diode (t_rr = 10.85ns)	Minimizes energy loss and voltage overshoot during freewheeling in non-synchronous topologies without external Schottky.
JEDEC-standard SOT-23 footprint	Enables drop-in replacement in existing designs using industry-common pick-and-place and reflow processes.

Applications

DC-DC Buck Converters

Load Disconnect Switches

Use Scenario: High-efficiency 5V-to-3.3V point-of-load regulator in portable instrumentation with 1.5A output.

IC Role / Device Role: Low-side synchronous rectifier in buck topology, replacing Schottky diode to reduce conduction loss.

Use Value: 0.150Ω R_DS(on) cuts conduction loss by >60% vs. 0.4Ω Schottky, extending battery life and reducing thermal load on PCB.

Use Scenario: Controlled power-up sequencing for FPGA core supply in industrial control module.

IC Role / Device Role: High-side or low-side load switch enabling software-controlled power gating.

Use Value: 0.7V V_GS(th) ensures clean turn-on with 1.8V GPIO, while 2.0A rating supports inrush-limited 1.2V/1.5A rails.

Motor Driver Half-Bridge Legs

USB Power Delivery Load Switches

Use Scenario: Low-voltage brushed DC motor driver (≤12V) in robotics actuator with PWM speed control.

IC Role / Device Role: Low-side switch in H-bridge configuration, handling bidirectional current via body diode freewheeling.

Use Value: 10.85ns t_rr prevents cross-conduction losses during direction reversal, maintaining >92% efficiency at 20kHz PWM.

Use Scenario: Overcurrent-protected 5V USB port power switch in smart hub with hot-plug detection.

IC Role / Device Role: Current-limiting pass element with integrated thermal shutdown and fast fault response.

Use Value: 806mW P_D and -55°C to +150°C T_j range support sustained 1.5A operation under ambient temperature cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
DMN2004LK-7	R_DS(on) = 0.125Ω @ V_GS=4.5V; higher I_D = 2.8A; slightly larger C_iss = 290pF	Better conduction efficiency at >2A loads; marginally slower switching due to higher input capacitance	Preferred when board space allows SOT-23-3 with tighter R_DS(on) tolerance and higher current headroom.
AO3400	R_DS(on) = 0.042Ω @ V_GS=10V but 0.055Ω @ V_GS=4.5V; V_GS(th) = 1.0V (min); Q_g = 7.5nC	Requires stronger gate drive for full enhancement; higher gate charge increases driver loss at high frequency	Choose only if system uses 5V logic and prioritizes ultra-low R_DS(on) over gate drive simplicity and switching speed.

Compared with DMN2004LK-7 and AO3400, ZXMN3B01FTC offers the best balance of low gate threshold (0.7V), moderate gate charge (2.93nC), and proven thermal performance in SOT-23-making it optimal for 2.5V–4.5V-driven, space-constrained, medium-current power switches where driver simplicity and EMI control are critical.

Availability

ZXMN3B01FTC is available at Aetrix Electronics and suitable for DC-DC converters, load disconnect switches, and motor control circuits requiring stable component supply across industrial, medical, and consumer electronics production programs.

Supply support for ZXMN3B01FTC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Zetex Semiconductors in 2008 and maintains its legacy of high-performance analog and discrete semiconductors with focus on power efficiency and signal integrity.

ZXMN3B01FTC belongs to Zetex's TrenchMOS® logic-level N-channel portfolio, engineered specifically for compact, high-frequency power management in battery-operated and low-voltage embedded systems.

FAQ

What is the maximum safe operating junction temperature for ZXMN3B01FTC?

The absolute maximum junction temperature is +150°C, and the device is rated for continuous operation across –55°C to +150°C. Derating begins at 25°C ambient with a linear factor of 6.4 mW/°C when mounted on FR4 PCB per specification (b), ensuring safe thermal margin up to 125°C ambient at reduced power.

Can ZXMN3B01FTC be used in a high-side switch configuration?

Yes, but only with appropriate gate drive circuitry that provides V_GS ≥ 4.5V relative to the source node. Since it is an N-channel device, high-side use requires a charge pump or bootstrap gate driver to elevate the gate voltage above the drain rail-unlike P-channel alternatives which simplify high-side implementation.

Does ZXMN3B01FTC have built-in ESD protection?

No. The datasheet does not specify on-chip ESD protection structures. Standard handling precautions (IEC 61000-4-2 Level 2 or higher) are required during assembly; external TVS or RC filtering is recommended on gate and drain lines in noisy environments to prevent latch-up or oxide damage.

Is the SOT-23 package lead-free and RoHS compliant?

Yes. ZXMN3B01FTC is manufactured in accordance with Diodes Incorporated's RoHS-compliant process and carries lead-free (Pb-free) terminations. The device meets JEDEC J-STD-020 moisture sensitivity level (MSL) 1 and is qualified for standard SnPb and Pb-free reflow profiles up to 260°C peak.

ZXMN3B01FTC Specifications

Product attributes: Attribute value

Manufacturer:: Diodes Incorporated

Series:: -

Package/Case:: TO-236-3, SC-59, SOT-23-3

Packaging:: Tape & Reel (TR)

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 30 V

Current - Continuous Drain (Id) @ 25°C:: 1.7A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 2.5V, 4.5V

Rds On (Max) @ Id, Vgs:: 150mOhm @ 1.7A, 4.5V

Vgs(th) (Max) @ Id:: 700mV @ 250µA (Min)

Gate Charge (Qg) (Max) @ Vgs:: 2.93 nC @ 4.5 V

Vgs (Max):: ±12V

Input Capacitance (Ciss) (Max) @ Vds:: 258 pF @ 15 V

FET Feature:: -

Power Dissipation (Max):: 625mW (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: SOT-23-3

ZXMN3B01FTC FAQ

1.How can I place an order for ZXMN3B01FTC through Aetrix?

Please submit a Request for Quotation (RFQ) for ZXMN3B01FTC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZXMN3B01FTC reliable?

The price and inventory of ZXMN3B01FTC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXMN3B01FTC is usually 5 days.

3.What payment methods are accepted for ZXMN3B01FTC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXMN3B01FTC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ZXMN3B01FTC?

ZXMN3B01FTC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZXMN3B01FTC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZXMN3B01FTC?

For technical support, including ZXMN3B01FTC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXMN3B01FTC requirements.

6.How does Aetrix verify that ZXMN3B01FTC is sourced from the original manufacturer or authorized distributors?

All ZXMN3B01FTC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXMN3B01FTC meets industry standards.

7.What is the process for return or replacement of ZXMN3B01FTC?

All ZXMN3B01FTC units undergo pre-shipment inspection (PSI). If there is an issue with ZXMN3B01FTC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZXMN3B01FTC part is unused and in its original packaging.

Return procedure for ZXMN3B01FTC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…